A3PE3000-2PQG208I - 3M-Gate Flash FPGA, 147 I/O | Microchip
부품 번호: A3PE3000-2PQG208I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $132.5 | $132.50 |
| 10 | $121.4 | $1,214.00 |
| 100 | $109.8 | $10,980.00 |
| 500 | $98.6 | $49,300.00 |
| 1,000 | $89.25 | $89,250.00 |
A3PE3000-2PQG208I 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Within the hierarchy of programmable logic, the A3PE3000 belongs to the flash-based FPGA class - distinct from SRAM FPGAs - because configuration data is stored in on-chip flash memory, giving it inherent single-chip, non-volatile, instant-on behavior without an external configuration PROM.
Key features include a 1.5V core supply typical of 130nm CMOS process technology, live-at-power-up (LAPU) operation enabled by flash storage, and reprogrammability that lowers total cost of ownership by eliminating external boot devices. The ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets.
Technically, the device uses Microsemi's proprietary flash switch technology combining a flash cell and routing switch in a single unit, which reduces area and improves security versus SRAM-based competitors. Speed grade -2 denotes the faster commercial speed bin, supporting system clock rates up to 310 MHz per distributor data. Embedded features include support for the Cortex-M1 soft processor in the related M1 ProASIC3 variants, plus on-chip PLLs and RAM blocks typical of the ProASIC3E architecture.
Typical applications include industrial control and automation, networking and communications line cards, avionics glue logic and interface bridging, medical instrumentation, and secure single-chip ASIC prototyping where non-volatile, tamper-resistant configuration matters.
When designing with this device, remember that the 208-pin PQFP has higher lead inductance than BGA alternatives such as the FGG484, which can limit very high-speed I/O signaling; verify signal-integrity margins for edges faster than approximately 500 ps.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, making it a one-stop reference for engineers evaluating the A3PE3000-2PQG208I.
드롭인 대체품: A3PE3000-2PQG208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-2PQG208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, System Gates, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000-PQG208
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000-PQ208I
✅ 드롭인✓ 재고 있음
$364 / 개
데이터시트 보기 →A3PE3000-PQG208X3
✅ 드롭인✓ 재고 있음
$128 / 개
데이터시트 보기 →M1A3PE3000-2PQG208I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1A3PE3000L-PQG208
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-PQ208I
✅ 드롭인✓ 재고 있음
$89.75 / 개
데이터시트 보기 →A3PE3000-2PQG208I 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| System Gates | 3000000 (3M) |
| Logic Capacity | 516096 |
| User I/O | 147 |
| Maximum System Frequency | 310 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Configuration Technology | Flash (non-volatile, reprogrammable) |
| 패키지 | 208-BFQFP (PQG208), gull-wing, square |
| Terminal Form | Gull Wing |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) |
| Temperature Grade | Industrial (I suffix) |
| Lead Free | Yes (G suffix, LEAD FREE per Mouser) |
| Packaging | Tray |
| RoHS 상태 | Compliant (lead free) |
A3PE3000-2PQG208I 208-bfqfp (pqg208), gull-wing, square 핀 구성 가이드
A3PE3000-2PQG208I(208-bfqfp (pqg208), gull-wing, square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-2PQG208I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-2PQG208I 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Networking and Communications Equipment, Avionics and Aerospace Interfaces, ASIC Prototyping and Low-Volume ASIC Replacement, Medical Instrumentation, Computing and Embedded Systems Glue Logic.
Industrial Control and Automation
The A3PE3000-2PQG208I fits industrial control and factory automation systems where the -40C to +85C industrial temperature rating and 3M-gate capacity handle motor sequencing, encoder interfaces, and safety interlock logic. Its non-volatile flash configuration means control cards power up functional immediately after a brownout - critical for equipment that must resume deterministically without reconfiguration downtime. With 147 user I/Os at up to 310 MHz internal performance, one device can absorb glue logic, counters, and communication bridges previously spread across multiple CPLDs and ASICs, cutting BOM cost. The 208-pin PQFP gull-wing package also suits the rework-friendly assembly typical of industrial boards with long service lifetimes.
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Networking and Communications Equipment
In networking and communications line cards, the A3PE3000-2PQG208I implements interface bridging, packet framing, and control-plane glue logic between PHYs, MACs, and backplane connectors. Microchip explicitly positions ProASIC3E for the networking/communications market, and the -2 speed grade supports internal system clocks up to 310 MHz, adequate for many framing and FIFO-management tasks. Flash storage eliminates the configuration-readback security exposure of SRAM FPGAs at power-up, a benefit for carrier equipment. Designers should note the PQFP-208 lead inductance is higher than BGA packages, so I/O signaling above a few hundred MHz edge rates warrants signal-integrity simulation before committing the footprint.
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Avionics and Aerospace Interfaces
For avionics subsystems, the A3PE3000-2PQG208I offers flash-based, single-chip programmable logic that Microchip targets at the avionics market. The instant-on flash configuration removes external boot PROMs, reducing component count in flight-hardware designs where every net adds qualification burden. The 3M-gate fabric comfortably implements ARINC-style bus interfaces, discrete-to-digital conditioning, and built-in-test logic, while the industrial -40C to +85C rating covers unpressurized equipment bays for many programs. The ceramic-compatible reflow profile of the PQFP and long Microchip product-longevity commitments support the multi-year production and sustainment schedules typical of aerospace programs. Program-specific screening must be arranged with the manufacturer.
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ASIC Prototyping and Low-Volume ASIC Replacement
The ProASIC3E family is explicitly marketed as a cost-effective ASIC replacement, and the A3PE3000-2PQG208I serves this role for designs of roughly 3 million gates that would be uneconomical as masked ASICs at low volumes. Because configuration is flash-based, a prototype board behaves identically in the lab and in the field - no JTAG chain configuration at every power cycle. Designers can iterate RTL in Libero SoC and reprogram the same physical device, compressing debug cycles. The 147 I/Os and 310 MHz (-2) performance cover a broad range of ASIC-interface emulations, and the PQFP-208 socket-friendly gull-wing package allows quick device swaps on prototype boards.
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Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE3000-2PQG208I's deterministic, instant-on behavior and secure on-chip flash configuration, which avoids configuration-stream interception concerns in devices handling patient data interfaces. The 3M-gate fabric implements sensor front-end timing, filter accelerators, and USB or UART bridging between analog front-ends and host processors, while the industrial temperature range covers autoclave-adjacent lab equipment and unconditioned portable devices. The PQFP-208 gull-wing package supports the inspection-friendly, reworkable assembly processes favored in medical hardware validation, and Microchip's long-lifecycle commitments align with the multi-year regulatory certification cycles these products require.
추천
Computing and Embedded Systems Glue Logic
In computing platforms and embedded single-board computers, the A3PE3000-2PQG208I consolidates bus translation, reset supervision, boot-sequencing, and legacy interface emulation (PCI-style addressing, local buses, legacy serial) into one reprogrammable device. Instant-on flash configuration means the FPGA is ready before the host CPU completes reset, avoiding external configuration controllers in the power-sequencing chain. The 1.5V core on 130nm process keeps static power modest, and the -2 speed grade's 310 MHz ceiling covers typical bridge clock domains. With 147 I/Os, one PQFP-208 device can replace several smaller CPLDs, simplifying spare-parts logistics for long-lived embedded product lines.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-2PQG208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000-PQG208 | A3PE3000-PQ208I | M1A3PE3000-2PQG208I | M1A3PE3000L-PQG208 | A3PE3000L-PQ208I |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQG208) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 3M | 3M | 3M | 3M | 3M | 3M |
| User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (L low-power variant) | 1.5 V (L low-power variant) |
| Special Features | Flash non-volatile, LAPU, speed -2 | Flash non-volatile, LAPU | Flash non-volatile, LAPU | Adds Cortex-M1 soft-CPU support | Cortex-M1 + low-power L grade | Low-power L grade |
주요 차별점
- Fastest speed grade in PQFP-208 footprint (vs A3PE3000-PQ208I)
- Soft-CPU upgrade path without respin (vs M1A3PE3000-2PQG208I)
- True single-chip instant-on operation (vs SRAM FPGAs (not pin-compatible))
설계 노트
The PQFP-208 package has gull-wing leads with higher lead inductance than BGA alternatives such as the FGG484. For I/O edges faster than roughly 500 ps or source-synchronous interfaces above ~100 MHz, simulate reflections and ground bounce, and assign switching I/Os across banks with adequate ground returns. If your design needs faster signaling than the PQFP supports, the same 3M-gate fabric is available in FGG324/FGG484 BGAs, but that requires a PCB respin - not a drop-in change.
Core supply is 1.5V on this 130nm flash process, with separate I/O supply rails per bank. Estimate dynamic power using Microchip's Libero SmartPower tool with your actual toggle rates rather than worst-case assumptions - FPGAs frequently over-estimate when designed with peak clocks on all blocks. Because the -2 speed grade supports 310 MHz internal clocks, unintentionally high clock trees can dominate the power budget; use clock-gating resources in the fabric to trim this. Always decouple each VCC bank with local bulk and 0.1uF ceramic capacitors.
Do not confuse ordering codes: the G suffix denotes lead-free, the I suffix denotes industrial temperature, and the -2 digit denotes speed grade. Substituting a non-I part in an industrial design or a slower speed grade where timing closure was achieved at -2 will fail. Also remember flash configuration means the device is live at power-up - input signals must not arrive before supply rails stabilize, or use external reset control. Verify substitution candidates against the FindIC/DigiKey cross-reference tables and the Microchip ProASIC3E datasheet before releasing a BOM change.
The 208-BFQFP footprint needs a 0.5mm-pitch land pattern with the exposed dimensions from the Microchip ProASIC3E datasheet package section; allow a small fanout channel under all four sides for escape routing on two signal layers. Provide a solid ground plane directly beneath the device to reference the 147 I/Os, and stitch VCC/ground pairs at the corner power pins. Because PQFP leads are hand-probeable, keep JTAG (TDI/TMS/TCK/TDO) accessible on test points for production programming and boundary-scan testing.
규정 준수 정보
Mouser lists A3PE3000-2PQG208I as LEAD FREE; G suffix in Microchip ordering codes denotes lead-free construction. REACH, halogen-free, and conflict-minerals status not stated in provided data.
