ATSAM3S2CA-CUR - 64MHz Cortex-M3 MCU 128KB Flash | Microchip
부품 번호: ATSAM3S2CA-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.01 | $6.01 |
| 10 | $5.71 | $57.10 |
| 100 | $5.41 | $541.00 |
| 500 | $5.14 | $2,570.00 |
| 1,000 | $4.89 | $4,890.00 |
ATSAM3S2CA-CUR 개요
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die, sitting at the center of the embedded-system hierarchy: MCU -> embedded processor -> semiconductor device. The SAM3S family from Microchip (originally Atmel) belongs to the 32-bit ARM Cortex-M class of flash microcontrollers, which are widely used where deterministic, energy-efficient control is required.
Key features include a 1.62V to 3.6V supply range supporting both 1.8V and 3.3V rails, operation from -40C to +85C for industrial environments, and a rich peripheral set: 12-bit ADC, 12-bit DAC, UART, USART, TWI (I2C), SPI, SSC, I2S, HSMCI, IrDA, and USB Device. The 79 programmable I/O lines give designers substantial expansion flexibility in a compact 9x9 mm ball grid array.
Technically, the Cortex-M3 core implements the ARMv7-M architecture with a 3-stage pipeline and Thumb-2 instruction set, delivering approximately 1.25 DMIPS/MHz. Flash acceleration logic allows full-speed 64MHz execution from embedded flash without wait-state penalties for most code. CMOS process technology keeps active power low, while the SAM3S power-management controller offers multiple sleep and wait modes for battery-conscious designs.
Typical applications include consumer and industrial devices with TFT LCD or segmented displays, battery-powered portable instruments, USB-connected data loggers, and motor or sensor control nodes. The generous peripheral mix makes the SAM3S2 a single-chip solution that avoids external bridge ICs.
A key design consideration: the 100-TFBGA package demands careful PCB stackup; plan for via-in-pad or dogbone fanout and follow the Microchip SAM3S hardware design guidelines for decoupling all VDDIO/VDDCORE ball pairs.
This page adds value beyond the manufacturer datasheet by consolidating distributor pricing, drop-in family alternatives, and practical design notes in one structured reference.
드롭인 대체품: ATSAM3S2CA-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3S2CA-CUR (동일 폼 팩터 및 풋프린트) — 차이점: SRAM, Core Processor, Mounting Type, Package, Supply Voltage Range.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S2CA-CU
✅ 드롭인✓ 재고 있음
$3.6 / 개
데이터시트 보기 →ATSAM3S4CA-CUR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3S8CA-CUR
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →ATSAM3S2CA-AUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →ATSAM3S2CA-CUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 (32-bit) |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 64 MHz |
| Flash Program Memory | 128 KB (128K x 8) |
| SRAM | 32 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Supply Voltage (Typical) | 1.8 V / 3.3 V |
| 동작 온도 | -40C to +85C |
| 패키지 | 100-TFBGA (9x9 mm) |
| Number of I/O | 79 |
| ADC Resolution | 10-bit / 12-bit |
| DAC Resolution | 12-bit |
| Connectivity | HSMCI, I2C, I2S, IrDA, SPI, SSC, TWI, UART, USART, USB |
| 실장 유형 | Surface Mount |
| Core Speed (DMIPS) | ~1.25 DMIPS/MHz (ARM Cortex-M3) |
| Technology | CMOS |
| RoHS 상태 | Compliant (per JLCPCB listing) |
ATSAM3S2CA-CUR 100-tfbga (9x9 mm) 핀 구성 가이드
ATSAM3S2CA-CUR(100-tfbga (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3S2CA-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3S2CA-CUR 적합 용도: 6 애플리케이션s: Consumer TFT and Segmented Display Products, USB Data Loggers and PC-Connected Instruments, Battery-Powered Portable Measurement Devices, Industrial Control and Sensor Nodes, Audio and Voice Peripheral Systems, IoT Edge Nodes and Smart Home Devices.
Consumer TFT and Segmented Display Products
Microchip positions the SAM3S family explicitly for consumer and industrial products with TFT or segmented displays, and the ATSAM3S2CA-CUR fits this role with its 64MHz Cortex-M3 core, 128KB flash, and rich display-oriented peripherals. The EBI/SMC external bus and parallel interface drive segment LCD controllers, while HSMCI handles removable storage for graphics assets. With 79 I/O lines and 1.62V-3.6V operation, a single chip can drive the panel, touch keys, and USB link to a host. The compact 9x9 mm TFBGA-100 saves board area versus LQFP alternatives, and the -40C to +85C range covers non-climate-controlled consumer environments.
추천
USB Data Loggers and PC-Connected Instruments
The integrated USB Device 2.0 full-speed peripheral plus HSMCI for SD/microSD cards makes the ATSAM3S2CA-CUR a natural single-chip data logger. Firmware can enumerate as CDC or MSC while the 12-bit ADC samples sensor channels and writes to card storage, using the 32KB SRAM as a double-buffered FIFO between the analog front end and the card interface. The 64MHz core sustains sustained throughput without DMA starvation, and the SSC/I2S ports capture external codecs when audio-grade logging is required. Operating from 1.62V-3.6V allows direct powering from the USB VBUS through a 3.3V regulator, simplifying portable designs.
추천
Battery-Powered Portable Measurement Devices
For handheld meters and portable instruments, the ATSAM3S2CA-CUR combines a 1.62V-3.6V supply window with the SAM3S power-management controller's sleep and wait modes, letting the device spend most of its life in low-current standby between measurement bursts. The 12-bit ADC and 12-bit DAC support sensor excitation and measurement in one chip, while TWI and SPI interfaces connect precision front ends. At 64MHz the core completes DSP-style averaging quickly and returns to sleep, maximizing battery life. The -40C to +85C industrial range plus RoHS-compliant green TFBGA-100 package suits rugged handheld form factors with dense double-sided PCBs.
추천
Industrial Control and Sensor Nodes
The -40C to +85C operating range, wide 1.62V-3.6V supply tolerance, and standard industrial buses (UART, USART, TWI/I2C, SPI, SSC) make the ATSAM3S2CA-CUR a solid industrial sensor and control node. USART with IrDA support and the SSC enable legacy field wiring, while TWI connects multiple slave sensors on one bus. The 79 GPIOs drive relays, indicators, and discrete inputs directly through appropriate buffers, reducing external logic. Firmware with 128KB flash accommodates MODBUS-style stacks and OTA field-update code with room to spare, and the BGA package's short bond wires support cleaner signal integrity on noisy factory floors than longer-lead packages.
추천
Audio and Voice Peripheral Systems
The ATSAM3S2CA-CUR integrates an I2S/SSC serial audio interface and a 12-bit DAC, enabling compact voice-record and audio-playback subsystems without an external codec controller. The 64MHz Cortex-M3 runs G.711-class codecs and sample-rate conversion in software while SSC streams I2S data to an external codec or class-D amplifier. The 12-bit DAC can output alerts and simple tones directly, and the HSMCI reads compressed audio from SD media for standalone players. With 32KB SRAM, buffering for full-speed USB audio is achievable at moderate sample rates, and the 3.3V rail simplifies codec power tree design.
추천
IoT Edge Nodes and Smart Home Devices
Smart-home and IoT edge products benefit from the ATSAM3S2CA-CUR's balance of performance and integration: the 64MHz Cortex-M3 handles protocol stacks over USART/SPI-connected radio modules, the 12-bit ADC reads environmental sensors, and USB enables commissioning via a PC. The 1.62V-3.6V supply range tolerates battery sag, and power-management modes keep average consumption low for always-on sensing. 128KB flash stores both the application and an update bootloader for secure field upgrades over USB or radio. The 9x9 mm TFBGA-100 footprint keeps node PCBs compact for wall switches, plugs, and sensor pucks where enclosure volume is constrained.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM3S2CA-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S2CA-CU | ATSAM3S4CA-CUR | ATSAM3S8CA-CUR | ATSAM3S2CA-AUR |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 128 KB | 128 KB | 256 KB | 512 KB | 128 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C (verify grade suffix per datasheet) |
| Packaging Delivery | Tape & Reel (R suffix) | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
주요 차별점
- Lowest-memory (lowest-cost) TFBGA-100 member of the SAM3S family (vs ATSAM3S4CA-CUR)
- Same-footprint upgrade path to 512KB (vs ATSAM3S8CA-CUR)
- Tape-and-reel delivery for automated assembly (vs ATSAM3S2CA-CU)
설계 노트
The 100-TFBGA (9x9 mm) package uses a fine-pitch ball grid requiring a planned fanout strategy. Use either via-in-pad with fill or dogbone escapes with 0.1-0.12 mm via lasers depending on fab capability, and define the land pattern per the Microchip SAM3S datasheet mechanical drawing. Decouple every VDDIO and VDDCORE ball pair with 100nF ceramic capacitors placed on the opposite board side directly under the die, plus bulk 10uF at the supply entry. Verify ball A1 polarity marker orientation against the datasheet before releasing the footprint.
The ATSAM3S2CA-CUR runs from a single 1.62V-3.6V rail, but the SAM3S power architecture separates VDDCORE and VDDIO domains; follow the SAM3S hardware design guidelines for the VDDCORE/VDDPLL connection scheme and any required sequencing. When powered from USB VBUS (5V), regulate to 3.3V with an LDO rated for at least the MCU plus peripheral load. Budget active current per the datasheet current-consumption tables at your target clock, and exploit the power-management controller sleep modes for duty-cycled battery designs - disable unused peripheral clocks in the PMC to cut run-mode current.
Three frequent mistakes on SAM3S designs: (1) floating unused GPIOs - configure them as grounded inputs or outputs-low to avoid erratic current and EMI susceptibility; (2) omitting the NRSTB pull-up and reset RC network, causing unreliable in-circuit programming; (3) programming the flash while VDDCORE is below the datasheet minimum, corrupting flash cells. Also confirm the exact ordering-code suffix when purchasing: the 'R' in ATSAM3S2CA-CUR denotes tape-and-reel delivery while 'CU' is tray - electrically identical but packaged differently.
규정 준수 정보
RoHS compliant per JLCPCB listing; Mouser identifies the part as 'BGA GREEN IND' (green molding compound, industrial temperature). REACH and conflict-minerals declarations not found in provided data - request formal certificates from Microchip.
