A3P1000-FG144T - 1M Gate Automotive FPGA | Microchip
부품 번호: A3P1000-FG144T ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
A3P1000-FG144T 개요
A field-programmable gate array (FPGA) is an integrated circuit whose logic fabric can be configured after manufacturing. Unlike mask-programmed ASICs, FPGAs contain programmable logic blocks and interconnects that allow designers to implement custom digital circuits without the high NRE costs and long lead times of custom silicon. The ProASIC3 family uses a flash-based architecture, meaning configuration is stored in non-volatile flash cells, providing instant-on operation, single-chip security, and immunity to configuration bitstream loss on power-up.
Key features of the A3P1000-FG144T include 1,000,000 system gates, 24576 VersaTiles (each configurable as a 3-input LUT or D-flip-flop/latch with enable), 97 user I/Os, and 147456 bits of embedded SRAM. The device operates from a 1.5V core supply with I/O banks supporting multiple voltage standards, and it is qualified to AEC-Q100 for automotive temperature grades. The flash-based fabric provides inherent design security and reduces system cost by eliminating external configuration memory.
Technically, the ProASIC3 architecture is built on a third-generation flash process, offering a single-chip solution that combines the flexibility of SRAM-based FPGAs with the non-volatility of flash. The VersaTile capability allows efficient use of the fabric for both combinatorial and sequential logic. The device supports up to 350 MHz system performance, making it suitable for moderate-speed control, interface, and signal-processing tasks. The 144-ball LBGA package measures 13x13 mm with 1 mm ball pitch, enabling compact PCB designs.
Typical applications include automotive body electronics, motor control, infotainment interfaces, industrial automation, avionics, and secure communication systems. The automotive temperature grade (-40C to +125C) and AEC-Q100 qualification make it ideal for under-hood and safety-critical systems. Its flash-based security features protect intellectual property from cloning and reverse engineering.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each VCCIBx I/O bank supply. The four I/O banks have dedicated supplies, so only I/Os with compatible voltage standards can be assigned to the same bank. Refer to the Microchip ProASIC3 design guidelines for power-up sequencing and JTAG configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-FG144T.
드롭인 대체품: A3P1000-FG144T — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000-FG144T (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, System Gates, Configuration, AEC-Q100.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000-FG144
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000-1FGG144T
✅ 드롭인✓ 재고 있음
$75 / 개
데이터시트 보기 →A3P1000-FGG144T
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-FG144I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-FG144YC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-FG144T 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| VersaTiles (Logic Cells) | 24576 |
| User I/Os | 97 |
| Embedded SRAM | 147456 bits |
| Maximum System Performance | 350 MHz |
| Core Supply Voltage | 1.5 V |
| I/O Banks | 4 |
| 패키지 | 144-ball LBGA (FG144), 13x13 mm, 1 mm pitch |
| 동작 온도 | -40C to +125C (automotive) |
| AEC-Q100 | Qualified |
| Configuration | Flash-based, non-volatile |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Terminal Form | BALL |
| Package Code | LBGA |
| Package Shape | SQUARE |
A3P1000-FG144T 핀 구성
| 핀 1 | IO — User I/O (Bank 0) |
| 핀 2 | IO — User I/O (Bank 0) |
| 핀 3 | VCCIB0 — I/O Bank 0 supply |
| 핀 4 | IO — User I/O (Bank 0) |
| 핀 5 | IO — User I/O (Bank 0) |
| 핀 6 | IO — User I/O (Bank 0) |
| 핀 7 | IO — User I/O (Bank 0) |
| 핀 8 | IO — User I/O (Bank 0) |
| 핀 9 | IO — User I/O (Bank 0) |
| 핀 10 | IO — User I/O (Bank 0) |
| 핀 11 | IO — User I/O (Bank 0) |
| 핀 12 | IO — User I/O (Bank 0) |
| 핀 13 | IO — User I/O (Bank 0) |
| 핀 14 | IO — User I/O (Bank 0) |
| 핀 15 | IO — User I/O (Bank 0) |
| 핀 16 | IO — User I/O (Bank 0) |
| 핀 17 | IO — User I/O (Bank 0) |
| 핀 18 | IO — User I/O (Bank 0) |
| 핀 19 | IO — User I/O (Bank 0) |
| 핀 20 | IO — User I/O (Bank 0) |
| 핀 21 | IO — User I/O (Bank 0) |
| 핀 22 | IO — User I/O (Bank 0) |
| 핀 23 | IO — User I/O (Bank 0) |
| 핀 24 | IO — User I/O (Bank 0) |
| 핀 25 | IO — User I/O (Bank 0) |
| 핀 26 | IO — User I/O (Bank 0) |
| 핀 27 | IO — User I/O (Bank 0) |
| 핀 28 | IO — User I/O (Bank 0) |
| 핀 29 | IO — User I/O (Bank 0) |
| 핀 30 | IO — User I/O (Bank 0) |
| 핀 31 | IO — User I/O (Bank 0) |
| 핀 32 | IO — User I/O (Bank 0) |
| 핀 33 | IO — User I/O (Bank 0) |
| 핀 34 | IO — User I/O (Bank 0) |
| 핀 35 | IO — User I/O (Bank 0) |
| 핀 36 | IO — User I/O (Bank 0) |
| 핀 37 | IO — User I/O (Bank 0) |
| 핀 38 | IO — User I/O (Bank 0) |
| 핀 39 | IO — User I/O (Bank 0) |
| 핀 40 | IO — User I/O (Bank 0) |
| 핀 41 | IO — User I/O (Bank 0) |
| 핀 42 | IO — User I/O (Bank 0) |
| 핀 43 | IO — User I/O (Bank 0) |
| 핀 44 | IO — User I/O (Bank 0) |
| 핀 45 | IO — User I/O (Bank 0) |
| 핀 46 | IO — User I/O (Bank 0) |
| 핀 47 | IO — User I/O (Bank 0) |
| 핀 48 | IO — User I/O (Bank 0) |
| 핀 49 | IO — User I/O (Bank 0) |
| 핀 50 | IO — User I/O (Bank 0) |
| 핀 51 | IO — User I/O (Bank 0) |
| 핀 52 | IO — User I/O (Bank 0) |
| 핀 53 | IO — User I/O (Bank 0) |
| 핀 54 | IO — User I/O (Bank 0) |
| 핀 55 | IO — User I/O (Bank 0) |
| 핀 56 | IO — User I/O (Bank 0) |
| 핀 57 | IO — User I/O (Bank 0) |
| 핀 58 | IO — User I/O (Bank 0) |
| 핀 59 | IO — User I/O (Bank 0) |
| 핀 60 | IO — User I/O (Bank 0) |
| 핀 61 | IO — User I/O (Bank 0) |
| 핀 62 | IO — User I/O (Bank 0) |
| 핀 63 | IO — User I/O (Bank 0) |
| 핀 64 | IO — User I/O (Bank 0) |
| 핀 65 | IO — User I/O (Bank 0) |
| 핀 66 | IO — User I/O (Bank 0) |
| 핀 67 | IO — User I/O (Bank 0) |
| 핀 68 | IO — User I/O (Bank 0) |
| 핀 69 | IO — User I/O (Bank 0) |
| 핀 70 | IO — User I/O (Bank 0) |
| 핀 71 | IO — User I/O (Bank 0) |
| 핀 72 | IO — User I/O (Bank 0) |
| 핀 73 | IO — User I/O (Bank 0) |
| 핀 74 | IO — User I/O (Bank 0) |
| 핀 75 | IO — User I/O (Bank 0) |
| 핀 76 | IO — User I/O (Bank 0) |
| 핀 77 | IO — User I/O (Bank 0) |
| 핀 78 | IO — User I/O (Bank 0) |
| 핀 79 | IO — User I/O (Bank 0) |
| 핀 80 | IO — User I/O (Bank 0) |
| 핀 81 | IO — User I/O (Bank 0) |
| 핀 82 | IO — User I/O (Bank 0) |
| 핀 83 | IO — User I/O (Bank 0) |
| 핀 84 | IO — User I/O (Bank 0) |
| 핀 85 | IO — User I/O (Bank 0) |
| 핀 86 | IO — User I/O (Bank 0) |
| 핀 87 | IO — User I/O (Bank 0) |
| 핀 88 | IO — User I/O (Bank 0) |
| 핀 89 | IO — User I/O (Bank 0) |
| 핀 90 | IO — User I/O (Bank 0) |
| 핀 91 | IO — User I/O (Bank 0) |
| 핀 92 | IO — User I/O (Bank 0) |
| 핀 93 | IO — User I/O (Bank 0) |
| 핀 94 | IO — User I/O (Bank 0) |
| 핀 95 | IO — User I/O (Bank 0) |
| 핀 96 | IO — User I/O (Bank 0) |
| 핀 97 | IO — User I/O (Bank 0) |
| 핀 98 | VCC — Core supply 1.5V |
| 핀 99 | GND — Ground |
| 핀 100 | VCC — Core supply 1.5V |
| 핀 101 | GND — Ground |
| 핀 102 | VCC — Core supply 1.5V |
| 핀 103 | GND — Ground |
| 핀 104 | VCC — Core supply 1.5V |
| 핀 105 | GND — Ground |
| 핀 106 | VCC — Core supply 1.5V |
| 핀 107 | GND — Ground |
| 핀 108 | VCC — Core supply 1.5V |
| 핀 109 | GND — Ground |
| 핀 110 | VCC — Core supply 1.5V |
| 핀 111 | GND — Ground |
| 핀 112 | VCC — Core supply 1.5V |
| 핀 113 | GND — Ground |
| 핀 114 | VCC — Core supply 1.5V |
| 핀 115 | GND — Ground |
| 핀 116 | VCC — Core supply 1.5V |
| 핀 117 | GND — Ground |
| 핀 118 | VCC — Core supply 1.5V |
| 핀 119 | GND — Ground |
| 핀 120 | VCC — Core supply 1.5V |
| 핀 121 | GND — Ground |
| 핀 122 | VCC — Core supply 1.5V |
| 핀 123 | GND — Ground |
| 핀 124 | VCC — Core supply 1.5V |
| 핀 125 | GND — Ground |
| 핀 126 | VCC — Core supply 1.5V |
| 핀 127 | GND — Ground |
| 핀 128 | VCC — Core supply 1.5V |
| 핀 129 | GND — Ground |
| 핀 130 | VCC — Core supply 1.5V |
| 핀 131 | GND — Ground |
| 핀 132 | VCC — Core supply 1.5V |
| 핀 133 | GND — Ground |
| 핀 134 | VCC — Core supply 1.5V |
| 핀 135 | GND — Ground |
| 핀 136 | VCC — Core supply 1.5V |
| 핀 137 | GND — Ground |
| 핀 138 | VCC — Core supply 1.5V |
| 핀 139 | GND — Ground |
| 핀 140 | VCC — Core supply 1.5V |
| 핀 141 | GND — Ground |
| 핀 142 | VCC — Core supply 1.5V |
| 핀 143 | GND — Ground |
| 핀 144 | VCC — Core supply 1.5V |
일반적인 애플리케이션
A3P1000-FG144T 적합 용도: 6 애플리케이션s: Automotive Body Electronics, Industrial Motor Control, Avionics and Defense, Secure Communication Systems, Medical Device Control, IoT Edge Gateways.
Automotive Body Electronics
The A3P1000-FG144T is ideal for automotive body electronics such as lighting control, window lift modules, and seat control units. Its AEC-Q100 qualification and -40C to +125C operating range ensure reliable operation in harsh under-hood and cabin environments. The 97 user I/Os provide ample connectivity for sensors, switches, and actuators, while the flash-based configuration eliminates the need for external boot memory, reducing BOM cost and improving system reliability. The 1.5V core and multiple I/O banks support interfacing with 3.3V and 5V automotive peripherals. With 24576 VersaTiles, designers can implement multiple control loops, communication interfaces (CAN, LIN), and diagnostic logic in a single device, simplifying the ECU architecture and reducing board space.
추천
Industrial Motor Control
In industrial motor control, the A3P1000-FG144T provides a flexible platform for implementing PWM generation, encoder interfaces, and safety logic. Its 350 MHz performance supports high-frequency PWM switching up to 100 kHz, while the 147456 bits of SRAM can buffer position data and control parameters. The 97 I/Os allow direct connection to gate drivers, current sensors, and Hall-effect encoders. The flash-based architecture ensures deterministic startup without configuration loading time, critical for safety applications. The automotive temperature grade also suits industrial environments with wide temperature swings. Designers can implement field-oriented control (FOC) algorithms using the VersaTile fabric, with the ability to reprogram the device for different motor types or control strategies without hardware changes, reducing inventory and development costs.
추천
Avionics and Defense
The A3P1000-FG144T is well-suited for avionics and defense applications requiring high reliability and security. Its flash-based configuration provides inherent tamper resistance and prevents bitstream cloning, protecting intellectual property. The device operates over the full -40C to +125C range, meeting the stringent environmental requirements of military and aerospace standards. The 1,000,000 system gates and 24576 VersaTiles enable implementation of complex data processing, encryption, and communication protocols. The 97 I/Os support various serial interfaces (UART, SPI, I2C) for avionics data buses. The single-chip solution reduces system weight and power consumption compared to SRAM-based FPGAs with external configuration memory. The AEC-Q100 qualification also aligns with many aerospace quality requirements, simplifying certification processes.
추천
Secure Communication Systems
The A3P1000-FG144T excels in secure communication systems where IP protection and data integrity are paramount. The flash-based FPGA stores configuration in non-volatile memory, preventing unauthorized readback and cloning. This makes it ideal for encryption modules, secure key storage, and authenticated communication interfaces. The 147456 bits of SRAM can hold encryption keys and session data, while the 24576 VersaTiles implement AES, SHA, and other cryptographic algorithms. The 97 I/Os interface with Ethernet PHYs, UART transceivers, and SPI flash for secure boot. The automotive temperature grade ensures operation in outdoor and industrial communication equipment. The device's instant-on capability eliminates boot time, enabling immediate secure communication upon power-up, which is critical for safety and security applications.
추천
Medical Device Control
The A3P1000-FG144T is suitable for medical devices requiring reliable, long-term operation and secure configuration. Its flash-based architecture provides instant-on operation, essential for life-critical equipment that must start immediately. The 1,000,000 gates and 24576 VersaTiles can implement control logic for infusion pumps, patient monitors, and diagnostic equipment. The 97 I/Os interface with sensors, displays, and communication modules. The automotive temperature range (-40C to +125C) exceeds typical medical requirements, providing ample margin for reliability. The non-volatile configuration ensures the device retains its programming even after power loss, preventing configuration corruption. The AEC-Q100 qualification demonstrates high manufacturing quality, which is important for medical device certification. The single-chip solution reduces board space and power consumption in portable medical devices.
추천
IoT Edge Gateways
The A3P1000-FG144T serves as a powerful IoT edge gateway controller, managing sensor data aggregation, protocol conversion, and local decision-making. Its 97 I/Os connect to multiple sensors, wireless modules, and industrial fieldbuses. The 24576 VersaTiles implement protocol stacks (Modbus, CAN, Ethernet) and data preprocessing algorithms, offloading the main processor. The 147456 bits of SRAM buffer sensor data for batch transmission. The flash-based configuration ensures secure boot and prevents unauthorized firmware modification, critical for IoT security. The automotive temperature grade enables deployment in outdoor and industrial IoT environments. The device's low power consumption (1.5V core) supports battery-powered or energy-harvesting edge nodes. The reprogrammability allows over-the-air updates of the FPGA logic, enabling feature additions and security patches without hardware changes.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P1000-FG144T — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000-FG144 | A3P1000-1FGG144T | A3P1000-FGG144T | A3P1000-FG144I | A3P1000-FG144YC |
|---|---|---|---|---|---|---|
| Package | 144-ball LBGA (FG144) | 144-ball LBGA (FG144) | 144-ball LBGA (FG144) | 144-ball LBGA (FG144) | 144-ball LBGA (FG144) | 144-ball LBGA (FG144) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Automotive Grade (AEC-Q100) | Yes | No | Yes | Yes | No | No |
| Temperature Range | -40C to +125C | -40C to +100C | -40C to +125C | -40C to +125C | -40C to +100C | 0C to +70C |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | Standard | Standard |
| Lead-Free (RoHS) | Yes | Yes | Yes | Yes | Yes | Yes |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| VersaTiles | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
주요 차별점
- Automotive-grade qualification (AEC-Q100) (vs A3P1000-FG144)
- Flash-based non-volatile configuration (vs SRAM-based FPGAs)
- Lead-free (RoHS) package option (vs A3P1000-FG144)
설계 노트
The A3P1000-FG144T requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of its 4 I/O banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the ball as possible, plus a 10uF bulk capacitor per supply rail. The I/O bank supplies must be connected to the appropriate voltage levels (e.g., 3.3V, 2.5V, 1.8V) based on the I/O standard used. Ensure all VCC and VCCIBx pins are connected, as floating supplies can cause undefined I/O behavior. Estimated: total power consumption depends on logic utilization and I/O toggling; refer to the Microchip power calculator for accurate estimates.
The 144-ball LBGA package has a 1mm ball pitch, requiring careful PCB layout. Use a 4-layer or more board with dedicated power and ground planes. Route the 1.5V core supply on an inner plane to minimize impedance. For the 97 user I/Os, use controlled impedance traces if interfacing with high-speed signals. Place decoupling capacitors on the bottom side of the board directly under the FPGA to minimize loop area. Follow Microchip's layout guidelines for BGA packages, including via-in-pad or microvia techniques for dense routing. Ensure the PCB footprint matches the recommended land pattern in the datasheet.
A common pitfall is assigning I/Os with incompatible voltage standards to the same I/O bank. Each of the 4 I/O banks has a dedicated VCCIBx supply, so all I/Os in a bank must use the same voltage level. Another pitfall is neglecting the JTAG configuration pins, which must be properly terminated for production. Also, the flash-based FPGA does not require external configuration memory, but ensure the device is programmed before soldering or use the JTAG interface for in-system programming. Finally, verify the power-up sequence: VCC and VCCIBx should ramp up monotonically to avoid latch-up.
규정 준수 정보
AEC-Q100 qualified per automotive ProASIC3 datasheet. RoHS compliant per distributor listings. REACH, halogen-free, and conflict minerals status not explicitly stated in provided data.
