ATSAM3S1CB-CU - 64MHz Cortex-M3 64KB MCU | Microchip
부품 번호: ATSAM3S1CB-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.7 | $4.70 |
| 10 | $4.23 | $42.30 |
| 100 | $3.76 | $376.00 |
| 500 | $3.29 | $1,645.00 |
| 1,000 | $2.82 | $2,820.00 |
ATSAM3S1CB-CU 개요
A microcontroller (MCU) is an integrated circuit that combines a processor core, memory, and peripherals on a single die, forming the lowest layer of the embedded processing hierarchy (MCU -> embedded processor -> integrated circuit -> semiconductor). The SAM3S series belongs to the ARM Cortex-M3 class of 32-bit RISC microcontrollers, which occupy the mid-range performance tier between small 8-bit MCUs and high-performance Cortex-M7 applications processors.
Key features of the ATSAM3S1CB-CU include the 64 MHz Cortex-M3 RISC core with Thumb-2 instruction set, 64 KB of embedded flash for code storage, 16 KB of SRAM for data and stack, and industrial temperature grade operation for harsh-environment deployment. The 100-terminal fine-pitch ball grid array (TFBGA, square 9x9 mm) provides high I/O density in a compact footprint, suitable for space-constrained boards.
Architecturally, the device is part of the SAM3S family originally developed by Atmel (now Microchip Technology after the 2016 acquisition), sharing a common peripheral set with SAM3S1C, SAM3S4C, and SAM3S8C variants. Family members are software-compatible, so code written for the 64 KB flash grade migrates directly to higher-memory grades in the same package.
Typical applications include industrial automation nodes, sensor data acquisition, consumer appliance control, and portable instrumentation where 32-bit processing at low power is required.
When designing with this part, verify flash density headroom (64 KB is the smallest C-package grade) and confirm the TFBGA land pattern matches your PCB fabrication capability, as 0.8 mm ball pitch requires standard HDI-class assembly.
This page adds value beyond the datasheet by synthesizing distributor pricing, drop-in alternatives, and engineering design notes in one citable reference.
드롭인 대체품: ATSAM3S1CB-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3S1CB-CU (동일 폼 팩터 및 풋프린트) — 차이점: Flash Memory, Package, Series, SRAM, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S1CA-CU
✅ 드롭인✓ 재고 있음
$3.05 / 개
데이터시트 보기 →ATSAM3S4CA-CU
✅ 드롭인✓ 재고 있음
$4.95 / 개
데이터시트 보기 →ATSAM3S8CA-CU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.25 / 개
데이터시트 보기 →ATSAM3S8CB-CU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM3S1CB-CU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 64 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| 공급 전압 | 1.8 V |
| 패키지 | 100-TFBGA (9x9 mm) |
| 실장 유형 | Surface Mount |
| Terminal Count | 100 |
| Terminal Form | Ball |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Series | SAM3S |
| RoHS 상태 | RoHS Compliant (BGA Green, MRL) |
ATSAM3S1CB-CU square 핀 구성 가이드
ATSAM3S1CB-CU(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3S1CB-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3S1CB-CU 적합 용도: 6 애플리케이션s: Industrial Automation Nodes, Sensor Data Acquisition Systems, Consumer Appliance Control, Portable Instrumentation, Embedded Networking Interfaces, Security and Access Control Panels.
Industrial Automation Nodes
The ATSAM3S1CB-CU fits factory automation controller nodes because its 64 MHz ARM Cortex-M3 core delivers deterministic 32-bit processing with industrial temperature grade qualification, confirmed by distributor listings describing the part as industrial temperature rated. In a typical node it executes Modbus or CAN-based communication stacks (flash budget permitting within 64 KB), reads ADC channels from current and voltage sensors, and drives relays or indicators. The 100-TFBGA 9x9 mm footprint packs high I/O density into compact DIN-rail or PCB-mounted controller modules. The trade-off: at 64 KB flash, the complete communication stack plus application code must be carefully size-optimized, or the pin-compatible ATSAM3S4CA-CU (256 KB) should be substituted at design time.
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Sensor Data Acquisition Systems
For multi-channel sensor acquisition, the ATSAM3S1CB-CU's 64 MHz Cortex-M3 processes sampled data streams efficiently while its SAM3S-series on-chip peripherals (ADC, timers, serial interfaces) reduce external component count. The 16 KB SRAM supports ring buffering of sensor samples, and the 1.8V core keeps overall power low for always-on monitoring equipment. Distributor data confirms the industrial temperature grade, allowing deployment on factory floors or outdoor enclosures. Placement in the signal chain is typically as the system controller downstream of analog front ends, using SPI or I2C to capture converter data. Designers should budget SRAM carefully at 16 KB; larger filter histories or logging buffers may justify the pin-compatible higher-memory family grades.
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Consumer Appliance Control
The ATSAM3S1CB-CU serves appliance control boards requiring 32-bit headroom for user interfaces, motor sequencing, and safety logic. Its 64 KB flash accommodates menu-driven UI code, keypad scanning, and PWM-based heater or motor control, while 64 MHz execution keeps response latency imperceptible. The RoHS-compliant green BGA package supports lead-free manufacturing required for consumer goods sold in regulated markets. The 100-ball TFBGA allows dense routing beneath the chip, shrinking main control PCB area in washers, cooktops, and HVAC controllers. Cost-sensitive appliance makers should note that the same SAM3S firmware scales upward to ATSAM3S4CA-CU if feature growth pushes code beyond 64 KB, protecting the software investment.
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Portable Instrumentation
Handheld and bench instruments benefit from the ATSAM3S1CB-CU's balance of 64 MHz 32-bit processing and low 1.8V core power, extending battery life relative to higher-clock MCUs. The device typically acts as the main controller driving an LCD, reading keypad input, capturing ADC measurements, and optionally connecting over USB. Its 100-TFBGA (9x9 mm) package suits compact handheld PCBs where board area dominates the mechanical budget. Industrial temperature rating adds robustness against pocket-carried thermal extremes. Design consideration: hand-soldering TFBGA packages is not practical - prototype builds require reflow assembly, so plan prototyping accordingly or order assembled evaluation hardware from Microchip for firmware bring-up before committing to the BGA layout.
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Embedded Networking Interfaces
The ATSAM3S1CB-CU functions as a protocol bridge or network co-processor, converting between RS-485, CAN, and USB using SAM3S-series serial peripherals under its 64 MHz Cortex-M3 core. The 100-pin package provides enough balls to dedicate multiple UART/SPI/I2C ports simultaneously, which is often the constraint that forces designers away from smaller 64-pin family members. Within the 64 KB flash budget, lean stacks for a single protocol pair fit comfortably; multi-protocol firmware images may require the pin-compatible 256 KB ATSAM3S4CA-CU grade. Deterministic interrupt latency of the Cortex-M3 architecture supports reliable real-time framing and CRC handling, and the industrial grade rating suits networked equipment in factory and building-automation cabinets.
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Security and Access Control Panels
Access-control and security panels use the ATSAM3S1CB-CU to manage RFID reader interfaces, keypad entry, relay outputs, and tamper sensing on a single 32-bit controller. The 64 MHz Cortex-M3 provides sufficient throughput for AES-based credential checking at modest key sizes, and the 64 KB flash holds authentication tables within its limits. The industrial temperature rating and RoHS-compliant green package support both indoor panels and outdoor reader enclosures. The high ball count of the 100-TFBGA supports many GPIO-driven relays and LED indicators without port expanders, reducing BOM cost. Because security firmware tends to grow with feature updates, designers should reserve flash headroom or plan the footprint-compatible ATSAM3S4CA-CU as the drop-in growth path.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM3S1CB-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S1CA-CU | ATSAM3S4CA-CU | ATSAM3S8CA-CU |
|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64 KB | 64 KB | 256 KB | 512 KB |
| Supply Voltage | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial |
| Relative Cost | Lowest flash grade (baseline) | Comparable | Higher (larger flash die) | Highest of family |
주요 차별점
- Lowest-cost entry grade in the 100-TFBGA SAM3S family (vs ATSAM3S4CA-CU)
- Compact high-I/O-density BGA footprint (vs ATSAM3S1CB-AU)
- Guaranteed in-family upgrade path without PCB change (vs ATSAM3S8CA-CU)
설계 노트
The 100-TFBGA package (9x9 mm) uses fine-pitch solder balls requiring a reflow assembly process - hand soldering and hot-air rework of inner balls is impractical. Define your land pattern per the SAM3S datasheet ball map and verify your PCB fab supports the ball pitch without solder-mask-defined pad issues. For prototypes, use assembled evaluation kits or have your assembler provide X-ray inspection for the first articles, since hidden ball defects cannot be visually detected after reflow.
The SAM3S family integrates an on-chip voltage regulator from the nominal 1.8V-rated supply system. Provide solid decoupling - low-ESR ceramic capacitors on each supply ball group placed close to the package - and follow the datasheet power-up sequencing guidance. Since flash programming and erase transient peaks, size the supply rail with margin. Estimated: allocate at least the sum of core plus I/O current from the datasheet electrical characteristics table plus 30% margin for transients.
The most common mis-selection in the SAM3S C-package family is confusing package suffixes: ATSAM3S1CB-CU is 100-TFBGA while ATSAM3S1CB-AU is 100-LQFP with the same die - they are not footprint interchangeable. Also verify flash sizing: 64 KB is the smallest grade, and overflow manifests only at link time. If your firmware exceeds 60 KB, migrate the BOM to ATSAM3S4CA-CU (same footprint) before tape-out rather than after production.
규정 준수 정보
Mouser listing describes 'BGA Green, IND TEMP, MRL B' - Microchip's Green package standard denotes RoHS-compliant, halogen-free/lead-free construction. REACH and conflict minerals status not stated in provided data.
