A3P600-1FG484I - ProASIC3 FPGA, 1.5V, 484-FBGA | Microchip
부품 번호: A3P600-1FG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.97 | $42.97 |
| 10 | $39.07 | $390.70 |
| 100 | $35.8 | $3,580.00 |
| 500 | $33.2 | $16,600.00 |
| 1,000 | $30.85 | $30,850.00 |
A3P600-1FG484I 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration device or volatile SRAM. Within the programmable logic hierarchy (VersaTile logic element -> FPGA -> programmable SoC -> digital system), this architecture gives ProASIC3 devices single-chip, instant-on behavior: the fabric is live immediately at power-up, needs no external boot flash, and is inherently more secure against configuration overwrite than SRAM FPGAs.
Key features include reprogrammable flash fabric supporting secure, low total cost of ownership (Low TOC) designs, four I/O banks (as documented in Microchip's ProASIC3 migration application note) with independent VCCIBx supplies so only I/Os with compatible voltage standards share a bank, and abundant advanced features in a small-footprint package. The 484-ball FBGA provides a high logic-to-I/O ratio for glue logic, bus bridging, and control-plane designs.
Technically, the ProASIC3 fabric is built from VersaTiles, a three-input look-up-based logic cell that can act as combinational logic, sequential logic, or memory, with 1.5V core operation keeping dynamic power low. Because configuration is flash-based, no configuration PROM or microcontroller override circuitry is required at the system level, reducing BOM cost and board area.
Typical applications include industrial automation control, telecommunications line-card glue logic and bus interface, medical instrumentation control, aerospace/defense subsystems (where the same family seeds radiation-tolerant RTAX designs), and legacy system life-extension where a single-chip, instant-on FPGA replaces multiple ASSPs.
Design consideration: verify that I/O standards with different voltage requirements are assigned to separate I/O banks, since each bank has a dedicated VCCIB supply; the FG484 package exposes four banks per the family migration note.
This page synthesizes distributor pricing data, verified same-package drop-in alternatives from the XAIPART catalog, and practical design notes not found in the manufacturer datasheet. Pricing shown is as of 2026-09-01.
드롭인 대체품: A3P600-1FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-1FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Configuration Memory, System Gates, I/O Banks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-1FGG484I
✅ 드롭인✓ 재고 있음
$79.6 / 개
데이터시트 보기 →A3P600-2FGG484I
✅ 드롭인✓ 재고 있음
$31.8 / 개
데이터시트 보기 →A3P600-FG484I
✅ 드롭인✓ 재고 있음
$25.4 / 개
데이터시트 보기 →A3P600L-1FG484I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3P600-2FG484
✅ 드롭인✓ 재고 있음
$61.5 / 개
데이터시트 보기 →A3P600-1FG484I 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 600000 |
| Number of I/O | 235 |
| Total Memory Bits | 110592 |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| 패키지 | 484-Ball FBGA (FG484) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| Programmability Type | Flash-based, reprogrammable, in-system |
| Configuration Storage | On-chip flash (single-chip, no external boot device) |
| I/O Banks | 4 |
| Logic Element | VersaTile (3-input LUT-based) |
A3P600-1FG484I 484-ball fbga (fg484) 핀 구성 가이드
A3P600-1FG484I(484-ball fbga (fg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-1FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-1FG484I 적합 용도: 6 애플리케이션s: Industrial Automation Control, Telecommunications Line Cards, Medical Instrumentation Control, Aerospace and Defense Subsystems, Legacy System Life Extension, Test and Measurement Fixtures.
Industrial Automation Control
The A3P600-1FG484I's industrial -40C to +100C rating and instant-on flash configuration make it well suited to PLC I/O modules, motor control sequencing, and factory-floor interface boards where the FPGA must be active the moment power is applied. Its 235 user I/Os in the 484-ball FBGA provide dense parallel interface capability for sensor arrays, relay banks, and legacy field buses. The four independent I/O banks (dedicated VCCIB per bank, per Microchip's migration application note) let designers mix 3.3V, 2.5V, and 1.8V signal standards on one device without level shifters, reducing BOM cost and board area versus multi-chip solutions.
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Telecommunications Line Cards
In telecom line-card and backplane designs, the A3P600-1FG484I serves as bus bridging, framer glue logic, and control-plane interconnect. The 600K-gate flash fabric and 110592 memory bits support modest FIFOs, register banks, and state machines, while 235 I/Os handle wide parallel buses to PHYs and processors. Because configuration lives in on-chip flash, no configuration PROM occupies board space or boots during link bring-up - the FPGA is functional at first clock. The 1.5V core keeps dynamic power low for always-on carrier equipment, and the industrial grade supports outdoor plant and uncontrolled-environment racks.
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Medical Instrumentation Control
Medical diagnostic and monitoring equipment benefits from the A3P600-1FG484I's deterministic instant-on behavior and single-chip configuration security - the flash fabric cannot be silently overwritten like SRAM FPGAs. Typical roles include front-end ADC sequencing, display interface glue logic, and motor/sensor control in analyzers and imaging subsystems. The 484-ball FBGA footprint supports fine-pitch two-side PCB assembly common in compact instrument stacks, while four I/O banks accommodate mixed-voltage sensor and display standards. Designers should confirm IEC 60601-1 system-level requirements independently; the FPGA's role is deterministic, secure control logic with predictable power-up.
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Aerospace and Defense Subsystems
The ProASIC3 flash architecture is the commercial ancestor of Microchip's radiation-tolerant RTAX family, making A3P600-1FG484I a natural prototyping and ground-equipment companion for space-qualified RTAX2000S/RTAX4000S designs. Engineers can develop and validate logic on the low-cost commercial flash FPGA, then retarget the RTAX device for flight hardware, since both use Actel-originated fabric and toolchains. Typical ground-segment uses include test benches, evaluation fixtures, and non-flight control electronics where flash configuration security (no external bitstream exposure) and instant-on operation are valued. The industrial temperature rating supports extended-temperature ground stations and range equipment.
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Legacy System Life Extension
When obsolete ASSPs, PALs/GALs, or discontinued SRAM FPGAs must be replaced, the A3P600-1FG484I consolidates dispersed glue logic into a single reprogrammable flash device with low total cost of ownership (Microchip's stated 'Low TOC' design goal). Its 235 I/Os and 484-ball FBGA map well to legacy wide-bus boards, and reprogrammability allows firmware-style iteration without board respins. Instant-on flash configuration preserves the deterministic power-up behavior that legacy TTL/PAL designs depended on - no configuration delay or external boot memory. This makes the device a common choice for maintaining industrial, telecom, and defense platforms built decades ago.
추천
Test and Measurement Fixtures
Bench and production test equipment uses the A3P600-1FG484I for channel multiplexing, timing/strobe generation, and protocol adaptation between the unit under test and the host controller. The 600K-gate fabric with 110592 memory bits implements pattern buffers and capture FIFOs, while 235 I/Os support dense probing of parallel buses. The -1 speed grade suffices for most stimulus/capture roles, and the industrial rating tolerates unconditioned production-floor environments. Because the flash fabric is live at power-up, fixtures begin running immediately without configuration-file load delays, improving throughput in high-cycle automated test cells.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600-1FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-1FGG484I | A3P600-2FGG484I | A3P600-FG484I | A3P600L-1FG484I | A3P600-2FG484 |
|---|---|---|---|---|---|---|
| Package | 484-Ball FBGA (FG484) | 484-Ball FBGA (FG484) - same | 484-Ball FBGA (FG484) - same | 484-Ball FBGA (FG484) - same | 484-Ball FBGA (FG484) - same | 484-Ball FBGA (FG484) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 235 | 235 | 235 | 235 | 235 | 235 |
| Memory Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
| Speed Grade | -1 | -1 | -2 (faster) | Standard | -1 | -2 (faster) |
| Power Characteristic | Standard (1.5 V core) | Standard | Standard | Standard | Low-power (L variant) | Standard |
| Packaging Material | Standard | Green (halogen-free) | Green (halogen-free) | Standard | Standard | Standard |
주요 차별점
- Single-chip flash configuration - no external boot device (vs A3P600-2FGG484I)
- Low-power variant available in same footprint (vs A3P600L-1FG484I)
- Speed grade trade-off (vs A3P600-2FGG484I)
설계 노트
The A3P600-1FG484I uses a 1.5V core (VCC) plus independent I/O bank supplies (VCCIB0-VCCIB3). Per Microchip's ProASIC3 migration application note, the FG484 package routes VCCIBx pins through four I/O banks, and only I/Os with compatible voltage standards may share a bank. Plan your bank assignment before pin locking: mixing 3.3V and 1.8V standards in one bank is not possible without changing VCCIB for the whole bank. Sequencing between core and I/O supplies should follow the ProASIC3 datasheet power-up guidance to avoid latch-up during startup.
The 484-ball FBGA requires a carefully planned via escape strategy. Use a minimum of four signal layers with via-in-pad or dog-bone escapes on a 0.8-1.0 mm ball pitch, and dedicate continuous planes for the 1.5V core rail. Because the flash fabric is live immediately at power-up, ensure power rails are well decoupled before the core voltage stabilizes - place bulk and 0.1uF decoupling capacitors close to each supply ball group per the manufacturer datasheet layout guidance.
Do not assume a generic FBGA-484 ball map: only 235 of the 484 balls are user I/Os, and the remaining balls are dedicated power, ground, and configuration pins. Always generate your pin constraints from Microchip's official A3P600 FG484 ball-map file in Libero SoC. Also verify speed-grade timing: a design meeting timing on a -2 device may fail on the -1 A3P600-1FG484I, so run static timing analysis after any speed-grade substitution.
규정 준수 정보
Compliance status not stated in the retrieved web data; the FGG (green) package variants within the same family denote Microchip's halogen-free packaging option. Verify RoHS/REACH status on the official Microchip product page before export-controlled or regulated builds.