A3P250-1FGG144T - ProASIC3 FPGA 250K Gates FBGA-144 | Microchip
부품 번호: A3P250-1FGG144T ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.8 | $2,380.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $19.2 | $19,200.00 |
A3P250-1FGG144T 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer configures after manufacturing. Within the semiconductor hierarchy, the A3P250 belongs to the nonvolatile flash-based FPGA class, sitting under the broader categories of programmable logic devices and digital logic ICs. Unlike SRAM FPGAs, ProASIC3 devices store their configuration in on-chip flash, so they power up instantly as a single-chip solution with no external boot configuration PROM.
Key features include flash-based live-at-power-up operation, 130 nm CMOS process technology, a 1.5 V core supply, and system performance up to 350 MHz per distributor specification data (FPGAkey lists 272 MHz typical for the -1 speed grade), making it suited for glue logic consolidation and low-power control paths. The device is reprogrammable in-system, reducing total cost of ownership by eliminating configuration devices and supporting design iteration late in production.
The ProASIC3 architecture provides versatile logic fabric with embedded memory, and the -1 speed grade balances performance with lower static power. The FBGA-144 package occupies a small footprint suited to space-constrained industrial and communications boards, and the green package supports environmental compliance goals.
Typical applications include industrial automation control, portable and battery-powered instruments, communications interface bridging, and aerospace/defense systems that benefit from flash FPGA immunity to configuration readback and single-event configuration upsets.
When designing with this device, verify the 1.5 V core and 3.3 V-class I/O power rails against the ProASIC3 datasheet, and budget I/O assignments against the 97-user-I/O limit of the FBGA-144 package.
This page synthesizes verified distributor data, drop-in same-package alternatives, and practical design guidance not found on a single manufacturer or distributor page.
드롭인 대체품: A3P250-1FGG144T — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P250-1FGG144T (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Process Technology, System Gates, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P250-FGG144I
✅ 드롭인✓ 재고 있음
$14.06 / 개
데이터시트 보기 →A3P250-FGG144I
✅ 드롭인✓ 재고 있음
$14.06 / 개
데이터시트 보기 →A3P250-1FGG144T
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$19.2 / 개
데이터시트 보기 →A3P250-1FGG144T 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 250000 gates |
| Logic Cells (CLBs) | 6144 |
| Number of Logic Cells (Cells) | 6144-cell |
| User I/O | 97 |
| Embedded Memory | 36864 bits |
| Maximum Frequency | 350 MHz (distributor spec); 272 MHz typical per FPGAkey |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Configuration Technology | Flash-based, nonvolatile, live at power-up |
| Speed Grade | -1 |
| 패키지 | FBGA-144 (PBGA144), 1 mm pitch |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Green package (RoHS compliant per distributor data) |
| Packaging | Tray |
| Total Equivalent Gates | 250000 |
A3P250-1FGG144T fbga-144 (pbga144), 1 mm pitch 핀 구성 가이드
A3P250-1FGG144T(fbga-144 (pbga144), 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P250-1FGG144T.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P250-1FGG144T 적합 용도: 6 애플리케이션s: Industrial Automation Control, Portable and Battery-Powered Instruments, Communications Interface Bridging, Aerospace and Defense Systems, Test and Measurement Equipment, Embedded System Glue Logic Consolidation.
Industrial Automation Control
The A3P250-1FGG144T suits industrial automation because its flash-based fabric is live at power-up, activating interlock and state-machine logic within microseconds of board power-on - critical where safety sequencing is mandated. Its 250K gates (6,144 CLBs) consolidate PLC I/O glue logic, encoder interfaces, and motor control peripherals that would otherwise occupy several discrete ICs, cutting BOM cost. The 97 user I/Os in the 1 mm-pitch FBGA-144 interface sensors, actuators, and industrial buses directly at 3.3 V-class levels. Low 130 nm flash static power suits always-on factory equipment, and reprogrammability lets field updates deploy new control sequences without hardware change. Pair with a Microchip supervisor and isolated transceivers for a robust control node.
추천
Portable and Battery-Powered Instruments
For portable instrumentation, the A3P250-1FGG144T's flash FPGA architecture removes the external configuration flash and its boot energy, so the instrument becomes usable almost immediately after switch-on. Static power of the 130 nm flash fabric is far lower than an equivalent SRAM FPGA that must constantly power its configuration memory, extending battery runtime in handheld data loggers and field test meters. The compact FBGA-144 conserves board area in space-limited enclosures, while 97 I/Os drive LCD segments, keypads, and sensor front ends. The -1 speed grade covers typical metering and display-logic timing at lower dynamic power than faster grades. Combine with low-power MCUs such as the MSP430FR5994 for the user interface and data processing path.
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Communications Interface Bridging
The A3P250-1FGG144T bridges protocol and interface domains in communications equipment: 250K gates implement UART, SPI, I2C, and parallel-bus conversions plus frame formatting, while the -1 grade delivers system clocking in the hundreds of MHz range per distributor data (350 MHz max spec, 272 MHz typical per FPGAkey). Flash configuration ensures the bridge is enumerating links the moment power arrives - important in hot-pluggable line cards and network appliances that must pass traffic quickly after reset. The 36,864 bits of embedded memory buffer packet payloads, and the 1 mm-pitch FBGA-144 keeps the design dense. Low static power suits always-on telecom infrastructure; pair with a Microchip PHY or transceiver for physical-layer connectivity.
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Aerospace and Defense Systems
The ProASIC3 flash architecture is widely used in aerospace and defense because the configuration lives in on-chip flash with no external bitstream to intercept or corrupt, and the fabric tolerates radiation-induced configuration upsets better than SRAM cells - the bitstream does not need reloading after single-event effects in configuration memory. The A3P250-1FGG144T provides 250K gates for payload control, telemetry formatting, and sensor aggregation in satellite subsystems and avionics line-replaceable units. Live-at-power-up behavior ensures critical sequencing logic runs immediately at spacecraft power application. The FBGA-144 footprint supports dense module designs. For flight programs, pair with rad-tolerant power components and confirm temperature-qualified ordering variants with Microchip.
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Test and Measurement Equipment
Bench and modular instruments use the A3P250-1FGG144T for timing generation, trigger logic, and data-path glue between converters and processors. The -1 speed grade supports system performance up to the hundreds-of-MHz range (272-350 MHz per distributor data), adequate for counter/timer front ends and programmable trigger engines, while 36,864 embedded memory bits buffer capture data. Reprogrammability lets instrument firmware add measurement modes across product life, and flash configuration means the instrument is ready the instant the power switch is pressed - a user-experience differentiator versus SRAM FPGAs with multi-second boot. The 97 I/Os interface front-panel controls and ADC/DAC data buses. Pair with TI precision ADCs such as the ADS131M08 for measurement chains.
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Embedded System Glue Logic Consolidation
Many boards carry aging CPLDs, PALs, and discrete buffers for bus matching, address decoding, and reset distribution; the A3P250-1FGG144T consolidates this glue logic into one reprogrammable flash device, cutting component count and board revisions. Its 6,144 logic cells comfortably absorb multiple legacy 22V10-class PLDs plus remaining randomness, and live-at-power-up behavior means decode logic is active before the host processor's first fetch - something SRAM FPGAs cannot guarantee without external config flash. The FBGA-144 footprint and 97 I/Os give headroom for future I/O additions via firmware. Total cost of ownership drops because no configuration device and no mask changes are needed for logic updates across production.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P250-1FGG144T — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P250-FGG144I | A3P250-FGG144 | A3P250-1FGG144I |
|---|---|---|---|---|
| Package | FBGA-144, 1 mm pitch | FBGA-144 - same footprint | 144-LBGA - same footprint | FBGA-144 - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 6,144 | 6,144 | 6,144 | 6,144 |
| User I/O | 97 | 97 | 97 | 97 |
| Embedded Memory | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Technology | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up |
주요 차별점
- Flash-based single-chip configuration (vs SRAM FPGAs (Xilinx/Intel equivalents))
- Compact 144-ball integration with 97 user I/O (vs A3P250-1VQ100M)
- Capacity upgrade path without respin (vs A3P1000-1FGG144T)
설계 노트
Design the power tree around a clean 1.5 V core rail plus I/O bank supplies (3.3 V-class, per ProASIC3 datasheet). ProASIC3's flash fabric draws lower static current than SRAM FPGAs of similar density, but dynamic power scales with toggle rate - use Microchip's Libero power calculator with your actual design to size regulators. Decouple each supply pin with 0.1 uF ceramics placed within 2 mm, supplemented by bulk 10-47 uF capacitance. Power I/O banks before or together with the core per the ProASIC3 power-up specification to avoid latch-up risk.
The FBGA-144 with 1 mm ball pitch fans out cleanly on a 0.8 mm design-rule via-in-pad or dog-bone escape pattern; allocate at least two signal layers plus dedicated ground and power planes. Follow the ball map printed in the Microchip datasheet - do not mirror or rotate the land pattern. Keep the exposed package center area clear for optional thermal relief vias, and follow the Microchip ProASIC3 PCB layout application notes for length-matching on any high-speed bank interfaces.
Three common mistakes with A3P250 designs: (1) treating speed grades interchangeably - the -1 grade has different timing than the standard grade, so timing-constrained designs must re-verify timing reports after substitution; (2) ignoring temperature suffixes - the T (tray) suffix does not indicate industrial temperature; order -I variants for extended environments; (3) under-budgeting I/O - only 97 of the 144 balls are user I/O, so confirm your pin assignment fits before committing the PCB. Always validate the final part number against Microchip's current ordering-information table.
규정 준수 정보
Distributor data (Jotrin, FindIC) describes the package as GREEN, consistent with RoHS-compliant lead-free construction. REACH, halogen-free, and conflict-minerals status not stated in verified data.
