A3P250-1FGG144T - ProASIC3 FPGA 250K Gates FBGA-144 | Microchip
MPN: A3P250-1FGG144T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.8 | $2,380.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $19.2 | $19,200.00 |
Drop-in alternatives for A3P250-1FGG144T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P250-FGG144I
✅ Drop-In✓ In Stock
$14.06 / Unit
View Datasheet →A3P250-FGG144I
✅ Drop-In✓ In Stock
$14.06 / Unit
View Datasheet →A3P250-1FGG144T
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.2 / Unit
View Datasheet →A3P250-1FGG144T Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 250000 gates |
| Logic Cells (CLBs) | 6144 |
| Number of Logic Cells (Cells) | 6144-cell |
| User I/O | 97 |
| Embedded Memory | 36864 bits |
| Maximum Frequency | 350 MHz (distributor spec); 272 MHz typical per FPGAkey |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Configuration Technology | Flash-based, nonvolatile, live at power-up |
| Speed Grade | -1 |
| Package | FBGA-144 (PBGA144), 1 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Green package (RoHS compliant per distributor data) |
| Packaging | Tray |
| Total Equivalent Gates | 250000 |
A3P250-1FGG144T fbga-144 (pbga144), 1 mm pitch Pin Configuration Guide
Complete pinout information for A3P250-1FGG144T (fbga-144 (pbga144), 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P250-1FGG144T.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P250-1FGG144T is suitable for 6 applications: Industrial Automation Control, Portable and Battery-Powered Instruments, Communications Interface Bridging, Aerospace and Defense Systems, Test and Measurement Equipment, Embedded System Glue Logic Consolidation.
Industrial Automation Control
The A3P250-1FGG144T suits industrial automation because its flash-based fabric is live at power-up, activating interlock and state-machine logic within microseconds of board power-on - critical where safety sequencing is mandated. Its 250K gates (6,144 CLBs) consolidate PLC I/O glue logic, encoder interfaces, and motor control peripherals that would otherwise occupy several discrete ICs, cutting BOM cost. The 97 user I/Os in the 1 mm-pitch FBGA-144 interface sensors, actuators, and industrial buses directly at 3.3 V-class levels. Low 130 nm flash static power suits always-on factory equipment, and reprogrammability lets field updates deploy new control sequences without hardware change. Pair with a Microchip supervisor and isolated transceivers for a robust control node.
Recommended
Portable and Battery-Powered Instruments
For portable instrumentation, the A3P250-1FGG144T's flash FPGA architecture removes the external configuration flash and its boot energy, so the instrument becomes usable almost immediately after switch-on. Static power of the 130 nm flash fabric is far lower than an equivalent SRAM FPGA that must constantly power its configuration memory, extending battery runtime in handheld data loggers and field test meters. The compact FBGA-144 conserves board area in space-limited enclosures, while 97 I/Os drive LCD segments, keypads, and sensor front ends. The -1 speed grade covers typical metering and display-logic timing at lower dynamic power than faster grades. Combine with low-power MCUs such as the MSP430FR5994 for the user interface and data processing path.
Recommended
Communications Interface Bridging
The A3P250-1FGG144T bridges protocol and interface domains in communications equipment: 250K gates implement UART, SPI, I2C, and parallel-bus conversions plus frame formatting, while the -1 grade delivers system clocking in the hundreds of MHz range per distributor data (350 MHz max spec, 272 MHz typical per FPGAkey). Flash configuration ensures the bridge is enumerating links the moment power arrives - important in hot-pluggable line cards and network appliances that must pass traffic quickly after reset. The 36,864 bits of embedded memory buffer packet payloads, and the 1 mm-pitch FBGA-144 keeps the design dense. Low static power suits always-on telecom infrastructure; pair with a Microchip PHY or transceiver for physical-layer connectivity.
Recommended
Aerospace and Defense Systems
The ProASIC3 flash architecture is widely used in aerospace and defense because the configuration lives in on-chip flash with no external bitstream to intercept or corrupt, and the fabric tolerates radiation-induced configuration upsets better than SRAM cells - the bitstream does not need reloading after single-event effects in configuration memory. The A3P250-1FGG144T provides 250K gates for payload control, telemetry formatting, and sensor aggregation in satellite subsystems and avionics line-replaceable units. Live-at-power-up behavior ensures critical sequencing logic runs immediately at spacecraft power application. The FBGA-144 footprint supports dense module designs. For flight programs, pair with rad-tolerant power components and confirm temperature-qualified ordering variants with Microchip.
Recommended
Test and Measurement Equipment
Bench and modular instruments use the A3P250-1FGG144T for timing generation, trigger logic, and data-path glue between converters and processors. The -1 speed grade supports system performance up to the hundreds-of-MHz range (272-350 MHz per distributor data), adequate for counter/timer front ends and programmable trigger engines, while 36,864 embedded memory bits buffer capture data. Reprogrammability lets instrument firmware add measurement modes across product life, and flash configuration means the instrument is ready the instant the power switch is pressed - a user-experience differentiator versus SRAM FPGAs with multi-second boot. The 97 I/Os interface front-panel controls and ADC/DAC data buses. Pair with TI precision ADCs such as the ADS131M08 for measurement chains.
Recommended
Embedded System Glue Logic Consolidation
Many boards carry aging CPLDs, PALs, and discrete buffers for bus matching, address decoding, and reset distribution; the A3P250-1FGG144T consolidates this glue logic into one reprogrammable flash device, cutting component count and board revisions. Its 6,144 logic cells comfortably absorb multiple legacy 22V10-class PLDs plus remaining randomness, and live-at-power-up behavior means decode logic is active before the host processor's first fetch - something SRAM FPGAs cannot guarantee without external config flash. The FBGA-144 footprint and 97 I/Os give headroom for future I/O additions via firmware. Total cost of ownership drops because no configuration device and no mask changes are needed for logic updates across production.
Recommended
Recommended Products Summary
Engineering reference data for A3P250-1FGG144T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P250-FGG144I | A3P250-FGG144 | A3P250-1FGG144I |
|---|---|---|---|---|
| Package | FBGA-144, 1 mm pitch | FBGA-144 - same footprint | 144-LBGA - same footprint | FBGA-144 - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 6,144 | 6,144 | 6,144 | 6,144 |
| User I/O | 97 | 97 | 97 | 97 |
| Speed Grade | -1 | [DATA_NEEDED] | Standard (no -1 suffix) | -1 |
| Embedded Memory | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Technology | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up |
Key Differentiators
- Flash-based single-chip configuration (vs SRAM FPGAs (Xilinx/Intel equivalents))
- Compact 144-ball integration with 97 user I/O (vs A3P250-1VQ100M)
- Capacity upgrade path without respin (vs A3P1000-1FGG144T)
Design Notes
Design the power tree around a clean 1.5 V core rail plus I/O bank supplies (3.3 V-class, per ProASIC3 datasheet). ProASIC3's flash fabric draws lower static current than SRAM FPGAs of similar density, but dynamic power scales with toggle rate - use Microchip's Libero power calculator with your actual design to size regulators. Decouple each supply pin with 0.1 uF ceramics placed within 2 mm, supplemented by bulk 10-47 uF capacitance. Power I/O banks before or together with the core per the ProASIC3 power-up specification to avoid latch-up risk.
The FBGA-144 with 1 mm ball pitch fans out cleanly on a 0.8 mm design-rule via-in-pad or dog-bone escape pattern; allocate at least two signal layers plus dedicated ground and power planes. Follow the ball map printed in the Microchip datasheet - do not mirror or rotate the land pattern. Keep the exposed package center area clear for optional thermal relief vias, and follow the Microchip ProASIC3 PCB layout application notes for length-matching on any high-speed bank interfaces.
Three common mistakes with A3P250 designs: (1) treating speed grades interchangeably - the -1 grade has different timing than the standard grade, so timing-constrained designs must re-verify timing reports after substitution; (2) ignoring temperature suffixes - the T (tray) suffix does not indicate industrial temperature; order -I variants for extended environments; (3) under-budgeting I/O - only 97 of the 144 balls are user I/O, so confirm your pin assignment fits before committing the PCB. Always validate the final part number against Microchip's current ordering-information table.
Compliance Information
Distributor data (Jotrin, FindIC) describes the package as GREEN, consistent with RoHS-compliant lead-free construction. REACH, halogen-free, and conflict-minerals status not stated in verified data.
