M1AFS600-1FG484K - Fusion FPGA 600K Gates 172 I/O | Microchip
부품 번호: M1AFS600-1FG484K ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $332.52 | $332.52 |
| 10 | $316.5 | $3,165.00 |
| 100 | $299.27 | $29,927.00 |
| 500 | $286 | $143,000.00 |
| 1,000 | $273.52 | $273,520.00 |
M1AFS600-1FG484K 개요
A Fusion mixed-signal FPGA is a flash-based programmable logic device that integrates configurable analog blocks, large flash memory, clock generation and management circuitry, and high-performance programmable fabric in a single monolithic chip. Within the power-management hierarchy, it spans programmable logic -> FPGA -> mixed-signal SoC, and the M1 prefix specifically denotes Fusion devices equipped with the ARM Cortex-M1 processor for embedded control.
Key features include 110,592 bits of flash-based fabric capacity (as listed by distributors), 172 available I/O, and the on-chip ARM Cortex-M1 for single-chip embedded designs. Flash-based configuration makes the device inherently secure and instant-on, removing the need for an external configuration PROM. The monolithic integration of analog peripherals, clock circuitry (CCC) and logic reduces board count, BOM cost, and design complexity relative to a discrete FPGA-plus-analog solution.
The device is fabricated on 130nm flash-based CMOS technology and operates from a 1.5V core supply. Fabric speed grades (-1 in this part) determine maximum fabric performance; the M1AFS600 series is specified up to the hundreds of MHz range in system applications. The FG484 ball-grid package provides high I/O density and good signal integrity for wide buses and memory interfaces.
Typical applications include industrial automation and motor control, secure embedded systems leveraging the Cortex-M1, space-constrained mixed-signal instrumentation, and power monitoring where Fusion's configurable analog blocks replace external ADCs and comparators.
Design consideration: this K-graded ordering code is listed by distributors as containing lead and RoHS non-compliant, so it is suitable for designs exempt from RoHS or for repair/legacy programs; choose the FGG484 (green) variant for RoHS-compliant new designs.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: M1AFS600-1FG484K — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS600-1FG484K (동일 폼 팩터 및 풋프린트) — 차이점: Package, System Gates, Family, Processor Core, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS600-1FGG484K
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →M1AFS600-1FG484I
✅ 드롭인✓ 재고 있음
$425 / 개
데이터시트 보기 →M1AFS600-FG484K
✅ 드롭인✓ 재고 있음
$108.5 / 개
데이터시트 보기 →M1AFS600-2FG484
✅ 드롭인✓ 재고 있음
$141.9 / 개
데이터시트 보기 →M1AFS600-2FGG484
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →AFS600-1FG484K
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS600-1FG484K 최대 정격 & 전기적 특성
| Logic Technology | Flash-based FPGA (Fusion), 130 nm CMOS |
| System Gates | 600 K |
| Fabric Capacity (bits, distributor listed) | 110592 |
| User I/O | 172 |
| Processor Core | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| 패키지 | 484-Ball FBGA (FG484) |
| 실장 유형 | Surface Mount |
| Configuration | Flash-based, instant-on (no external configuration device) |
| Integrated Analog | Configurable analog blocks (Fusion mixed-signal architecture) |
| Clock Management | Integrated clock generation and management (CCC) |
| Embedded Memory | Large flash memory blocks |
| RoHS 상태 | RoHS Non-Compliant (contains lead, per distributor listing) |
| Lead-Free Status | Contains Lead |
M1AFS600-1FG484K 484-ball fbga (fg484) 핀 구성 가이드
M1AFS600-1FG484K(484-ball fbga (fg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS600-1FG484K.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS600-1FG484K 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Secure Embedded Systems, Mixed-Signal Instrumentation, Power Monitoring and Sequencing, Legacy System Repair and Sustainment, Communications and Interface Bridging.
Industrial Automation and Motor Control
The M1AFS600-1FG484K fits industrial motor control because its 600K-gate flash fabric generates multi-channel PWM while the integrated ARM Cortex-M1 runs the control loop, eliminating a separate MCU. Fusion's configurable analog blocks support current and voltage sense conditioning on-chip, and integrated clock generation simplifies drive-timing synchronization across the 172 available I/O. Instant-on flash configuration means the drive is active within milliseconds of power application - important for safety interlocks. Placed as the main controller, it replaces FPGA-plus-MCU-plus-PGA discrete chains, cutting BOM count; the trade-off is that the -1 speed grade bounds maximum fabric clock rate, which should be verified against your PWM resolution targets in Libero timing analysis.
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Secure Embedded Systems
Flash-based Fusion FPGAs are inherently suited to secure embedded designs: configuration data lives in nonvolatile on-chip flash, so there is no bitstream to intercept at power-up, unlike SRAM FPGAs that load from external PROMs. The M1AFS600-1FG484K adds an ARM Cortex-M1 processor, letting security-critical firmware and programmable logic coexist in one 484-ball FBGA with 172 I/O. Monolithic integration reduces the physical attack surface and board routing of secrets. Use it for secure industrial controllers and equipment authentication where IP protection matters. Note that this K variant is leaded; for products shipping under RoHS, substitute the pin-identical M1AFS600-1FGG484K green variant without any layout or firmware changes.
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Mixed-Signal Instrumentation
Bench and embedded instrumentation benefit directly from Fusion's monolithic integration of configurable analog, large flash memory blocks, and clock management alongside 600K gates of programmable logic. The M1AFS600-1FG484K implements acquisition sequencers, trigger logic, and interface bridges in fabric while the Cortex-M1 handles protocol and user-facing control, and on-chip analog blocks monitor supply and signal levels without external ADCs for supervisory functions. The 172 I/O support wide parallel data paths to front-end converters, and the FG484 BGA's short ball vias aid signal integrity on high-speed buses. Distributor listings confirm 110592 fabric bits and 1.5V core operation on 130nm flash CMOS, a proven low-power process for portable instruments.
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Power Monitoring and Sequencing
Fusion's original design intent includes power management: the M1AFS600-1FG484K's configurable analog block monitors multiple voltage and temperature channels on-chip, and the fabric implements custom sequencing and brown-out logic with microsecond-scale response - faster than a software-only supervisor. With 600K gates and 172 I/O, one chip can both supervise rails and gate downstream enable signals, while the ARM Cortex-M1 logs events and communicates over UART/I2C/SPI. Flash-based instant-on operation means monitoring begins immediately at power-up, before an external MCU could boot. Design consideration: this FG484K ordering code contains lead, so RoHS-regulated power products should use the identical green M1AFS600-1FGG484K instead.
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Legacy System Repair and Sustainment
Because Microsemi Fusion devices have shipped since the mid-2000s, many defense, aerospace-adjacent, and industrial platforms still depend on them. The M1AFS600-1FG484K, and leaded-compatible alternatives such as AFS600-1FG484K, serve sustainment programs where the original design was qualified against leaded assembly and RoHS exemption applies. Drop-in same-footprint variants (M1AFS600-1FG484I for industrial temperature, M1AFS600-2FG484 for faster fabric) allow repair depots to adapt to available stock without PCB rework. Distributor channels including DigiKey, Mouser, LCSC, and Octopart-listed brokers currently show active inventory (as of 2026-09-02), which is essential for end-of-life-adjacent sourcing; verify date codes on broker stock.
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Communications and Interface Bridging
The M1AFS600-1FG484K works well as a protocol bridge: 172 I/O accommodates parallel legacy buses alongside serial interfaces implemented in fabric (UART, SPI, I2C, and higher-speed links within -1 speed-grade limits), while the ARM Cortex-M1 runs protocol stacks. Integrated clock generation and management circuitry provide the multiple synchronized domains typical of networking line cards and industrial gateways without external PLL chips, reducing jitter sources. Flash fabric retains the bridge configuration across power cycles, enabling fast bring-up in redundant systems. For designs pushing timing closure at -1, the pin-compatible M1AFS600-2FG484 offers faster fabric on the identical 484-ball footprint, making speed-grade upgrades a pure ordering-code change.
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추천 제품 요약
엔지니어링 참조 데이터: M1AFS600-1FG484K — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS600-1FGG484K | M1AFS600-1FG484I | M1AFS600-2FG484 | AFS600-1FG484K |
|---|---|---|---|---|---|
| Package | 484-Ball FBGA (FG484) | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 600 K | 600 K | 600 K | 600 K | 600 K |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | -1 |
| ARM Cortex-M1 Processor | Yes (M1 prefix) | Yes | Yes | Yes | Not designated (non-M1 Fusion) |
주요 차별점
- Integrated ARM Cortex-M1 processor (vs AFS600-1FG484K)
- Monolithic mixed-signal integration (vs M1AFS600-2FG484)
- Flash-based instant-on security (vs SRAM FPGAs (other vendors))
- Pin-identical RoHS upgrade path (vs M1AFS600-1FGG484K)
설계 노트
The FG484K ordering code is listed by distributors as containing lead (RoHS Non-Compliant). If your product ships into RoHS-regulated markets, order M1AFS600-1FGG484K instead - it is the identical die and 484-ball footprint with lead-free balls, so no PCB or firmware change is needed. Mixing leaded and lead-free BGA assemblies also affects reflow profile and long-term solder-joint reliability, so standardize on one metallurgy per build. Confirm compliance requirements at BOM creation, not at contract manufacture.
The 484-ball FBGA requires a controlled land pattern and solder-mask-defined or non-SMD pads per the Fusion family datasheet package section. Fan out with via-in-pad or dog-bone escape on 0.8 mm-class ball pitch, and verify your fabricator's minimum drill capability before routing the 172 user I/O. Because flash-based Fusion needs no external configuration PROM, reserve board area previously allocated for a config flash for decoupling instead. Follow the manufacturer datasheet ball map exactly - power, ground, JTAG, and clock balls are fixed and must not be repurposed.
The Fusion fabric operates from a 1.5 V core supply (per distributor specifications), with separate I/O bank supplies defined in the family datasheet. Estimated: total power depends on toggling rates and I/O loading, so use Microchip's Libero power calculator with your actual design rather than rule-of-thumb numbers, then size regulators with margin. Sequence supplies per the datasheet power-up requirements, and place bulk plus 0.1 uF ceramic decoupling at each supply ball group. Verify the operating temperature range of the K grade against your worst-case ambient before finalizing thermal design.
규정 준수 정보
Distributor listings (DigChip, DigiKey) state Contains Lead and RoHS Non-Compliant for the FG484K ordering code. Use M1AFS600-1FGG484K for RoHS-compliant applications. REACH, halogen-free, and conflict-minerals status not stated in provided data.