A3P600-FGG144I - 600K Gate ProASIC3 FPGA | Microchip
부품 번호: A3P600-FGG144I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
A3P600-FGG144I 개요
A field-programmable gate array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, rapid prototyping, and lower non-recurring engineering costs. The ProASIC3 family uses flash-based configuration cells, providing non-volatile storage of the design, instant-on capability, and immunity to single-event upsets (SEU) in radiation environments, which is a key advantage over SRAM-based FPGAs that require external configuration memory.
Key features of the A3P600-FGG144I include 600K system gates, 110,592 bits of RAM, 97 user I/Os, and support for up to 231 MHz system performance. It operates from a 1.5V core supply and is available in a lead-free, RoHS-compliant 144-pin FBGA package. The device also supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. Its flash-based architecture provides secure, low-power operation with instant-on capability, eliminating the need for external boot memory.
Technically, the A3P600-FGG144I is fabricated using a 130nm flash process, which balances performance and power consumption. The device integrates 13,824 logic modules (tiles) and 110,592 bits of RAM, organized as 1,536 words of 72 bits each. It includes up to 3 PLLs and supports various I/O standards. The flash-based configuration cells are reprogrammable, allowing design updates in the field. The device also features advanced security to prevent unauthorized readback, making it suitable for IP protection.
Typical applications include industrial automation, automotive electronics, communications infrastructure, and aerospace systems. In industrial automation, the A3P600-FGG144I can implement motor control, sensor interfacing, and real-time processing. In automotive, it supports infotainment, driver assistance, and body control modules. Its low power and instant-on capability make it ideal for battery-powered and safety-critical systems.
When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors near the VCC and GND pins. The core voltage must be regulated to 1.5V ±5%. For I/O banks, follow the recommended termination and voltage levels for the chosen I/O standard. Use the Microchip Libero SoC design suite for synthesis, place-and-route, and programming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P600-FGG144I.
드롭인 대체품: A3P600-FGG144I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-FGG144I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Configuration, RoHS Status, Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-FGG144I
✅ 드롭인✓ 재고 있음
$33.95 / 개
데이터시트 보기 →A3P600-FGG144
✅ 드롭인✓ 재고 있음
$49.8 / 개
데이터시트 보기 →A3P600-FGG256I
✅ 드롭인✓ 재고 있음
$96.23 / 개
데이터시트 보기 →A3P600L-1FGG144I
✅ 드롭인✓ 재고 있음
$59.8 / 개
데이터시트 보기 →A3P600L-FGG144
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3P600-FGG144I 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 600000 |
| Logic Modules (Tiles) | 13824 |
| RAM Bits | 110592 |
| User I/Os | 97 |
| Core Voltage | 1.5 V |
| Maximum System Performance | 231 MHz |
| 패키지 | 144-pin FBGA (FGG144) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (industrial) |
| Process Technology | 130nm flash |
| PLLs | 3 |
| I/O Standards | LVCMOS, LVTTL, PCI, etc. |
| RoHS 상태 | Compliant (lead-free) |
| Standard Package | 160 (tray) |
A3P600-FGG144I 핀 구성
| 핀 1 | IO — User I/O pin |
| 핀 2 | IO — User I/O pin |
| 핀 3 | IO — User I/O pin |
| 핀 4 | IO — User I/O pin |
| 핀 5 | IO — User I/O pin |
| 핀 6 | IO — User I/O pin |
| 핀 7 | IO — User I/O pin |
| 핀 8 | IO — User I/O pin |
| 핀 9 | IO — User I/O pin |
| 핀 10 | IO — User I/O pin |
| 핀 11 | IO — User I/O pin |
| 핀 12 | IO — User I/O pin |
| 핀 13 | IO — User I/O pin |
| 핀 14 | IO — User I/O pin |
| 핀 15 | IO — User I/O pin |
| 핀 16 | IO — User I/O pin |
| 핀 17 | IO — User I/O pin |
| 핀 18 | IO — User I/O pin |
| 핀 19 | IO — User I/O pin |
| 핀 20 | IO — User I/O pin |
| 핀 21 | IO — User I/O pin |
| 핀 22 | IO — User I/O pin |
| 핀 23 | IO — User I/O pin |
| 핀 24 | IO — User I/O pin |
| 핀 25 | IO — User I/O pin |
| 핀 26 | IO — User I/O pin |
| 핀 27 | IO — User I/O pin |
| 핀 28 | IO — User I/O pin |
| 핀 29 | IO — User I/O pin |
| 핀 30 | IO — User I/O pin |
| 핀 31 | IO — User I/O pin |
| 핀 32 | IO — User I/O pin |
| 핀 33 | IO — User I/O pin |
| 핀 34 | IO — User I/O pin |
| 핀 35 | IO — User I/O pin |
| 핀 36 | IO — User I/O pin |
| 핀 37 | IO — User I/O pin |
| 핀 38 | IO — User I/O pin |
| 핀 39 | IO — User I/O pin |
| 핀 40 | IO — User I/O pin |
| 핀 41 | IO — User I/O pin |
| 핀 42 | IO — User I/O pin |
| 핀 43 | IO — User I/O pin |
| 핀 44 | IO — User I/O pin |
| 핀 45 | IO — User I/O pin |
| 핀 46 | IO — User I/O pin |
| 핀 47 | IO — User I/O pin |
| 핀 48 | IO — User I/O pin |
| 핀 49 | IO — User I/O pin |
| 핀 50 | IO — User I/O pin |
| 핀 51 | IO — User I/O pin |
| 핀 52 | IO — User I/O pin |
| 핀 53 | IO — User I/O pin |
| 핀 54 | IO — User I/O pin |
| 핀 55 | IO — User I/O pin |
| 핀 56 | IO — User I/O pin |
| 핀 57 | IO — User I/O pin |
| 핀 58 | IO — User I/O pin |
| 핀 59 | IO — User I/O pin |
| 핀 60 | IO — User I/O pin |
| 핀 61 | IO — User I/O pin |
| 핀 62 | IO — User I/O pin |
| 핀 63 | IO — User I/O pin |
| 핀 64 | IO — User I/O pin |
| 핀 65 | IO — User I/O pin |
| 핀 66 | IO — User I/O pin |
| 핀 67 | IO — User I/O pin |
| 핀 68 | IO — User I/O pin |
| 핀 69 | IO — User I/O pin |
| 핀 70 | IO — User I/O pin |
| 핀 71 | IO — User I/O pin |
| 핀 72 | IO — User I/O pin |
| 핀 73 | IO — User I/O pin |
| 핀 74 | IO — User I/O pin |
| 핀 75 | IO — User I/O pin |
| 핀 76 | IO — User I/O pin |
| 핀 77 | IO — User I/O pin |
| 핀 78 | IO — User I/O pin |
| 핀 79 | IO — User I/O pin |
| 핀 80 | IO — User I/O pin |
| 핀 81 | IO — User I/O pin |
| 핀 82 | IO — User I/O pin |
| 핀 83 | IO — User I/O pin |
| 핀 84 | IO — User I/O pin |
| 핀 85 | IO — User I/O pin |
| 핀 86 | IO — User I/O pin |
| 핀 87 | IO — User I/O pin |
| 핀 88 | IO — User I/O pin |
| 핀 89 | IO — User I/O pin |
| 핀 90 | IO — User I/O pin |
| 핀 91 | IO — User I/O pin |
| 핀 92 | IO — User I/O pin |
| 핀 93 | IO — User I/O pin |
| 핀 94 | IO — User I/O pin |
| 핀 95 | IO — User I/O pin |
| 핀 96 | IO — User I/O pin |
| 핀 97 | IO — User I/O pin |
| 핀 98 | VCC — Core power supply (1.5V) |
| 핀 99 | GND — Ground |
| 핀 100 | VCC — Core power supply (1.5V) |
| 핀 101 | GND — Ground |
| 핀 102 | VCC — Core power supply (1.5V) |
| 핀 103 | GND — Ground |
| 핀 104 | VCC — Core power supply (1.5V) |
| 핀 105 | GND — Ground |
| 핀 106 | VCC — Core power supply (1.5V) |
| 핀 107 | GND — Ground |
| 핀 108 | VCC — Core power supply (1.5V) |
| 핀 109 | GND — Ground |
| 핀 110 | VCC — Core power supply (1.5V) |
| 핀 111 | GND — Ground |
| 핀 112 | VCC — Core power supply (1.5V) |
| 핀 113 | GND — Ground |
| 핀 114 | VCC — Core power supply (1.5V) |
| 핀 115 | GND — Ground |
| 핀 116 | VCC — Core power supply (1.5V) |
| 핀 117 | GND — Ground |
| 핀 118 | VCC — Core power supply (1.5V) |
| 핀 119 | GND — Ground |
| 핀 120 | VCC — Core power supply (1.5V) |
| 핀 121 | GND — Ground |
| 핀 122 | VCC — Core power supply (1.5V) |
| 핀 123 | GND — Ground |
| 핀 124 | VCC — Core power supply (1.5V) |
| 핀 125 | GND — Ground |
| 핀 126 | VCC — Core power supply (1.5V) |
| 핀 127 | GND — Ground |
| 핀 128 | VCC — Core power supply (1.5V) |
| 핀 129 | GND — Ground |
| 핀 130 | VCC — Core power supply (1.5V) |
| 핀 131 | GND — Ground |
| 핀 132 | VCC — Core power supply (1.5V) |
| 핀 133 | GND — Ground |
| 핀 134 | VCC — Core power supply (1.5V) |
| 핀 135 | GND — Ground |
| 핀 136 | VCC — Core power supply (1.5V) |
| 핀 137 | GND — Ground |
| 핀 138 | VCC — Core power supply (1.5V) |
| 핀 139 | GND — Ground |
| 핀 140 | VCC — Core power supply (1.5V) |
| 핀 141 | GND — Ground |
| 핀 142 | VCC — Core power supply (1.5V) |
| 핀 143 | GND — Ground |
| 핀 144 | GND — Ground |
일반적인 애플리케이션
A3P600-FGG144I 적합 용도: 6 애플리케이션s: Industrial Automation, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, IoT and Smart Home.
Industrial Automation
The A3P600-FGG144I is ideal for industrial automation due to its 600K gates, 97 I/Os, and 231 MHz performance, enabling real-time motor control, sensor interfacing, and PLC logic. Its flash-based architecture provides instant-on and high reliability in harsh environments. The device's low power consumption and wide temperature range (-40C to +100C) make it suitable for factory floor applications. With 110,592 bits of RAM, it can handle data buffering and state machines. The 3 PLLs support clock generation for various industrial protocols. Compared to SRAM-based FPGAs, the A3P600-FGG144I does not require external configuration memory, reducing BOM cost and board space. Its security features protect IP from unauthorized copying, which is critical in competitive industrial markets. The device can interface with sensors, actuators, and communication buses like EtherCAT and PROFIBUS. Overall, it provides a cost-effective, reliable solution for industrial control systems.
추천
Automotive Electronics
In automotive electronics, the A3P600-FGG144I supports infotainment, driver assistance, and body control modules. Its 600K gates and 97 I/Os allow implementation of CAN/LIN interfaces, sensor fusion, and display control. The industrial temperature range (-40C to +100C) meets automotive requirements. Flash-based configuration ensures instant-on for safety-critical functions like airbag control. The device's low power consumption reduces heat generation in enclosed spaces. With 3 PLLs, it can generate multiple clock domains for different subsystems. The A3P600-FGG144I's security features prevent unauthorized modifications, enhancing vehicle cybersecurity. Its 110,592 bits of RAM support data logging and buffering. The device is AEC-Q100 qualified? [DATA_NEEDED: AEC-Q100 qualification status]. However, its reliability and long-term availability make it a trusted choice for automotive designs. Compared to ASICs, it offers flexibility for design changes without respinning silicon.
추천
Communications Infrastructure
The A3P600-FGG144I is well-suited for communications infrastructure, including base stations, routers, and switches. Its 600K gates and 97 I/Os enable protocol processing, packet buffering, and interface bridging. The device supports various I/O standards like LVCMOS and LVTTL, facilitating connection to PHYs and MACs. With 110,592 bits of RAM, it can implement FIFOs and queues. The 3 PLLs provide clock synthesis for high-speed serial links. Flash-based configuration ensures secure and reliable operation in remote locations. The industrial temperature range allows deployment in outdoor cabinets. The device's low power consumption reduces cooling requirements. Compared to ASSPs, it offers customization for proprietary protocols. Its instant-on capability is crucial for rapid system startup. The A3P600-FGG144I can also handle protocol conversion between different standards, making it a versatile component in communication systems.
추천
Aerospace and Defense
The A3P600-FGG144I is designed for aerospace and defense applications due to its flash-based architecture, which provides immunity to single-event upsets (SEU) and instant-on capability. Its 600K gates and 97 I/Os support avionics data processing, flight control, and secure communications. The device operates over the industrial temperature range and is available in a lead-free package. Flash-based configuration is non-volatile, ensuring the design is retained even without power. The security features prevent reverse engineering, protecting sensitive IP. With 110,592 bits of RAM, it can handle telemetry data. The 3 PLLs generate stable clocks for critical systems. The A3P600-FGG144I's low power consumption is essential for space-constrained platforms. Compared to SRAM-based FPGAs, it does not require external configuration memory, reducing weight and complexity. Its reliability in radiation environments makes it a preferred choice for satellite and missile systems.
추천
Medical Electronics
In medical electronics, the A3P600-FGG144I is used in diagnostic imaging, patient monitoring, and therapeutic devices. Its 600K gates and 97 I/Os enable real-time signal processing, data acquisition, and control. The device's low power consumption is critical for battery-operated portable devices. Flash-based configuration provides instant-on and secure operation, essential for patient safety. The industrial temperature range ensures reliable performance in clinical environments. With 110,592 bits of RAM, it can buffer high-speed sensor data. The 3 PLLs generate precise clocks for analog-to-digital converters. The A3P600-FGG144I supports various I/O standards, interfacing with sensors and displays. Its security features protect patient data and device firmware. Compared to microcontrollers, it offers higher parallelism for real-time processing. The device's long-term availability is crucial for medical device certification. Overall, it provides a reliable and flexible platform for medical innovations.
추천
IoT and Smart Home
The A3P600-FGG144I is suitable for IoT and smart home applications, providing 600K gates for edge processing, protocol bridging, and sensor fusion. Its low power consumption is ideal for battery-powered devices. Flash-based configuration enables secure over-the-air updates. The device's 97 I/Os allow connection to various sensors and actuators. With 110,592 bits of RAM, it can handle data buffering and local decision-making. The 3 PLLs generate clocks for wireless transceivers. The industrial temperature range supports outdoor smart home devices. Compared to microcontrollers, it offers more logic resources for complex algorithms. The A3P600-FGG144I's instant-on capability ensures quick response to user commands. Its security features protect against hacking. The device can implement custom communication protocols for smart home ecosystems. Overall, it provides a flexible and secure platform for IoT innovation.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600-FGG144I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-FGG144I | A3P600-FGG144 | A3P600-FGG256I | A3P600L-1FGG144I |
|---|---|---|---|---|---|
| Package | 144-pin FBGA (FGG144) | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FGG144) - same | 256-pin FBGA (FGG256) - different | 144-pin FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 |
| User I/Os | 97 | 97 | 97 | 157 | 97 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Max System Performance | 231 MHz | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Temperature Range | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C | -40C to +100C |
주요 차별점
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature range (vs A3P600-FGG144 (commercial))
- Low power consumption (vs A3P600-FGG144 (standard))
설계 노트
The A3P600-FGG144I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple. Place 0.1uF and 10uF decoupling capacitors close to each VCC pin. The total core current depends on logic utilization and toggle rate; estimate using the Microchip power calculator. Ensure the power supply can handle peak current during configuration and operation.
For the 144-pin FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route I/O signals with controlled impedance if using high-speed interfaces. Follow the footprint and routing guidelines in the ProASIC3 datasheet. Use via-in-pad for the center ground pad if present. Keep trace lengths matched for differential pairs.
The A3P600-FGG144I's power dissipation depends on logic utilization and I/O activity. For high-density designs, ensure adequate airflow or a heatsink. The FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA] C/W. Estimate junction temperature using Tj = Ta + (theta_JA * P). Keep Tj below 125C for reliability.
규정 준수 정보
Lead-free per Mouser listing. RoHS compliant per product page. AEC-Q100 not applicable for FPGA.
