A3P250-FG256T - ProASIC3 250K-Gate Flash FPGA | Microchip
부품 번호: A3P250-FG256T ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $43.19 | $43.19 |
| 10 | $40.5 | $405.00 |
| 100 | $37.2 | $3,720.00 |
| 500 | $34.9 | $17,450.00 |
| 1,000 | $32.5 | $32,500.00 |
A3P250-FG256T 개요
A flash FPGA is a type of field-programmable gate array that stores its configuration in on-chip flash memory rather than volatile SRAM. This places the ProASIC3 within the broader hierarchy of programmable logic devices: flash FPGA -> FPGA -> programmable logic -> semiconductor. Because the configuration is nonvolatile, the A3P250 powers up instantly without an external configuration device, reducing total cost of ownership (TOC), board space, and bill-of-materials complexity compared with SRAM FPGAs.
Key features highlighted by Microchip include low total cost of ownership, system performance in ultra-low-density devices, a single-chip solution, small-footprint packages, and reprogrammability. The unique VersaTile architecture allows each logic tile to function as a three-input LUT equivalent or as a D-flip-flop/latch with enable, improving fabric utilization.
Technically, the A3P250 targets the 130 nm flash process with a 1.5V core, supporting automotive-grade temperature operation per distributor specifications. The 256-ball FBGA footprint supports high I/O density in a compact surface-mount form factor. Distributor data indicates the device is used where instant-on, secure, nonvolatile configuration is required, including industrial control, communications interface bridging, and automotive subsystems.
Typical applications include industrial automation controllers, glue logic and bus bridging, motor control interfaces, and portable instrumentation where a small footprint and single-chip solution matter. The A3P250 fits designs that need FPGA flexibility without configuration PROMs or power-up configuration sequencing.
When designing with the A3P250-FG256T, verify I/O banking voltage compatibility with adjacent logic and follow Microchip power decoupling guidelines for the 1.5V core rail; migration to lower-density A3P030/A3P060/A3P125 devices is documented in the Microchip pin-compatibility application note.
This page synthesizes distributor pricing, same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: A3P250-FG256T — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P250-FG256T (동일 폼 팩터 및 풋프린트) — 차이점: Package, Packaging, User I/O, Configuration, Number of I/O.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P400-FG256I
✅ 드롭인✓ 재고 있음
$46.2 / 개
데이터시트 보기 →A3P1000-FG256T
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-1FG256T
✅ 드롭인✓ 재고 있음
$89.64 / 개
데이터시트 보기 →A3P1000-FGG256M
✅ 드롭인✓ 재고 있음
$27.85 / 개
데이터시트 보기 →A3P250-FGG256
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P250-FG256T 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| Logic Gates | 250000 gates |
| System Performance | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| User I/O | 157 |
| Embedded Memory | 36864 bits |
| 패키지 | 256-FBGA (FG256) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| Configuration Memory | On-chip Flash (nonvolatile) |
| Logic Tile Architecture | VersaTile (3-input LUT or D-flip-flop/latch with enable) |
| Grade | Automotive |
| Reprogrammability | Yes |
A3P250-FG256T 256-fbga (fg256) 핀 구성 가이드
A3P250-FG256T(256-fbga (fg256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P250-FG256T.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P250-FG256T 적합 용도: 6 애플리케이션s: Industrial Automation Control, Automotive Subsystem Logic, Communications Interface Bridging, Portable and Battery-Powered Instrumentation, Motor Drive Control Interfaces, Security-Sensitive Embedded Systems.
Industrial Automation Control
The A3P250-FG256T suits industrial automation controllers because its 250K gates and 157 user I/Os provide enough fabric for sequencing, interlock logic, and peripheral interfacing, while instant-on flash configuration eliminates boot delays on factory-floor equipment that must be operational at power application. In a typical deployment the FPGA sits between a microcontroller and I/O modules, implementing state machines at up to 231 MHz and glue logic on the 36,864-bit embedded memory blocks for small buffering tasks. Because it is a single-chip solution with no configuration PROM, system reliability improves in electrically noisy industrial environments. The 1.5V core on a 130 nm process keeps static power low for fanless enclosures.
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Automotive Subsystem Logic
Distributor data classifies the A3P250-FG256T as automotive grade, making it appropriate for non-safety-critical automotive electronic control modules such as body electronics, lighting sequencing, and sensor aggregation. The flash FPGA's nonvolatile configuration is an advantage here: the module is functional the moment ignition power is applied, with no configuration load time, and the single-chip solution reduces component count on high-volume boards. With 157 user I/Os in a compact 256-ball FBGA, designers can consolidate discrete glue logic and implement LIN/CAN interface bridging logic at the fabric level. The 130 nm flash process provides proven reliability characteristics expected in automotive qualification flows.
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Communications Interface Bridging
The A3P250-FG256T is well suited to protocol bridging tasks - translating between bus standards such as parallel peripheral interfaces, SPI, UART aggregates, and custom serial links - because 157 user I/Os offer ample pin budget for wide parallel buses, and the 231 MHz fabric performance supports serializable logic at common line rates. The VersaTile architecture lets designers implement shift registers, FIFOs in the 36,864-bit memory, and handshaking state machines efficiently. Because the design is field-reprogrammable via flash, protocol updates can be deployed in the field through JTAG without replacing hardware. The single-chip configuration also avoids the configuration-bus signal integrity concerns that SRAM FPGAs introduce on dense boards.
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Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the A3P250-FG256T's low static power on the 130 nm flash process and its 1.5V core, which extends battery life compared with SRAM FPGAs that require continuous configuration retention or frequent reloads. The compact 256-ball FBGA saves board area in handheld enclosures, and instant-on behavior means measurements are available immediately at power-up - important for test tools where the user expects zero boot delay. The 250K-gate fabric handles display driving, sensor timing generation, and data formatting, while the embedded memory buffers measurement samples. Reprogrammability allows firmware-style feature updates in the field over JTAG.
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Motor Drive Control Interfaces
The A3P250-FG256T fits motor drive systems as the interface layer between a digital signal controller and the power stage: the FPGA generates precise PWM gating patterns with fine dead-time resolution, handles encoder feedback decoding, and implements protection interlocks in deterministic fabric logic. Its 231 MHz fabric performance supports sub-nanosecond-resolution timing derived from the system clock, and the flash configuration ensures protection logic is active from the first clock cycle - a meaningful safety benefit over SRAM FPGAs that are unconfigured during boot. The 157 I/Os accommodate multiple encoder channels, gate driver PWM outputs, and fault feedback lines on one device in the compact FBGA footprint.
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Security-Sensitive Embedded Systems
Flash FPGAs like the A3P250-FG256T are favored in designs where bitstream confidentiality matters: the configuration resides in on-chip nonvolatile flash rather than an external SRAM configuration device whose contents can be read from the bus during power-up. For industrial equipment and automotive modules where design IP protection is a requirement, the single-chip ProASIC3 solution removes the external configuration readout attack surface entirely. With 250K gates, engineers can implement authentication logic, encrypted communication wrappers, and secure state machines alongside the primary application logic, while the 36,864-bit memory supports key or session storage patterns under fabric control. Instant-on behavior additionally prevents unauthenticated logic from ever running.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P250-FG256T — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P400-FG256I | A3P1000-FG256T | A3P1000-1FG256T | A3P250-FGG256 |
|---|---|---|---|---|---|
| Package | 256-FBGA (FG256) | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Gates | 250000 | 400000 | 1000000 | 1000000 | 250000 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | On-chip Flash (nonvolatile) | On-chip Flash (nonvolatile) | On-chip Flash (nonvolatile) | On-chip Flash (nonvolatile) | On-chip Flash (nonvolatile) |
주요 차별점
- Balanced density-to-cost point in the family (vs A3P400-FG256I)
- Lower cost than high-density same-footprint options (vs A3P1000-FG256T)
- Instant-on nonvolatile flash configuration (vs A3P250-FGG256)
설계 노트
The A3P250-FG256T requires a 1.5V core rail on a 130 nm flash process. Use a dedicated low-noise buck regulator with at least 10 uF of bulk and 0.1 uF per power ball of ceramic decoupling placed within 2 mm of the FBGA power balls. Power-up sequencing should bring VCC core up before or with the I/O bank rails per Microchip ProASIC3 power guidelines; violations can cause latch-up or I/O contention during flash configuration read. Verify total current by running post-layout simulation in Libero, since dynamic power scales with toggle rate.
The 256-ball FBGA (FG256) requires a controlled land pattern per Microchip package drawing; typical ball pitch demands via-in-pad or dog-bone fanout on outer two rows with blind vias for the inner array. Plan at least four signal layers with dedicated ground and core-power planes to manage the 157 user I/O return paths. Follow IPC-recommended BGA reflow profiles and inspect with X-ray on first articles, since collapsed or bridged balls on the inner array are invisible optically. Keep JTAG programming balls accessible to a test pad header.
A frequent migration error is assuming all ProASIC3 densities are freely interchangeable: while Microchip documents pin compatibility within the same package (per the A3P250-to-lower-density migration application note), I/O bank voltage assignments and unused-ball treatment must be rechecked when moving between A3P250, A3P400, or A3P1000 devices. Also confirm the exact speed and temperature suffix on purchase orders - the T suffix denotes tray packing, and I/G/I grades differ in temperature rating. Mismatches discovered at assembly are costly to unwind.
규정 준수 정보
Distributor data classifies the device as automotive grade, but explicit RoHS/REACH/AEC-Q100 certificates were not present in the verified web data and must be confirmed via the Microchip product page or material declarations.
