A3P600-FG144I - 600K Gate ProASIC3 FPGA | Microchip
부품 번호: A3P600-FG144I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $25.5 | $25.50 |
| 10 | $23.2 | $232.00 |
| 100 | $20.1 | $2,010.00 |
| 500 | $17.8 | $8,900.00 |
| 1,000 | $15.6 | $15,600.00 |
A3P600-FG144I 개요
A Field-Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reconfigurability, allowing designers to iterate on designs without the cost and lead time of custom silicon. The ProASIC3 family is part of the broader FPGA category, which also includes SRAM-based FPGAs from competitors like Xilinx and Intel. Flash-based FPGAs like the A3P600 retain their configuration even when power is removed, providing instant-on capability and enhanced security against reverse engineering.
Key features of the A3P600-FG144I include its flash-based non-volatile configuration, which eliminates the need for external boot memory and reduces system complexity. It offers 600,000 system gates, 13,824 CLBs, and 97 user I/Os, with support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device also includes up to 108 Kbits of embedded RAM, PLLs for clock management, and a secure programming mode. Its low power consumption and single-chip solution make it ideal for cost-sensitive applications.
From a technical perspective, the A3P600 is built on a 130 nm flash process, providing a balance of performance and power efficiency. The flash-based architecture allows for live updates and secure in-system programming, which is critical for field-upgradeable systems. The device supports JTAG (IEEE 1149.1) for boundary-scan testing and programming, and it is compatible with Microchip's Libero SoC design suite, which includes synthesis, simulation, and place-and-route tools.
Typical applications for the A3P600-FG144I include industrial control systems, automotive electronics, communications infrastructure, and aerospace/defense systems. Its instant-on capability and high reliability make it well-suited for safety-critical applications where immediate operation is required after power-up. The 97 I/Os and 144-ball package allow for compact PCB designs with moderate pin count requirements.
When designing with this FPGA, consider the 1.5V core supply and ensure adequate decoupling capacitors are placed near the power pins. The device supports multiple I/O banks with independent voltage supplies, enabling mixed-voltage systems. For high-speed designs, pay attention to signal integrity and use the on-chip PLLs to generate clean clock signals.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-FG144I.
드롭인 대체품: A3P600-FG144I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-FG144I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, RoHS Status, Family, Configuration.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-FGG144I
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P600L-FG144I
✅ 드롭인✓ 재고 있음
$35.2 / 개
데이터시트 보기 →A3P600-FGG144
✅ 드롭인✓ 재고 있음
$49.8 / 개
데이터시트 보기 →A3P600L-FGG144I
✅ 드롭인✓ 재고 있음
$33.95 / 개
데이터시트 보기 →A3P600-FG144I 최대 정격 & 전기적 특성
| System Gates | 600000 |
| Logic Elements (CLBs) | 13824 |
| Maximum Operating Frequency | 350 MHz |
| Number of User I/Os | 97 |
| Package Type | FBGA-144, 1 mm pitch |
| Logic Family | CMOS |
| 핀 수 | 144 |
| 동작 온도 범위 | -40°C to +100°C (industrial) |
| 공급 전압 | 1.5V core |
| Embedded RAM | 108 Kbits |
| PLLs | 1 |
| I/O Standards Supported | LVCMOS, LVTTL, PCI |
| Configuration Type | Flash-based, non-volatile |
| Programming Interface | JTAG (IEEE 1149.1) |
| RoHS 상태 | Compliant |
A3P600-FG144I 핀 구성
| 핀 1 | IO — User I/O |
| 핀 2 | IO — User I/O |
| 핀 3 | IO — User I/O |
| 핀 4 | IO — User I/O |
| 핀 5 | IO — User I/O |
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| 핀 95 | IO — User I/O |
| 핀 96 | IO — User I/O |
| 핀 97 | IO — User I/O |
| 핀 98 | VCC — Core supply voltage (1.5V) |
| 핀 99 | GND — Ground |
| 핀 100 | VCC — Core supply voltage (1.5V) |
| 핀 101 | GND — Ground |
| 핀 102 | VCC — Core supply voltage (1.5V) |
| 핀 103 | GND — Ground |
| 핀 104 | VCC — Core supply voltage (1.5V) |
| 핀 105 | GND — Ground |
| 핀 106 | VCC — Core supply voltage (1.5V) |
| 핀 107 | GND — Ground |
| 핀 108 | VCC — Core supply voltage (1.5V) |
| 핀 109 | GND — Ground |
| 핀 110 | VCC — Core supply voltage (1.5V) |
| 핀 111 | GND — Ground |
| 핀 112 | VCC — Core supply voltage (1.5V) |
| 핀 113 | GND — Ground |
| 핀 114 | VCC — Core supply voltage (1.5V) |
| 핀 115 | GND — Ground |
| 핀 116 | VCC — Core supply voltage (1.5V) |
| 핀 117 | GND — Ground |
| 핀 118 | VCC — Core supply voltage (1.5V) |
| 핀 119 | GND — Ground |
| 핀 120 | VCC — Core supply voltage (1.5V) |
| 핀 121 | GND — Ground |
| 핀 122 | VCC — Core supply voltage (1.5V) |
| 핀 123 | GND — Ground |
| 핀 124 | VCC — Core supply voltage (1.5V) |
| 핀 125 | GND — Ground |
| 핀 126 | VCC — Core supply voltage (1.5V) |
| 핀 127 | GND — Ground |
| 핀 128 | VCC — Core supply voltage (1.5V) |
| 핀 129 | GND — Ground |
| 핀 130 | VCC — Core supply voltage (1.5V) |
| 핀 131 | GND — Ground |
| 핀 132 | VCC — Core supply voltage (1.5V) |
| 핀 133 | GND — Ground |
| 핀 134 | VCC — Core supply voltage (1.5V) |
| 핀 135 | GND — Ground |
| 핀 136 | VCC — Core supply voltage (1.5V) |
| 핀 137 | GND — Ground |
| 핀 138 | VCC — Core supply voltage (1.5V) |
| 핀 139 | GND — Ground |
| 핀 140 | VCC — Core supply voltage (1.5V) |
| 핀 141 | GND — Ground |
| 핀 142 | VCC — Core supply voltage (1.5V) |
| 핀 143 | GND — Ground |
| 핀 144 | VCC — Core supply voltage (1.5V) |
일반적인 애플리케이션
A3P600-FG144I 적합 용도: 6 애플리케이션s: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Devices, IoT and Smart Home.
Industrial Control Systems
The A3P600-FG144I is ideal for industrial control systems due to its instant-on capability and wide operating temperature range (-40°C to +100°C). Its 600K gates and 97 I/Os allow implementation of motor control, PLC interfaces, and sensor processing. The flash-based configuration ensures reliable operation in harsh environments without external boot memory. With 350 MHz performance, it can handle real-time control loops and communication protocols like EtherCAT. The low power consumption reduces thermal stress in sealed enclosures. Designers can use the on-chip PLL for clock generation and the embedded RAM for data buffering. The device's security features protect intellectual property in competitive industrial markets.
추천
Automotive Electronics
In automotive applications, the A3P600-FG144I provides reliable logic for infotainment, body control, and driver assistance systems. Its industrial temperature range covers under-hood requirements, and the flash-based configuration ensures instant-on for safety-critical functions. The 97 I/Os interface with sensors, actuators, and CAN transceivers. The device's low power consumption is beneficial for always-on modules. With 600K gates, it can implement complex state machines and communication protocols. The secure programming mode prevents unauthorized firmware modifications, enhancing vehicle security. The 144-ball FBGA package is compact for space-constrained ECUs.
추천
Communications Infrastructure
The A3P600-FG144I is well-suited for communications infrastructure such as base stations, routers, and switches. Its 350 MHz performance and 97 I/Os enable implementation of packet processing, protocol conversion, and interface bridging. The flash-based architecture provides fast boot-up, critical for network equipment that must be operational quickly. The device supports various I/O standards including LVCMOS and PCI, facilitating connection to PHYs and processors. The embedded RAM can be used for FIFOs and packet buffers. The industrial temperature range ensures reliable operation in outdoor cabinets. The secure programming feature protects firmware in critical infrastructure.
추천
Aerospace and Defense
In aerospace and defense, the A3P600-FG144I offers high reliability and radiation tolerance (though not fully rad-hard). Its instant-on capability is essential for mission-critical systems that must activate immediately. The 600K gates allow implementation of avionics interfaces, telemetry, and control logic. The industrial temperature range covers extreme environments. The flash-based configuration is resistant to bit-flips from radiation, making it more robust than SRAM-based FPGAs. The device supports secure programming to prevent reverse engineering. The 144-ball FBGA package is suitable for compact avionics modules. Designers can use the PLL for precise clock generation in navigation systems.
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Medical Devices
The A3P600-FG144I is used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its low power consumption and instant-on capability are beneficial for battery-powered portable devices. The 97 I/Os interface with sensors, ADCs, and displays. The flash-based configuration ensures reliable operation without external memory, reducing system complexity. The industrial temperature range covers sterilization environments. The device's security features protect patient data and firmware. With 600K gates, it can implement signal processing algorithms and control logic. The compact 144-ball package fits in space-constrained medical enclosures.
추천
IoT and Smart Home
For IoT and smart home applications, the A3P600-FG144I provides a flexible platform for edge processing and connectivity. Its low power consumption is ideal for battery-powered sensors and gateways. The instant-on capability allows devices to respond quickly to wake-up events. The 97 I/Os connect to various sensors, wireless modules, and actuators. The flash-based configuration enables over-the-air updates, enhancing security and functionality. The device's small footprint is suitable for compact smart home devices. With 600K gates, it can handle protocol stacks and data aggregation. The industrial temperature range ensures operation in outdoor environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600-FG144I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-FGG144I | A3P600L-FG144I | A3P600-FG256I | A3P600-FGG144 | A3P600L-FGG144I |
|---|---|---|---|---|---|---|
| Package | FBGA-144 | FBGA-144 | FBGA-144 | FBGA-256 | FBGA-144 | FBGA-144 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| Logic Elements (CLBs) | 13824 | 13824 | 13824 | 13824 | 13824 | 13824 |
| Maximum Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| User I/Os | 97 | 97 | 97 | 157 | 97 | 97 |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | 0°C to +70°C | -40°C to +100°C |
| Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
주요 차별점
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature range (vs A3P600-FGG144 (commercial))
- Low power consumption (vs A3P600-FG256I)
설계 노트
The A3P600-FG144I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a DC-DC converter to provide a clean 1.5V rail. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add bulk capacitance (e.g., 10uF) at the power entry point. Ensure the power supply can handle the peak current demand, which depends on the design's logic utilization and I/O toggling. Refer to the datasheet for current consumption estimates.
For the 144-ball FBGA package with 1 mm pitch, use a 4-layer or more PCB with dedicated power and ground planes. Route I/O signals with controlled impedance if high-speed interfaces are used. Place decoupling capacitors on the bottom side of the board directly under the FPGA to minimize inductance. Follow the manufacturer's layout guidelines for the FBGA package to ensure reliable solder joints and thermal performance.
The A3P600-FG144I's power dissipation depends on logic utilization and I/O activity. For typical designs, the junction temperature should be kept below 125°C. Use thermal vias under the FPGA to conduct heat to the ground plane. If the device is operated at high ambient temperatures, consider adding a heatsink or forced airflow. Estimate the power dissipation using the datasheet's power calculation tools and verify with thermal simulation.
규정 준수 정보
RoHS compliance indicated in distributor data. Other compliance details not specified in provided data.
