TDA4VE88TGAALZRQ1 - 8 TOPS AI SoC | Texas Instruments
부품 번호: TDA4VE88TGAALZRQ1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $80.36 | $80.36 |
| 10 | $78 | $780.00 |
| 100 | $75 | $7,500.00 |
| 500 | $72 | $36,000.00 |
| 1,000 | $70 | $70,000.00 |
TDA4VE88TGAALZRQ1 개요
What is a System-on-Chip (SoC)? An SoC is a semiconductor device that integrates multiple computing units, including CPU cores, DSPs, GPU, AI accelerators, and memory interfaces, onto a single chip. It is a higher-level integration than a microprocessor, combining system functionality to reduce board complexity. In the automotive domain, SoCs are the central compute hub for ADAS, autonomous driving, and infotainment.
Key features include dual 2 GHz Cortex-A72 cores for application processing, a 1 GHz Cortex-R5F for real-time control, and C66x and C7x DSPs for signal processing. The 8 TOPS AI accelerator enables deep learning inference at the edge, supporting tasks such as object detection and semantic segmentation. The integrated GPU provides 3D rendering capability for surround-view systems.
The SoC uses a heterogeneous architecture to optimize power and performance. The A72 cores handle Linux-based automotive stacks, while the DSPs offload real-time sensor processing. The 770-pin FCBGA (ALZ) package offers excellent thermal performance with a 23x23 mm footprint, enabling dense system integration. The AEC-Q100 qualification ensures reliability across the automotive temperature range.
Typical applications include ADAS domain controllers, autonomous driving systems, surround-view camera processing, radar signal processing, and in-vehicle infotainment. Its 8 TOPS AI is particularly suited for vision-perception systems where real-time object detection is critical.
When designing with this SoC, ensure proper power sequencing using a PMIC like TPS6594-Q1 and adequate thermal management. The high-speed interfaces require careful PCB design with controlled impedance. Refer to TI's Jacinto 7 reference designs for guidance.
드롭인 대체품: TDA4VE88TGAALZRQ1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TDA4VE88TGAALZRQ1 (동일 폼 팩터 및 풋프린트) — 차이점: Core Processor.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TDA4VE88TGAALZR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TDA4VE87TGAALZRQ1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TDA4VE86TGAALZRQ1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TDA4AL88TGAALZRQ1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$74.21 / 개
데이터시트 보기 →TDA4VL88TGAALZRQ1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TDA4VE88TGAALZRQ1 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-A72, ARM Cortex-R5F, C66x, C7x |
| Core Frequency (A72) | 2 GHz |
| Core Frequency (R5F) | 1 GHz |
| Core Frequency (C66x) | 1 GHz |
| AI Accelerator | 8 TOPS |
| Package Type | FCBGA (ALZ) |
| 핀 수 | 770 |
| Package Dimensions | 23x23 mm |
| 동작 온도 범위 | -40°C to 125°C |
| 실장 유형 | Surface Mount |
| Automotive Qualification | AEC-Q100 (Q1) |
| Silicon Revision | 1.0 |
| Datasheet Pages | 251 |
TDA4VE88TGAALZRQ1 23x23 mm 핀 구성 가이드
TDA4VE88TGAALZRQ1(23x23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: TDA4VE88TGAALZRQ1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
TDA4VE88TGAALZRQ1 적합 용도: 6 애플리케이션s: ADAS Vision Perception, Autonomous Driving Domain Controller, In-Vehicle Infotainment (IVI), Surround View Camera System, Radar/Imaging Signal Processing, Industrial Robotics Vision.
ADAS Vision Perception
The TDA4VE88TGAALZRQ1's dual Cortex-A72 and 8 TOPS AI accelerator provide the computational power to process multiple camera feeds in real time. By offloading neural network inference to the C7x and MMA units, it enables object detection and lane tracking with low latency. The integrated GPU supports 3D surround view rendering, crucial for parking assistance systems. Its 770-pin FCBGA package is optimized for dense integration in space-constrained control units.
추천
Autonomous Driving Domain Controller
In a domain controller, the TDA4VE88TGAALZRQ1 handles sensor fusion from radar, LiDAR, and cameras. Its heterogeneous architecture (A72 for high-level, R5F for real-time control, C66x/C7x for DSP) supports safety-critical functions. The 8 TOPS AI capability enables real-time decision-making. Automotive-grade AEC-Q100 qualification ensures reliability in harsh vehicle conditions, while the -40 to 125°C range covers both cold and hot climates.
추천
In-Vehicle Infotainment (IVI)
The dual Cortex-A72 cores provide ample performance for IVI systems, including dashboard clusters, navigation, and multimedia. The GPU accelerates UI rendering, while the C7x DSP can handle audio processing. Its 8 TOPS AI can also support voice assistants. The SoC's power-efficient design and automotive qualification make it suitable for head units with stringent power budgets.
추천
Surround View Camera System
For surround view systems, the TDA4VE88TGAALZRQ1 integrates up to 8 camera inputs via its CSI-2 interface, allowing 360-degree views. The GPU handles fisheye distortion correction and stitching in real time. With 8 TOPS AI, it can also detect pedestrians and obstacles. The 770-pin FCBGA package provides the I/O density needed for multiple cameras, while the -40 to 125°C range ensures operation in all weather.
추천
Radar/Imaging Signal Processing
The C66x DSP and C7x DSP in TDA4VE88TGAALZRQ1 are well-suited for radar signal processing and imaging algorithms. The SoC can handle FFT, beamforming, and object tracking. Its heterogeneous computing architecture reduces CPU load, enabling real-time processing of multiple sensor streams. The automotive-grade design ensures it can be used in radar units for adaptive cruise control and automatic emergency braking.
추천
Industrial Robotics Vision
Though designed for automotive, the TDA4VE88TGAALZRQ1 is also suitable for industrial robotics vision applications. Its 8 TOPS AI and GPU enable object recognition, motion tracking, and quality inspection. The wide operating temperature range and robust package make it reliable in factory environments. Engineers can leverage TI's edge AI tools to deploy neural networks for real-time decision making.
추천
추천 제품 요약
엔지니어링 참조 데이터: TDA4VE88TGAALZRQ1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TDA4AL88TGAALZRQ1 | TDA4VL88TGAALZRQ1 | TDA4VE87TGAALZRQ1 |
|---|---|---|---|---|
| Package | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Architecture | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU (reduced AI) | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU |
| AI Accelerator (TOPS) | 8 | 1 | 8 | 8 |
| A72 Core Frequency | 2 GHz | 2 GHz | 2 GHz | 1.8 GHz |
| Operating Temperature Range | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C |
| Automotive Grade | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) |
주요 차별점
- 8 TOPS AI acceleration (vs TDA4AL88TGAALZRQ1)
- AEC-Q100 qualification (vs TDA4VE88TGAALZR)
- 2 GHz dual A72 cores (vs TDA4VE87TGAALZRQ1)
설계 노트
The TDA4VE88TGAALZRQ1 requires multiple supply rails (core, IO, DDR). Use a PMIC like TPS6594-Q1 for sequencing and monitoring. Ensure all rails meet voltage tolerances to prevent boot failures. Decouple each rail with 10uF and 0.1uF capacitors.
This SoC dissipates significant power due to dual A72 cores and AI acceleration. Use a heatsink and thermal vias under the FCBGA package to maintain junction temperature within -40 to 125°C. Consider airflow in the enclosure.
Route high-speed interfaces (DDR, CSI-2, PCIe) with controlled impedance. Use reference plane and avoid crossing planes to minimize EMI. The 770-pin FCBGA requires fine-pitch soldering - follow TI's layout guidelines.
규정 준수 정보
AEC-Q100 qualification inferred from Q1 suffix. RoHS, REACH, lead-free, halogen-free, and conflict minerals status not extracted from verified data.
