AM5728BABCXA - Dual Cortex-A15 1.5GHz Sitara MPU | Texas Instruments
부품 번호: AM5728BABCXA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $56.9 | $569.00 |
| 100 | $51.2 | $5,120.00 |
| 500 | $46.8 | $23,400.00 |
| 1,000 | $42.5 | $42,500.00 |
AM5728BABCXA 개요
A microprocessor is a CPU integrated on a single chip that executes instructions and manages data flow in embedded computing systems. The AM5728 is a system-on-chip (SoC) that combines multiple heterogeneous processing cores (ARM and DSP) with memory controllers, peripheral interfaces, and graphics acceleration, forming the computational heart of an embedded system. It sits within the hierarchy: SoC -> microprocessor -> embedded processor -> integrated circuit.
Key features include dual 1.5 GHz ARM Cortex-A15 cores for general-purpose OS workloads, dual C66x DSP cores for math-intensive signal processing, a dual-core PRU-ICSS for deterministic real-time industrial Ethernet protocols, DDR3/DDR3L memory support, HDMI and LCD display interfaces, and Gigabit Ethernet, USB 3.0, PCIe, and SATA connectivity. An integrated video acceleration engine handles H.264 encode/decode for multimedia pipelines.
Architecturally, the AM5728 uses a heterogeneous multicore design supporting asymmetric (AMP) or symmetric (SMP) multiprocessing. ARM cores run Linux or RTOS workloads while DSP cores offload computationally heavy tasks; the PRU-ICSS provides deterministic low-latency I/O, optimizing performance per watt across diverse workloads. The 760-FCBGA (23x23) 0.8 mm-pitch ball grid array supports high gate density with strong signal integrity for high-speed DDR and SerDes interfaces.
Typical applications include industrial PLCs, medical ultrasound systems, human-machine interfaces (HMI), smart grid gateways, and non-safety automotive infotainment - anywhere edge computing requires local processing plus rich connectivity.
When designing with this device, ensure adequate multi-rail power delivery and thermal management, following the TI datasheet power-sequencing and decoupling recommendations for reliable operation across the full -40C to +105C industrial range.
This page synthesizes distributor availability, drop-in alternatives from the AM57x family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: AM5728BABCXA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
AM5728BABCXEA
📋 참조 대체품 (카탈로그에 없음)
AM5729BABCXA
📋 참조 대체품 (카탈로그에 없음)
AM5726BABCXA
📋 참조 대체품 (카탈로그에 없음)
AM5748BABCXA
📋 참조 대체품 (카탈로그에 없음)
AM5749BABCXA
📋 참조 대체품 (카탈로그에 없음)
AM5728BABCXA 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-A15 (dual core) |
| Core Count | 2 |
| Core Architecture | 32-Bit |
| 최대 클록 주파수 | 1.5 GHz |
| Co-Processors / DSP | Dual C66x floating-point DSP |
| Graphics Accelerator | PowerVR SGX544 3D GPU |
| Real-Time Subsystem | Dual-core PRU-ICSS |
| Memory Interface | DDR3 / DDR3L |
| Connectivity | Gigabit Ethernet, USB 3.0, PCIe, SATA |
| Display Interfaces | HDMI, LCD |
| Video Acceleration | H.264 encode/decode engine |
| 동작 온도 | -40C to +105C |
| 패키지 | 760-FCBGA (ABC), 23x23 mm |
| 실장 유형 | Surface Mount (BGA) |
| Product Family | Sitara AM57x |
| Datasheet Length | 415 pages (AM572x datasheet) |
| Supplier Device Package | 760-FCBGA (23x23) |
AM5728BABCXA 760-fcbga (23x23) 핀 구성 가이드
AM5728BABCXA(760-fcbga (23x23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: AM5728BABCXA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
AM5728BABCXA 적합 용도: 6 애플리케이션s: Industrial PLC and Automation Control, Human-Machine Interface (HMI) Panels, Medical Ultrasound and Diagnostics, Smart Grid Gateways, Non-Safety Automotive Infotainment, Edge AI and Machine Vision Inspection.
Industrial PLC and Automation Control
The AM5728BABCXA fits industrial PLCs because its dual-core PRU-ICSS delivers deterministic, low-latency I/O for industrial Ethernet protocols such as EtherCAT and PROFINET, while the dual 1.5 GHz Cortex-A15 cores run the control application on Linux. In a typical PLC design, the ARM cores execute the logic engine and HMI stack, the dual C66x DSPs handle high-speed filtering and motion-control math, and the PRU-ICSS interfaces directly to fieldbus PHYs. The -40C to +105C industrial temperature grade ensures reliable cabinet operation. Unlike single-core MPUs, the heterogeneous architecture isolates real-time traffic from Linux scheduling jitter, improving cycle-time determinism at a competitive price per performance point.
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Human-Machine Interface (HMI) Panels
For HMI panels, the AM5728BABCXA combines the PowerVR SGX544 3D GPU with HDMI and parallel LCD outputs, enabling multi-layer graphical interfaces rendered by Qt or Android on the dual Cortex-A15 cores at 1.5 GHz. The GPU offloads rotation, blending, and vector rendering from the CPU, keeping touch response below perceptible latency even on 10-inch or larger displays. Gigabit Ethernet links the panel to plant networks, and the -40C to +105C rating covers harsh factory-floor enclosures. DDR3L support provides the memory bandwidth needed for smooth animation. Compared with GPU-less AM5726 designs, AM5728 delivers richer graphics at a modest cost premium, while remaining pin-compatible for platform reuse.
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Medical Ultrasound and Diagnostics
Medical ultrasound front ends benefit directly from the AM5728BABCXA's dual C66x floating-point DSPs, which perform beamforming post-processing, filtering, and image reconstruction with high arithmetic throughput, while the Cortex-A15 cores run the user interface, DICOM networking, and record-keeping software. The H.264 video encode engine compresses cine loops and streaming clips locally, and PCIe/Gigabit Ethernet connect to acquisition hardware and hospital networks. The 1.5 GHz dual-core performance supports real-time 2D imaging pipelines without external co-processors. Because medical benches are temperature-controlled, the industrial temperature range adds margin for compact fanless enclosures, and the same 760-FCBGA footprint is shared across the AM57x family for product-tier differentiation.
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Smart Grid Gateways
Smart grid and substation gateways use the AM5728BABCXA to aggregate field protocols and translate them to secure IP backhaul: the PRU-ICSS implements deterministic serial/fieldbus timing, the Cortex-A15 cores run protocol stacks and cybersecurity services, and the C66x DSPs accelerate encryption and power-quality analytics. The -40C to +105C grade covers unconditioned outdoor cabinets, and dual Gigabit Ethernet plus PCIe provide redundant uplinks. SATA enables local event logging to industrial SSDs, while the 23x23 mm FCBGA keeps board area compact. Compared with single-core gateways, the heterogeneous cores separate time-critical packet handling from Linux network processing, sustaining line-rate translation with lower latency jitter across changing grid traffic loads.
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Non-Safety Automotive Infotainment
For non-safety automotive infotainment and cluster-adjacent displays, the AM5728BABCXA provides dual 1.5 GHz Cortex-A15 cores running the infotainment OS, the SGX544 GPU rendering the user interface, and HDMI/LCD outputs driving center-stack screens. The H.264 acceleration handles rear-camera video decoding and media playback, while Gigabit Ethernet (AVB-capable via PRU-ICSS) integrates with in-vehicle networks. The -40C to +105C operating range meets typical cabin electronics requirements. Note that for safety-critical functions an AEC-Q100-qualified processor should be selected instead; the AM5728 targets non-safety informational displays, where its heterogeneous multicore architecture still delivers smooth multimedia and connectivity at industrial-grade silicon cost.
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Edge AI and Machine Vision Inspection
Machine-vision inspection stations use the AM5728BABCXA's dual C66x DSPs to execute classical image pre-processing (filters, thresholding, correlation) at line rate, while the Cortex-A15 cores host inference runtimes and result reporting over Gigabit Ethernet. The PRU-ICSS can time-stamp trigger and strobe signals deterministically, synchronizing camera exposure with illumination - a key requirement for consistent inspection accuracy. H.264 encoding compresses defect footage for traceability archives. Using the pin-compatible AM574x variant instead adds dedicated EVE vision coprocessors for heavier convolution workloads without a PCB respin. The 23x23 mm FCBGA and industrial temperature rating allow compact, fanless camera-adjacent integration in factory environments with wide ambient swings.
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추천 제품 요약
엔지니어링 참조 데이터: AM5728BABCXA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | AM5728BABCXEA | AM5729BABCXA | AM5726BABCXA |
|---|---|---|---|---|
| Package | 760-FCBGA (ABC) 23x23 mm | 760-FCBGA (ABC) 23x23 mm - same | 760-FCBGA (ABC) 23x23 mm - same | 760-FCBGA (ABC) 23x23 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Cortex-A15 Cores / Frequency | 2 cores at 1.5 GHz | 2 cores at 1.5 GHz | 2 cores at 1.5 GHz | 2 cores at 1.5 GHz |
| DSP Cores | Dual C66x | Dual C66x | Dual C66x (extended configuration) | Dual C66x |
| GPU (SGX544) | Yes | Yes | Yes | No (GPU removed) |
| Memory Interface | DDR3 / DDR3L | DDR3 / DDR3L | DDR3 / DDR3L | DDR3 / DDR3L |
| Lifecycle Status | Active | Active | Active | Active |
주요 차별점
- 3D graphics acceleration included (vs AM5726BABCXA)
- Upgradeable to vision acceleration without respin (vs AM5729BABCXA)
- Silicon revision headroom (vs AM5728BABCXEA)
설계 노트
The AM5728BABCXA requires a multi-rail power supply (core, DSP/GPU, memory, and I/O rails). Follow the TI AM572x datasheet power-sequencing recommendations strictly: rails must ramp in the prescribed order and be monitored by the integrated or external supervisor to avoid latch-up or boot failures. Estimated: budget supply design around peak processor load plus DDR3L termination currents; use TI's reference power designs (e.g., TPS65 series PMIC solutions for AM57x) rather than discrete regulators to guarantee sequencing and voltage accuracy across -40C to +105C.
The 760-FCBGA (23x23 mm) package dissipates significant power when both Cortex-A15 cores, DSPs, and GPU run concurrently. Estimated: junction temperature must remain below the datasheet maximum over the -40C to +105C ambient range, so thermal vias under the package, a solid ground plane, and in many cases a heatsink or airflow are required for sustained full-load operation. Run TI's thermal design calculator or the datasheet theta-JA data with your actual workload duty cycle before finalizing enclosure design for fanless industrial products.
DDR3/DDR3L routing on the AM5728 demands length-matched fly-by or tree topology with controlled impedance; follow the TI AM57x hardware design guide for trace length matching windows and reference-plane continuity. Use a dense stack-up (at least 6 layers) with the 0.8 mm-pitch BGA fanout planned via dog-bone vias. Decouple each supply rail per the datasheet decoupling table, placing ceramic capacitors on the underside of the board directly beneath the ball field to minimize loop inductance.
Boot failures on AM5728 designs most often trace to incorrect boot-mode pin strapping or missing power-good sequencing rather than silicon defects. Verify the SYSBOOT configuration pins against your boot media (eMMC, SD, QSPI, or NAND), and confirm the PMIC I2C configuration matches the TI reference design. Also note the 'XA' suffix on AM5728BABCXA denotes TI's standard production flow; do not confuse it with characterization-suffix parts when procuring, and always check the silicon errata sheet against your software's known-issue list.
규정 준수 정보
RoHS compliance and lead-free status per standard TI Sitara FCBGA production flow; explicit REACH, halogen-free, and conflict-minerals declarations were not present in the verified data - confirm on TI.com product page.
