A3P600-2FG484 - ProASIC3 FPGA, 600K Gates | Microchip
부품 번호: A3P600-2FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $91.85 | $91.85 |
| 10 | $84.5 | $845.00 |
| 100 | $76.2 | $7,620.00 |
| 500 | $68.9 | $34,450.00 |
| 1,000 | $61.5 | $61,500.00 |
A3P600-2FG484 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs belong to the programmable logic device family, which sits between fixed-function ASICs and general-purpose processors. They offer reconfigurability, parallel processing, and rapid prototyping, making them essential in applications where flexibility and time-to-market are critical.
The A3P600-2FG484 features flash-based configuration, which retains the design without external boot memory, providing instant-on capability and enhanced security. It includes 110,592 bits of embedded flash memory, 235 user I/Os, and four I/O banks with support for multiple voltage standards. The device is lead-free and RoHS compliant, and it is available in a 484-ball FBGA package with a 23x23 mm body.
This FPGA is built on a 130nm CMOS process, offering a balance of performance and power efficiency. The ProASIC3 family is known for its low total cost of ownership, single-chip solution, and reprogrammability. The device supports in-system programming (ISP) and can be reprogrammed in the field, enabling design updates and secure key storage.
Typical applications include industrial automation, automotive electronics, communications infrastructure, and aerospace systems. The 235 I/Os and 600K gates provide ample resources for implementing complex logic, interfacing with sensors and actuators, and handling communication protocols. The flash-based architecture ensures reliable operation in harsh environments.
When designing with this FPGA, consider the I/O bank voltage requirements and the need for proper decoupling of the 1.5V core supply. The device supports multiple I/O standards, so configure each bank according to the interfacing voltage levels. Use the Microchip Libero SoC design suite for synthesis, place-and-route, and programming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P600-2FG484.
드롭인 대체품: A3P600-2FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-2FG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, System Gates, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-2FGG484I
✅ 드롭인✓ 재고 있음
$31.8 / 개
데이터시트 보기 →A3P600-2FG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P600-2FGG484I
✅ 드롭인✓ 재고 있음
$31.8 / 개
데이터시트 보기 →A3P600-FG484I
✅ 드롭인✓ 재고 있음
$25.4 / 개
데이터시트 보기 →A3P600-FGG484
✅ 드롭인✓ 재고 있음
$44.75 / 개
데이터시트 보기 →A3P600-FGG484I
✅ 드롭인✓ 재고 있음
$55.3 / 개
데이터시트 보기 →A3P600-2FG484 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements (LEs) | 7K LEs (approx.) |
| User I/Os | 235 |
| RAM Bits | 110592 |
| Core Supply Voltage | 1.5V |
| Maximum System Performance | 310 MHz |
| I/O Banks | 4 |
| 패키지 | 484-BGA (FBGA) |
| 실장 유형 | Surface Mount |
| Process Technology | 130nm CMOS |
| Configuration | Flash-based |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
A3P600-2FG484 484-bga (fbga) 핀 구성 가이드
A3P600-2FG484(484-bga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-2FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-2FG484 적합 용도: 6 애플리케이션s: Industrial Automation, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Devices, IoT and Edge Computing.
Industrial Automation
The A3P600-2FG484 is ideal for industrial automation due to its 600K gates and 235 I/Os, enabling implementation of motor control, PLC interfaces, and sensor processing. Its flash-based configuration provides instant-on and high reliability in harsh environments. The 1.5V core and 310 MHz performance support real-time control loops and communication protocols like EtherCAT. With four I/O banks, it can interface with various voltage levels, simplifying system integration. The FPGA's reprogrammability allows field updates and customization for different automation tasks, reducing time-to-market and inventory costs.
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Automotive Electronics
In automotive electronics, the A3P600-2FG484 can be used for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS) preprocessing. Its 600K gates provide ample logic for implementing communication interfaces like CAN and LIN, while the 235 I/Os connect to sensors and actuators. The flash-based architecture ensures reliable operation across temperature extremes, and the instant-on capability is crucial for safety-critical applications. Although not AEC-Q100 qualified, the industrial temperature grade variant (A3P600-2FGG484I) offers extended temperature range for under-hood applications. The FPGA's reprogrammability enables over-the-air updates, enhancing vehicle functionality post-production.
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Communications Infrastructure
The A3P600-2FG484 is well-suited for communications infrastructure, including base stations, routers, and switches. Its 600K gates and 235 I/Os enable implementation of packet processing, protocol conversion, and interface bridging. The 310 MHz system performance supports high-speed data paths, while the four I/O banks allow interfacing with various logic levels (e.g., LVCMOS, LVDS). The flash-based configuration provides secure boot and prevents unauthorized copying, which is critical for network equipment. The FPGA's reprogrammability allows firmware updates to support evolving standards, extending product lifespan. Its low power consumption compared to SRAM-based FPGAs makes it suitable for power-constrained remote equipment.
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Aerospace and Defense
In aerospace and defense, the A3P600-2FG484 is used for avionics, satellite subsystems, and secure communication systems. Its flash-based FPGA offers radiation tolerance and immunity to configuration upsets, making it suitable for space applications. The 600K gates and 235 I/Os support complex signal processing and interface management. The instant-on capability ensures immediate operation upon power-up, critical for mission-critical systems. The device's security features protect intellectual property and prevent reverse engineering. The industrial temperature grade variant (A3P600-2FGG484I) is recommended for extreme environments. The FPGA's reprogrammability allows in-field updates, enabling adaptability to changing mission requirements.
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Medical Devices
The A3P600-2FG484 is suitable for medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its 600K gates and 235 I/Os enable implementation of data acquisition, signal processing, and display interfaces. The flash-based configuration provides reliable operation and instant-on, which is essential for life-critical devices. The FPGA's low power consumption is beneficial for battery-powered portable devices. The reprogrammability allows firmware updates to improve functionality and address bugs without hardware changes. The industrial temperature grade variant (A3P600-2FGG484I) is available for devices that require extended temperature ranges. Compliance with medical standards is facilitated by the device's RoHS compliance and lead-free construction.
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IoT and Edge Computing
The A3P600-2FG484 is ideal for IoT gateways and edge computing devices that require flexible I/O and moderate logic capacity. Its 600K gates and 235 I/Os allow implementation of protocol bridging, sensor fusion, and local decision-making. The flash-based FPGA provides instant-on and low power consumption, making it suitable for battery-powered or energy-harvesting devices. The reprogrammability enables over-the-air updates to adapt to changing IoT standards. The four I/O banks support various sensor interfaces, including SPI, I2C, and UART. The device's security features protect data and prevent unauthorized access. The industrial temperature grade variant (A3P600-2FGG484I) is available for outdoor or harsh environments.
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추천 제품 요약
엔지니어링 참조 데이터: A3P600-2FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-2FGG484 | A3P600-2FG484I | A3P600-2FGG484I | A3P600-FG484I | A3P600-FGG484 | A3P600-FGG484I |
|---|---|---|---|---|---|---|---|
| Package | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K | 600K |
| User I/Os | 235 | 235 | 235 | 235 | 235 | 235 | 235 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
| Core Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Temperature Grade | Commercial | Commercial | Industrial | Industrial | Industrial | Commercial | Industrial |
주요 차별점
- Flash-based configuration provides instant-on and secure boot (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption compared to SRAM-based FPGAs (vs SRAM-based FPGAs (e.g., Altera Cyclone IV))
- Reprogrammability with in-system programming (ISP) (vs ASICs)
설계 노트
The A3P600-2FG484 requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with adequate current capability. Estimated: For a design with 50% logic utilization and 100 MHz clock, core current may be around 200-400 mA. Provide decoupling capacitors (0.1uF and 10uF) close to each VCC pin to minimize voltage ripple. Refer to the Microchip power application notes for detailed calculations.
For the 484-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Ensure the thermal pad (if present) is properly connected to ground for heat dissipation. Route high-speed I/O signals with controlled impedance (e.g., 50 ohms) and minimize trace lengths. Place decoupling capacitors as close as possible to the FPGA power pins. Follow the layout guidelines in the Microchip FPGA layout application note.
Avoid exceeding the absolute maximum ratings for the core supply voltage (1.5V ±5%). Ensure all I/O banks are powered with the correct VCCIBX voltage before applying signals. Do not leave unused I/O pins floating; configure them as inputs with pull-ups or as outputs. When programming the FPGA, use the recommended programmer and follow the programming sequence to avoid configuration errors. Also, verify that the JTAG pins are not conflicting with other functions.
규정 준수 정보
RoHS compliant and lead-free per distributor listings. AEC-Q100 qualification not specified for this part.