ATSAM3U1EA-CU - 96MHz ARM Cortex-M3 64KB Flash MCU
부품 번호: ATSAM3U1EA-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ATSAM3U1EA-CU 개요
A microcontroller is a programmable semiconductor that integrates a processor core, memory, and peripherals into one device. The ATSAM3U1EA-CU follows the hierarchy ARM Cortex-M3 core → 32-bit RISC microcontroller → embedded microcontroller → semiconductor. Its compact BGA package supports dense PCB layouts, while the 96 MHz operating speed provides a practical balance between processing performance, power consumption, and design complexity for control-oriented embedded systems.
Key features include a 96 MHz ARM Cortex-M3 processor, 64 KB Flash, 20 KB SRAM, DMA, PWM, watchdog timer, I2S, and high-speed USB device support with an embedded transceiver. The verified component description also identifies high-speed MCI support for SDIO, SD, and MMC interfaces, along with two 10-bit and two 12-bit ADC groups. These peripherals reduce the need for external interface devices and make the MCU suitable for connected industrial, communications, and data-acquisition equipment.
The SAM3U architecture combines a 32-bit RISC processor with dedicated hardware peripherals for data movement and real-time control. DMA improves peripheral throughput by transferring data with less CPU intervention, while PWM and watchdog functions support deterministic timing and system monitoring. The 144-BGA package exposes the high peripheral count in a compact 13 mm by 13 mm footprint, but BGA layout requires careful escape routing, thermal-via planning, and assembly inspection.
Typical applications include USB-connected control systems, industrial data loggers, SD-card or MMC data storage, motor and power-control platforms, audio interfaces using I2S, and embedded communications equipment. The 64 KB Flash capacity is appropriate for firmware that integrates control logic, USB firmware, and peripheral drivers without requiring an external memory device.
Design consideration: the 144-BGA package and 1.62 V to 3.6 V supply range require careful decoupling, controlled-layout routing, and validation of signal integrity at the 96 MHz operating speed. Confirm pin assignments and BGA escape-routing requirements against the manufacturer datasheet before releasing a PCB design.
This page consolidates the verified distributor specifications, practical application guidance, and replacement considerations for ATSAM3U1EA-CU, while clearly separating unavailable data from confirmed manufacturer information.
드롭인 대체품: ATSAM3U1EA-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3U1EA-CU (동일 폼 팩터 및 풋프린트) — 차이점: Package, Memory Protection Unit, USB, Instruction Set, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3U1EB-CU
✅ 드롭인✓ 재고 있음
$4.59 / 개
데이터시트 보기 →ATSAM3U1EA-CU
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →ATSAM3U2EA-CU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3U4EA-CU
✅ 드롭인✓ 재고 있음
$12.05 / 개
데이터시트 보기 →ATSAM3U1EACU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3U1EA-CU 최대 정격 & 전기적 특성
| Processor Core | ARM Cortex-M3, 32-bit RISC |
| Maximum Operating Frequency | 96 MHz |
| Embedded Flash Memory | 64 KB |
| SRAM | 20 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| 패키지 | 144-BGA (13x13) |
| Package Type | Surface-mount LFBGA |
| 동작 온도 범위 | -40°C to +85°C |
| USB | High-speed USB device port with embedded transceiver |
| Memory Card Interface | High-speed MCI for SDIO, SD, and MMC |
| DMA | Supported |
| PWM | Supported |
| Watchdog Timer | Supported |
| I2S | Supported |
| ADC | Two 10-bit and two 12-bit ADC groups |
| Instruction Set | Thumb-2 instruction set |
| Memory Protection Unit | MPU |
ATSAM3U1EA-CU surface-mount lfbga 핀 구성 가이드
ATSAM3U1EA-CU(surface-mount lfbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3U1EA-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3U1EA-CU 적합 용도: 6 애플리케이션s: USB Embedded Control, Industrial Data Logging, SD or MMC Data Storage, Audio Interface and I2S Control, Motor and PWM Control, USB Audio and Communication Equipment.
USB Embedded Control
ATSAM3U1EA-CU fits USB-connected control products because its verified feature set includes a high-speed USB device port with an embedded transceiver, while the ARM Cortex-M3 core operates at up to 96 MHz. The MCU can execute device firmware, manage control states, and exchange data with a host without adding a separate USB controller. Its 64 KB Flash and 20 KB SRAM provide a defined firmware and working-memory budget for compact peripherals, gateways, and service tools. The design must still budget USB routing, power-supply noise, firmware stack requirements, and connector protection before production release.
추천
Industrial Data Logging
ATSAM3U1EA-CU is suitable for industrial data-logging equipment that must acquire sensor data and retain it locally. Its verified ADC resources include two 10-bit and two 12-bit ADC groups, while DMA can move captured data with less processor intervention. The 96 MHz Cortex-M3 core supports formatting, timestamping, and communication tasks, and the 64 KB Flash can hold firmware when the application does not exceed that budget. A robust design should add memory-card storage through the verified high-speed MCI interface and validate analog input conditioning and industrial temperature requirements from -40°C to +85°C.
추천
SD or MMC Data Storage
ATSAM3U1EA-CU is a practical fit for products that need removable or embedded SD, SDIO, or MMC storage. The verified SAM3U description identifies a high-speed MCI peripheral for those media, while the 96 MHz processor can service file-system activity and control logic. The 20 KB SRAM helps buffer transfers, although sustained logging and complex file systems may require careful DMA and buffer planning. Designers should check the exact MCI pin mapping, electrical levels, card support, and timing constraints in the manufacturer documentation; the package and memory figures alone do not guarantee application compatibility.
추천
Audio Interface and I2S Control
ATSAM3U1EA-CU can serve compact audio-control and interface equipment because I2S is included in the verified peripheral set. The 96 MHz Cortex-M3 core is sufficient for protocol handling and control tasks, while DMA can support repetitive audio transfers with reduced CPU loading. The device is not an audio DAC by itself, so an external converter, amplifier, and protection network may be required. Firmware must establish correct I2S timing, clock configuration, buffer management, and fault recovery, and the 64 KB Flash limit should be checked against any required codec and USB firmware stack.
추천
Motor and PWM Control
ATSAM3U1EA-CU is suitable for embedded motor-control and actuator platforms that benefit from a 96 MHz Cortex-M3 core and integrated PWM, DMA, and watchdog resources. PWM channels can generate deterministic control signals, DMA can exchange data with external peripherals, and the watchdog supports system recovery. The MCU is a controller, not a power stage, so MOSFETs, gate drivers, current sensing, and protection must be added according to the motor voltage and current. The 1.62 V to 3.6 V supply range and -40°C to +85°C operating specification should be checked against the actuator environment.
추천
USB Audio and Communication Equipment
ATSAM3U1EA-CU can support USB-connected communication and service equipment because the verified feature set combines high-speed USB, UART-class serial control capability within the MCU family, DMA, and I2S. This combination can serve as the basis for configuration tools, audio accessories, and protocol bridges, although the exact peripheral assignments must be verified against the datasheet. At 96 MHz, the processor provides headroom for protocol stacks and buffering, while 20 KB SRAM constrains simultaneous buffers. Designers should budget USB descriptor storage, class-driver memory, firmware update space, and connector ESD protection before selecting the device.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM3U1EA-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3U1EB-CU | ATSAM3U2EA-CU | ATSAM3U4EA-CU | ATSAM3U1EACU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
주요 차별점
- Verified 96 MHz ARM Cortex-M3 performance configuration (vs ATSAM3U1EB-CU)
- High-speed USB and memory-card integration (vs ATSAM3U2EA-CU)
- Memory footprint balance (vs ATSAM3U2EA-CU)
- Compact 144-BGA integration (vs ATSAM3U4EA-CU)
설계 노트
Treat the 144-BGA footprint as a high-density routing constraint. Plan escape vias and layer transitions before placing the MCU, keep power and ground connections short, and preserve symmetric signal paths where possible. Because the verified data does not provide exact ball-map or recommended-land-pattern dimensions, use the current manufacturer package drawing and assembly land pattern as the controlling PCB source.
Design the supply network for the verified 1.62 V to 3.6 V operating range and validate startup, load transients, and noise margins. Place the required decoupling structures close to the MCU power balls, keep analog and digital return paths controlled, and verify the regulator's stability requirements against the actual load and capacitor selection. The available data does not specify exact capacitor values, so those values must come from the manufacturer reference design.
At 96 MHz, route clocks, USB, MCI, and other high-speed signals with continuous return paths and controlled impedance. Avoid routing sensitive signals through power or split-plane regions, and use the package's available escape layers consistently. Check USB and memory-card timing margins with the actual external device, connector, and PCB stack-up rather than relying only on nominal MCU frequency.
Do not substitute ATSAM3U1EB-CU, ATSAM3U2EA-CU, or ATSAM3U4EA-CU solely because the comparison pages show a 144-BGA family association. Compare every power ball, ground ball, USB connection, MCI connection, analog input, clock, reset, and exposed signal before approving a substitution. The supplied data does not provide complete pin-level compatibility for these candidates.
The verified operating-temperature range is -40°C to +85°C, but the supplied material does not provide junction-temperature limits, thermal resistance, or package dissipation curves. Use the manufacturer thermal data to estimate self-heating under the actual clock, I/O, and peripheral load. Keep the BGA thermal and ground-via arrangement consistent with the package drawing and validate junction temperature rather than relying on ambient temperature alone.
규정 준수 정보
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for ATSAM3U1EA-CU. AEC-Q100 is marked not_applicable because no automotive qualification is identified in the provided material.
