A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip
부품 번호: A3PE3000-PQG208X3 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172 | $1,720.00 |
| 100 | $155 | $15,500.00 |
| 500 | $140 | $70,000.00 |
| 1,000 | $128 | $128,000.00 |
A3PE3000-PQG208X3 개요
A flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration PROM or SRAM cells. In the power-management hierarchy of programmable logic devices, flash FPGAs sit between one-time-programmable antifuse devices and SRAM-based FPGAs, offering reprogrammability with single-chip, Instant-On behavior and inherent security because no external bitstream is exposed at power-up.
Key features of the A3PE3000 include nonvolatile flash programming that eliminates external configuration devices, low power consumption typical of the 130 nm ProASIC3E architecture, and abundant advanced features including support for soft ARM processor cores. The device provides 147 user I/Os in the 208-pin package and 516,096 bits of embedded memory per DigiKey listing data, making it suitable for glueless integration of logic and memory functions.
The ProASIC3E architecture uses Microchip's VersaTile structure, a fine-grained logic tile that can be configured as a combinational cell, sequential element, or distributed memory. Fabrication on a 130 nm flash process yields ASIC-level unit costs at low-to-medium volumes, and the optional soft ARM support enables embedded processing without an external microcontroller.
Typical applications include industrial control and automation, networking and communications equipment, consumer electronics, computing platforms, and avionics systems, where the family datasheet explicitly positions ProASIC3E as a cost-effective ASIC replacement. Instant-On flash configuration also suits power-critical systems that must be functional within microseconds of supply application.
A key design consideration is that the 1.5 V core requires a dedicated low-noise rail, while I/O banks must be planned against the 208-pin PQFP allocation early in the pinout cycle, since PQFP packages limit total I/O and signal-integrity headroom compared with fine-pitch BGA alternatives.
This page synthesizes distributor listing data, drop-in same-package alternatives, pricing tiers, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000-PQG208X3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-PQG208X3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, System Gates, RoHS Status, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1PQG208
✅ 드롭인✓ 재고 있음
$162.9 / 개
데이터시트 보기 →A3PE3000L-PQ208I
✅ 드롭인✓ 재고 있음
$89.75 / 개
데이터시트 보기 →A3PE1500-1PQG208
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE1500-2PQG208
✅ 드롭인✓ 재고 있음
$48 / 개
데이터시트 보기 →M1AFS250-PQG208I
✅ 드롭인✓ 재고 있음
$54.8 / 개
데이터시트 보기 →M1AFS250-2PQG208
✅ 드롭인✓ 재고 있음
$205 / 개
데이터시트 보기 →A3PE3000-PQG208X3 최대 정격 & 전기적 특성
| Family | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 (3M) |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of I/Os (PQG208) | 147 |
| Total Memory Bits | 516096 |
| Configuration Technology | Nonvolatile Flash (Instant-On, single-chip) |
| 패키지 | 208-pin BFQFP (PQG208), 0.5 mm pitch |
| 실장 유형 | Surface Mount |
| Packing Option | Tape and Reel (X3 suffix) |
| Soft ARM Support | Optional (per family datasheet) |
| Reprogrammability | Yes (in-system reprogrammable) |
| Applications Markets | Consumer, networking/communications, computing, avionics |
A3PE3000-PQG208X3 208-pin bfqfp (pqg208), 0.5 mm pitch 핀 구성 가이드
A3PE3000-PQG208X3(208-pin bfqfp (pqg208), 0.5 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-PQG208X3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-PQG208X3 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Networking and Communications Equipment, Avionics and Aerospace Systems, ASIC Prototyping and Low-Volume ASIC Replacement, Consumer Electronics, Computing Platforms and Embedded Processing.
Industrial Control and Automation
The A3PE3000-PQG208X3 fits industrial control because its nonvolatile Instant-On flash configuration brings control logic live within microseconds of power application - no boot delay from an external configuration device, which matters for safety interlocks and motor-drive sequencing. The 3M-gate fabric and 516,096 memory bits integrate multi-axis state machines, communication stacks, and buffering on one chip, while 147 user I/Os in the 208-pin PQFP drive sensors, encoders, and actuators at 3.3V or lower I/O standards. The family datasheet positions ProASIC3E explicitly as a cost-effective ASIC replacement for automation equipment at low-to-medium volumes. Placing the device behind a clean 1.5V core rail with local decoupling keeps switching-noise coupling into I/O banks low; the trade-off versus an SRAM FPGA is fewer hardened peripherals, so timing-critical functions must use the 231 MHz fabric budget.
추천
Networking and Communications Equipment
Line-card glue logic, protocol bridging, and backplane interfacing suit the A3PE3000-PQG208X3: the family datasheet names networking/communications as a core ProASIC3E market. The 231 MHz maximum system frequency supports pipelined packet-processing datapaths, and 516,096 memory bits provide FIFO buffering for rate adaptation between interfaces. Flash-based single-chip configuration eliminates the external boot PROM - an availability and security benefit in always-on network hardware that must resume forwarding instantly after power interruption. With 147 I/Os across I/O banks on the 208-pin PQFP, designers can mix 3.3V, 2.5V, and 1.8V standards for legacy PHY and modern ASIC interfaces; the constraint versus fine-pitch BGA family members (FG324/FGG484) is total signal count, so plan bus widths before locking the pinout in Libero.
추천
Avionics and Aerospace Systems
ProASIC3E flash FPGAs are used in avionics because on-chip flash configuration is inherently more robust than SRAM configuration in radiated environments and removes the external bitstream bus from the attack and upset surface; the family datasheet explicitly lists avionics as a target market. The A3PE3000-PQG208X3's Instant-On behavior suits systems that must be operational during power-transient profiles typical of aircraft electrical systems, and the single-chip solution reduces parts count and associated qualification burden. The 3M gates implement sensor-interface glue logic, ARINC-style bus bridging, and voter/monitor structures around a processor. For flight programs, order industrial-grade suffixes with traceability, verify qualification documentation with Microchip, and budget the 1.5V core rail with fault-tolerant regulation; the 208-pin PQFP's gull-wing leads also simplify inspection for high-reliability solder processes.
추천
ASIC Prototyping and Low-Volume ASIC Replacement
Microchip positions ProASIC3E as a cost-effective ASIC replacement, and the A3PE3000-PQG208X3 serves this role directly: at ASIC-level unit cost with no mask charges, 3M gates absorb gate-array-scale logic that would otherwise justify a full ASIC only at high volume. Nonvolatile flash means the prototype or production board is a single-chip solution - no configuration PROM, no bitstream load time - matching the power-up behavior of the ASIC it replaces. The 130 nm fabric accommodates control-dominated designs, bus interfaces, and moderate datapaths within the 231 MHz envelope and 516,096 memory bits. Migration path is a strength: the same die ships in FG324, FGG484, and FGG896 packages, so a prototype proven on the 208-pin PQFP can move to a higher-I/O package if production requirements grow, preserving design investment in Libero projects and verification collateral.
추천
Consumer Electronics
The family datasheet lists consumer markets among ProASIC3E's targets, and the A3PE3000-PQG208X3 fits cost-sensitive consumer platforms needing flexible glue logic with secure, single-chip configuration - display timing controllers, peripheral bridging, and feature-customization fabric that differentiates product SKUs without new silicon. Flash configuration protects design IP because no external bitstream is readable at boot, and Instant-On behavior matches consumer expectations of immediate functionality. The 130 nm process yields the low unit costs that make reprogrammable fabric viable against hard ASICs at mid volumes, and the 208-pin PQFP is inexpensive to assemble on high-volume lines, with the X3 tape-and-reel packing supporting automated pick-and-place. Designers should budget the 1.5V core regulator into the platform power tree and confirm I/O bank voltages against the specific consumer interface standards used on the 147 available pins.
추천
Computing Platforms and Embedded Processing
For computing hardware, the A3PE3000-PQG208X3 serves as flexible system interconnect and boot/control logic, with optional soft ARM support enabling embedded processing without a separate microcontroller - a feature the family datasheet highlights. The 516,096 memory bits implement scratch RAM and queue structures for data-flow management between a host processor and peripherals, and the 231 MHz fabric keeps interface bridging off the critical path of the host bus. Single-chip flash configuration simplifies platform bring-up: the FPGA is functional immediately at power-on and can even sequence or gate other rails' logic. On a 208-pin PQFP with 147 I/Os, designers typically map a processor bus plus a handful of peripheral interfaces; heavier computing interconnect should step up to the FGG896 package options. Decouple per I/O bank and keep the 1.5V core on a dedicated low-noise regulator for clean timing margins.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-PQG208X3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1PQG208 | A3PE3000L-PQ208I | A3PE1500-1PQG208 | M1AFS250-PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (PQG208) | 208-PQFP (PQG208) - same | 208-PQFP (PQ208) - same footprint | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 1,500,000 | 250,000 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash | 130 nm flash (low-power) | 130 nm flash (low-power) | 130 nm flash | 130 nm flash (Fusion, mixed-signal) |
| Low-Power Variant | No (standard A3PE3000) | Yes (-L process) | Yes (-L process) | No | Low-power Fusion family |
| Configuration | Nonvolatile flash, Instant-On, single-chip | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On |
| Family | ProASIC3E | ProASIC3E (L) | ProASIC3E (L) | ProASIC3E | Fusion |
주요 차별점
- Full 3M-gate density in the PQG208 footprint (vs A3PE1500-1PQG208)
- Standard process for maximum 231 MHz system performance (vs A3PE3000L-1PQG208)
- Pure digital fabric versus mixed-signal Fusion (vs M1AFS250-PQG208I)
설계 노트
Supply the A3PE3000 core from a dedicated 1.5 V low-noise regulator sized for the fabric's dynamic current at 231 MHz operation; do not share the core rail with high-switching-noise loads. I/O bank rails must match the voltage standards assigned per bank in Libero - mixing standards on one rail causes drive-strength violations. Because flash configuration is nonvolatile and Instant-On, there is no configuration current surge at power-up, simplifying supply sequencing versus SRAM FPGAs; still add bulk capacitance at the board entry and 0.1 uF ceramic decoupling at each supply pin pair.
The 208-pin PQFP has 0.5 mm gull-wing leads - specify a solder-mask-defined or non-SMD pad per IPC-recommended PQFP land patterns and inspect with AOI or X-ray for solder bridging on the dense lead rows. Route high-speed buses on inner layers with a solid ground reference to control impedance, and keep stub lengths short on the outer lead exits. Distribute I/O assignments so wide buses stay within a single I/O bank to avoid crossing bank voltage domains; reassigning pins late in a PQFP design is painful due to the two-row leadframe geometry.
Common pitfalls: (1) assuming the -X3 suffix changes silicon - it is a tape-and-reel packing code only; verify the temperature grade from the base order code. (2) Designing to 3M gates without checking routed utilization - flash FPGA routing overhead means achieving above roughly 70-80% utilization at 231 MHz targets requires early timing closure in Libero. (3) Treating A3PE3000L as identical silicon - the -L low-power process trades some speed for static current, so re-run timing after any L-family substitution even on the same footprint.
규정 준수 정보
Compliance data was not present in the provided verified web data; verify RoHS/REACH status on the official Microchip product page for the exact order code before export or automotive/avionics use.
