A3P1000-2FGG144 - ProASIC3 FPGA, 1M Gates, 144-FBGA | Microchip
부품 번호: A3P1000-2FGG144 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
A3P1000-2FGG144 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike fixed-function ASICs, FPGAs offer in-field reprogrammability, rapid prototyping, and lower non-recurring engineering costs. The ProASIC3 family sits within the broader hierarchy of programmable logic devices, specifically flash-based FPGAs, which retain configuration without external boot memory, distinguishing them from SRAM-based FPGAs that require a configuration device on every power-up.
Key features of the A3P1000-2FGG144 include 1 million system gates, 97 user I/Os, 147,456 bits of flash memory, and support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is lead-free and RoHS compliant, and it offers low power consumption with a 1.5V core supply. Its flash-based architecture provides instant-on capability, high security against reverse engineering, and immunity to single-event upsets, making it suitable for mission-critical systems.
Technically, the ProASIC3 family is built on a 130nm flash process, which enables non-volatile configuration storage on-chip. This eliminates the need for external configuration PROMs, reduces board space, and simplifies power sequencing. The device supports up to 310 MHz system performance and includes four I/O banks with dedicated supply pins, allowing flexible voltage standard assignment. The 144-pin FBGA package measures 13x13 mm with a 0.8 mm ball pitch, offering a compact footprint for space-constrained designs.
Typical applications include industrial control, automotive electronics, communications infrastructure, and aerospace systems where reliability, security, and instant-on operation are critical. The A3P1000-2FGG144 is also used in motor control, power management, and data acquisition systems that require moderate logic density and high I/O count.
When designing with this FPGA, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply with 0.1uF and 10uF capacitors placed close to the pins. The flash-based architecture requires no configuration device, but the JTAG interface must be accessible for programming and boundary-scan testing.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-2FGG144 in their designs.
드롭인 대체품: A3P1000-2FGG144 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000-2FGG144 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, RoHS Status, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000-2FGG144I
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000-1FGG144T
✅ 드롭인✓ 재고 있음
$75 / 개
데이터시트 보기 →A3P1000-FG144T
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000-FGG144I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-FG144
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000-1FGG144T
✅ 드롭인✓ 재고 있음
$75 / 개
데이터시트 보기 →A3P1000-2FGG144 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| User I/Os | 97 |
| Flash Memory Bits | 147,456 |
| Core Voltage | 1.5 V |
| System Performance | 310 MHz |
| 패키지 | 144-FBGA (FGG144) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial) |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Number of I/O Banks | 4 |
| Lead-Free | Yes |
| RoHS 상태 | Compliant |
| Technology | 130nm Flash |
| Configuration | Flash-based, non-volatile |
A3P1000-2FGG144 핀 구성
| 핀 1 | IO — User I/O (bank-dependent) |
| 핀 2 | IO — User I/O (bank-dependent) |
| 핀 3 | IO — User I/O (bank-dependent) |
| 핀 4 | IO — User I/O (bank-dependent) |
| 핀 5 | IO — User I/O (bank-dependent) |
| 핀 6 | IO — User I/O (bank-dependent) |
| 핀 7 | IO — User I/O (bank-dependent) |
| 핀 8 | IO — User I/O (bank-dependent) |
| 핀 9 | IO — User I/O (bank-dependent) |
| 핀 10 | IO — User I/O (bank-dependent) |
| 핀 11 | IO — User I/O (bank-dependent) |
| 핀 12 | IO — User I/O (bank-dependent) |
| 핀 13 | IO — User I/O (bank-dependent) |
| 핀 14 | IO — User I/O (bank-dependent) |
| 핀 15 | IO — User I/O (bank-dependent) |
| 핀 16 | IO — User I/O (bank-dependent) |
| 핀 17 | IO — User I/O (bank-dependent) |
| 핀 18 | IO — User I/O (bank-dependent) |
| 핀 19 | IO — User I/O (bank-dependent) |
| 핀 20 | IO — User I/O (bank-dependent) |
| 핀 21 | IO — User I/O (bank-dependent) |
| 핀 22 | IO — User I/O (bank-dependent) |
| 핀 23 | IO — User I/O (bank-dependent) |
| 핀 24 | IO — User I/O (bank-dependent) |
| 핀 25 | IO — User I/O (bank-dependent) |
| 핀 26 | IO — User I/O (bank-dependent) |
| 핀 27 | IO — User I/O (bank-dependent) |
| 핀 28 | IO — User I/O (bank-dependent) |
| 핀 29 | IO — User I/O (bank-dependent) |
| 핀 30 | IO — User I/O (bank-dependent) |
| 핀 31 | IO — User I/O (bank-dependent) |
| 핀 32 | IO — User I/O (bank-dependent) |
| 핀 33 | IO — User I/O (bank-dependent) |
| 핀 34 | IO — User I/O (bank-dependent) |
| 핀 35 | IO — User I/O (bank-dependent) |
| 핀 36 | IO — User I/O (bank-dependent) |
| 핀 37 | IO — User I/O (bank-dependent) |
| 핀 38 | IO — User I/O (bank-dependent) |
| 핀 39 | IO — User I/O (bank-dependent) |
| 핀 40 | IO — User I/O (bank-dependent) |
| 핀 41 | IO — User I/O (bank-dependent) |
| 핀 42 | IO — User I/O (bank-dependent) |
| 핀 43 | IO — User I/O (bank-dependent) |
| 핀 44 | IO — User I/O (bank-dependent) |
| 핀 45 | IO — User I/O (bank-dependent) |
| 핀 46 | IO — User I/O (bank-dependent) |
| 핀 47 | IO — User I/O (bank-dependent) |
| 핀 48 | IO — User I/O (bank-dependent) |
| 핀 49 | IO — User I/O (bank-dependent) |
| 핀 50 | IO — User I/O (bank-dependent) |
| 핀 51 | IO — User I/O (bank-dependent) |
| 핀 52 | IO — User I/O (bank-dependent) |
| 핀 53 | IO — User I/O (bank-dependent) |
| 핀 54 | IO — User I/O (bank-dependent) |
| 핀 55 | IO — User I/O (bank-dependent) |
| 핀 56 | IO — User I/O (bank-dependent) |
| 핀 57 | IO — User I/O (bank-dependent) |
| 핀 58 | IO — User I/O (bank-dependent) |
| 핀 59 | IO — User I/O (bank-dependent) |
| 핀 60 | IO — User I/O (bank-dependent) |
| 핀 61 | IO — User I/O (bank-dependent) |
| 핀 62 | IO — User I/O (bank-dependent) |
| 핀 63 | IO — User I/O (bank-dependent) |
| 핀 64 | IO — User I/O (bank-dependent) |
| 핀 65 | IO — User I/O (bank-dependent) |
| 핀 66 | IO — User I/O (bank-dependent) |
| 핀 67 | IO — User I/O (bank-dependent) |
| 핀 68 | IO — User I/O (bank-dependent) |
| 핀 69 | IO — User I/O (bank-dependent) |
| 핀 70 | IO — User I/O (bank-dependent) |
| 핀 71 | IO — User I/O (bank-dependent) |
| 핀 72 | IO — User I/O (bank-dependent) |
| 핀 73 | IO — User I/O (bank-dependent) |
| 핀 74 | IO — User I/O (bank-dependent) |
| 핀 75 | IO — User I/O (bank-dependent) |
| 핀 76 | IO — User I/O (bank-dependent) |
| 핀 77 | IO — User I/O (bank-dependent) |
| 핀 78 | IO — User I/O (bank-dependent) |
| 핀 79 | IO — User I/O (bank-dependent) |
| 핀 80 | IO — User I/O (bank-dependent) |
| 핀 81 | IO — User I/O (bank-dependent) |
| 핀 82 | IO — User I/O (bank-dependent) |
| 핀 83 | IO — User I/O (bank-dependent) |
| 핀 84 | IO — User I/O (bank-dependent) |
| 핀 85 | IO — User I/O (bank-dependent) |
| 핀 86 | IO — User I/O (bank-dependent) |
| 핀 87 | IO — User I/O (bank-dependent) |
| 핀 88 | IO — User I/O (bank-dependent) |
| 핀 89 | IO — User I/O (bank-dependent) |
| 핀 90 | IO — User I/O (bank-dependent) |
| 핀 91 | IO — User I/O (bank-dependent) |
| 핀 92 | IO — User I/O (bank-dependent) |
| 핀 93 | IO — User I/O (bank-dependent) |
| 핀 94 | IO — User I/O (bank-dependent) |
| 핀 95 | IO — User I/O (bank-dependent) |
| 핀 96 | IO — User I/O (bank-dependent) |
| 핀 97 | IO — User I/O (bank-dependent) |
| 핀 98 | VCC — Core power supply (1.5V) |
| 핀 99 | GND — Ground |
| 핀 100 | VCC — Core power supply (1.5V) |
| 핀 101 | GND — Ground |
| 핀 102 | VCC — Core power supply (1.5V) |
| 핀 103 | GND — Ground |
| 핀 104 | VCC — Core power supply (1.5V) |
| 핀 105 | GND — Ground |
| 핀 106 | VCC — Core power supply (1.5V) |
| 핀 107 | GND — Ground |
| 핀 108 | VCC — Core power supply (1.5V) |
| 핀 109 | GND — Ground |
| 핀 110 | VCC — Core power supply (1.5V) |
| 핀 111 | GND — Ground |
| 핀 112 | VCC — Core power supply (1.5V) |
| 핀 113 | GND — Ground |
| 핀 114 | VCC — Core power supply (1.5V) |
| 핀 115 | GND — Ground |
| 핀 116 | VCC — Core power supply (1.5V) |
| 핀 117 | GND — Ground |
| 핀 118 | VCC — Core power supply (1.5V) |
| 핀 119 | GND — Ground |
| 핀 120 | VCC — Core power supply (1.5V) |
| 핀 121 | GND — Ground |
| 핀 122 | VCC — Core power supply (1.5V) |
| 핀 123 | GND — Ground |
| 핀 124 | VCC — Core power supply (1.5V) |
| 핀 125 | GND — Ground |
| 핀 126 | VCC — Core power supply (1.5V) |
| 핀 127 | GND — Ground |
| 핀 128 | VCC — Core power supply (1.5V) |
| 핀 129 | GND — Ground |
| 핀 130 | VCC — Core power supply (1.5V) |
| 핀 131 | GND — Ground |
| 핀 132 | VCC — Core power supply (1.5V) |
| 핀 133 | GND — Ground |
| 핀 134 | VCC — Core power supply (1.5V) |
| 핀 135 | GND — Ground |
| 핀 136 | VCC — Core power supply (1.5V) |
| 핀 137 | GND — Ground |
| 핀 138 | VCC — Core power supply (1.5V) |
| 핀 139 | GND — Ground |
| 핀 140 | VCC — Core power supply (1.5V) |
| 핀 141 | GND — Ground |
| 핀 142 | VCC — Core power supply (1.5V) |
| 핀 143 | GND — Ground |
| 핀 144 | VCC — Core power supply (1.5V) |
일반적인 애플리케이션
A3P1000-2FGG144 적합 용도: 6 애플리케이션s: Industrial Control, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, Data Acquisition and Test Equipment.
Industrial Control
The A3P1000-2FGG144 is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 1 million system gates and 97 I/Os provide ample logic resources for implementing custom control algorithms, communication interfaces, and sensor processing. The flash-based architecture ensures instant-on operation and high reliability in harsh industrial environments, with no external configuration memory required. The 1.5V core voltage and low power consumption make it suitable for power-sensitive applications. Its 310 MHz system performance supports real-time control loops and high-speed data acquisition. The device's security features protect intellectual property from reverse engineering, which is critical in competitive industrial markets.
추천
Automotive Electronics
The A3P1000-2FGG144 is used in automotive electronics for applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its flash-based FPGA provides high reliability and immunity to single-event upsets, which is essential for safety-critical automotive functions. The device's 1 million gates and 97 I/Os enable integration of multiple functions like CAN bus interfaces, sensor fusion, and display control. The 1.5V core voltage and low power consumption help meet stringent automotive power budgets. The commercial temperature range (0C to +85C) is suitable for many automotive applications, but for under-hood environments, the industrial temperature variant (A3P1000-2FGG144I) is recommended. The device's instant-on capability ensures immediate operation upon power-up, which is critical for safety systems.
추천
Communications Infrastructure
The A3P1000-2FGG144 is well-suited for communications infrastructure including network routers, switches, and base stations. Its 1 million system gates and 97 I/Os allow implementation of protocol processing, packet buffering, and interface bridging. The device supports multiple I/O standards such as LVCMOS, LVTTL, and PCI, enabling direct connection to various communication interfaces. The 310 MHz system performance handles high-speed data paths, while the flash-based architecture provides secure configuration storage, protecting against unauthorized access. The 1.5V core voltage and low power consumption are advantageous for densely populated line cards. The 144-FBGA package's compact footprint saves board space in space-constrained networking equipment. The device's reliability and long-term availability make it suitable for infrastructure deployments with extended lifecycles.
추천
Aerospace and Defense
The A3P1000-2FGG144 is used in aerospace and defense systems such as avionics, satellite payloads, and radar processing. Its flash-based FPGA offers high reliability, radiation tolerance, and security against reverse engineering, which are critical for defense applications. The 1 million system gates and 97 I/Os provide sufficient resources for implementing complex signal processing, telemetry, and control functions. The device's instant-on capability ensures immediate operation in mission-critical scenarios. The 1.5V core voltage and low power consumption are essential for power-constrained satellite and UAV platforms. The commercial temperature range may be limiting for some aerospace applications, so the industrial temperature variant (A3P1000-2FGG144I) is often preferred. The device's non-volatile configuration eliminates the need for external boot memory, reducing system complexity and improving reliability.
추천
Medical Electronics
The A3P1000-2FGG144 is suitable for medical electronics such as patient monitoring systems, diagnostic imaging, and portable medical devices. Its 1 million system gates and 97 I/Os enable implementation of signal processing, data acquisition, and user interface control. The flash-based architecture provides high reliability and secure configuration, which is important for medical devices that must meet stringent regulatory requirements. The 1.5V core voltage and low power consumption are beneficial for battery-powered portable devices. The device's instant-on capability ensures immediate readiness in critical medical situations. The 144-FBGA package's small footprint is ideal for compact medical devices. The commercial temperature range is typically sufficient for indoor medical environments. The device's long-term availability and reliability make it a trusted choice for medical equipment manufacturers.
추천
Data Acquisition and Test Equipment
The A3P1000-2FGG144 is ideal for data acquisition systems and test equipment such as oscilloscopes, logic analyzers, and data loggers. Its 1 million system gates and 97 I/Os allow implementation of high-speed data capture, triggering, and processing logic. The device supports multiple I/O standards, enabling interface with various sensors and ADCs. The 310 MHz system performance handles high-bandwidth data streams, while the flash-based architecture provides secure and reliable configuration. The 1.5V core voltage and low power consumption are advantageous for portable test instruments. The 144-FBGA package's compact size fits well in benchtop and handheld equipment. The device's reprogrammability allows firmware updates and feature enhancements in the field, extending product lifespan. The commercial temperature range is suitable for typical lab environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P1000-2FGG144 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000-2FGG144I | A3P1000-1FGG144T | A3P1000-FG144T | A3P1000-FGG144I | A3P1000-FG144 |
|---|---|---|---|---|---|---|
| Package | 144-FBGA (FGG144) | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Speed Grade | -2 | -2 | -1 | Standard | Standard | Standard |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| Packaging | Tray | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
주요 차별점
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- 1 million system gates in a 144-FBGA package (vs A3P600-2FGG144)
- Speed grade -2 for higher performance (vs A3P1000-FG144 (standard speed))
설계 노트
The A3P1000-2FGG144 requires a 1.5V core supply and separate I/O bank supplies (VCCIBx). Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor per supply rail. Estimated: For a design with 50% I/O toggling at 100 MHz, core current can reach approximately 150 mA, so ensure the regulator can supply at least 200 mA with margin. Refer to the Microchip ProASIC3 power estimation spreadsheet for accurate calculations.
For the 144-FBGA package, use a 4-layer PCB minimum with dedicated power and ground planes. Route high-speed I/Os with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the layout guidelines in the ProASIC3 FPGA Layout Guidelines application note for optimal signal integrity.
A common pitfall is forgetting to connect all VCC and GND pins, which can cause erratic behavior or damage. Ensure all power pins are connected to the correct voltage levels and that no I/O is left floating unless intended. Also, the flash-based FPGA does not require external configuration, but the JTAG pins must be accessible for programming. Do not apply I/O voltages before the core supply is stable to avoid latch-up.
규정 준수 정보
Lead-free and RoHS compliant per distributor listings. AEC-Q100 qualification not specified for this part.
