ATSAM4E8EB-CN - 120MHz Cortex-M4 MCU 512KB Flash | Microchip
부품 번호: ATSAM4E8EB-CN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.9 | $12.90 |
| 10 | $11.61 | $116.10 |
| 100 | $10.32 | $1,032.00 |
| 500 | $9.35 | $4,675.00 |
| 1,000 | $8.51 | $8,510.00 |
ATSAM4E8EB-CN 개요
A microcontroller unit (MCU) is a single-chip embedded computer that integrates a processor core, memory, and programmable peripherals on one die, sitting within the broader hierarchy of semiconductor devices: Cortex-M4 core -> ARM 32-bit MCU -> microcontroller -> embedded processor. The SAM4E series belongs to Atmel (now Microchip) SMART ARM-based Flash MCU family, designed for connectivity-centric embedded systems.
Key features include the high-performance Cortex-M4 core with hardware floating point unit (FPU), 2KB instruction cache for improved flash execution efficiency, and 128KB of SRAM for data buffering. The SAM4E family integrates advanced connectivity peripherals, most notably a 10/100 Ethernet MAC, alongside UART, USART, SPI, I2C (TWI) and CAN interfaces, plus a 12-bit ADC and PWM channels for control tasks. The device operates from 1.2V, 2.5V, and 3.3V supply domains per the Arrow listing, with extended temperature support per Mouser data.
Technically, the SAM4E achieves 1.25 DMIPS/MHz from the Cortex-M4 pipeline, and the 2KB cache allows zero-wait-state execution from Flash at 120 MHz, mitigating flash access latency. The Ethernet MAC with DMA offloads network stack processing from the CPU, making it well suited for connected industrial nodes.
Typical applications include industrial Ethernet gateways, building automation and HVAC controllers, networked sensor nodes, and motor-control systems where the FPU accelerates control-loop math.
Design consideration: BGA packages require controlled-impedance PCB stackups and X-ray inspection capability; plan the fanout strategy early and consider the LQFP-packaged SAM4E8EA sibling if BGA assembly is not available.
This page synthesizes distributor availability, drop-in family alternatives, pricing tiers, and practical design notes not found in the manufacturer datasheet. Pricing shown as of 2026-09-20.
드롭인 대체품: ATSAM4E8EB-CN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4E8EB-CN (동일 폼 팩터 및 풋프린트) — 차이점: Flash Memory, Package, Core Processor, Packaging, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4E16EB-CN
✅ 드롭인✓ 재고 있음
$6.05 / 개
데이터시트 보기 →ATSAM4E8EB-CNR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM4E8EB-CN 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 with FPU |
| Core Size | 32-bit |
| 최대 클록 주파수 | 120 MHz |
| Flash Memory | 512KB (512K x 8) |
| SRAM | 128KB |
| Cache | 2KB |
| Series | SAM4E |
| 공급 전압 | 1.2V / 2.5V / 3.3V |
| 패키지 | 144-LFBGA (10x10 mm) |
| 실장 유형 | Surface Mount |
| Temperature Grade | Extended (EXT TEMP) |
| Ethernet | 10/100 Ethernet MAC |
| Connectivity Peripherals | UART, USART, SPI, TWI (I2C), CAN |
| Package Color / MSL | Green package, MRL B |
| Packaging | Tray |
ATSAM4E8EB-CN green package, mrl b 핀 구성 가이드
ATSAM4E8EB-CN(green package, mrl b 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4E8EB-CN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4E8EB-CN 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateways, Building Automation Controllers, Networked Sensor Nodes, Motor Control Systems, Medical and Lab Instrumentation, Consumer and IoT Connected Devices.
Industrial Ethernet Gateways
The ATSAM4E8EB-CN fits industrial Ethernet gateway designs because its integrated 10/100 Ethernet MAC with DMA offloads frame handling from the 120 MHz Cortex-M4 core, while 512KB Flash stores protocol stacks such as Modbus TCP or PROFINET wrappers. The FPU accelerates protocol-layer math and data conversion. In a typical topology the MCU connects over RMII to an external PHY and bridges field buses via its CAN and USART peripherals. The trade-off versus a higher-integration SoC is lower power and simpler certification, at the cost of needing an external PHY.
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Building Automation Controllers
Building automation and HVAC controllers benefit from the ATSAM4E8EB-CN's combination of Ethernet connectivity, CAN interfaces, and 128KB SRAM for network buffering. The 120 MHz Cortex-M4 with FPU executes PID control loops for damper and valve actuation while the Ethernet MAC reports to BMS supervisory systems. Extended temperature rating (EXT TEMP per Mouser data) suits rooftop and mechanical-room environments. The 144-LFBGA package keeps board area under 10x10 mm of die footprint, allowing compact controller PCBs; designers must budget for BGA assembly capability in production.
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Networked Sensor Nodes
Distributed sensing systems use the ATSAM4E8EB-CN to aggregate analog and digital sensor data and stream it over Ethernet. The 12-bit ADC samples process variables while 128KB SRAM buffers burst data, and the 512KB Flash stores both the application and a lightweight TCP/IP stack. The 2KB cache sustains zero-wait-state execution at 120 MHz from Flash, improving real-time sampling determinism. Power-sensitive battery nodes should instead consider SAM L or SAM D families; this part is optimal for line-powered nodes where Ethernet cabling already exists.
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Motor Control Systems
The Cortex-M4 FPU in the ATSAM4E8EB-CN executes field-oriented control (FOC) math in floating point at 120 MHz, enabling sensorless PMSM and BLDC drives without fixed-point conversion effort. PWM peripherals generate complementary outputs with dead-time for three-phase inverters, and the ADC synchronizes current sampling to PWM cycles. Ethernet allows drive integration into Industry 4.0 monitoring networks. Designers should verify ADC trigger and PWM peripheral allocation in the SAM4E datasheet against their modulation scheme, as peripheral channel counts determine achievable control-loop rates.
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Medical and Lab Instrumentation
Benchtop lab instruments and networked medical devices use the ATSAM4E8EB-CN for its deterministic 120 MHz real-time core, FPU-accelerated signal processing, and Ethernet port for data upload to LIS/HIS systems. The 512KB Flash accommodates measurement algorithms plus a full UI, while 128KB SRAM holds waveform buffers. The 12-bit ADC front-end suits moderate-accuracy acquisition; higher-resolution measurements typically add an external delta-sigma ADC over SPI. Extended temperature tolerance also supports sterilization-adjacent enclosures, and the BGA package keeps the main board compact.
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Consumer and IoT Connected Devices
Smart appliances, networked audio accessories, and IoT hubs leverage the ATSAM4E8EB-CN when wired Ethernet is preferred over wireless for reliability. The 3.3V supply rail simplifies power design, and the rich USART/SPI/TWI set interfaces touch controllers, displays, and external Flash for assets. The FPU shortens audio filtering and control algorithms development time. The 144-ball LFBGA requires reflow assembly, so cost-driven consumer products with simple assembly lines may prefer LQFP siblings like ATSAM4E8EA-CU; choose the BGA when board area is the binding constraint.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM4E8EB-CN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4E16EB-CN | ATSAM4E8EB-CNR |
|---|---|---|---|
| Package | 144-LFBGA (10x10 mm) | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 with FPU, 32-bit | ARM Cortex-M4 with FPU, 32-bit | ARM Cortex-M4 with FPU, 32-bit |
| Max Clock | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512KB | 1024KB (+100%) | 512KB |
| Ethernet | 10/100 MAC | 10/100 MAC | 10/100 MAC |
| Temperature Grade | Extended (EXT TEMP) | Extended | Extended |
주요 차별점
- Lowest-cost entry into SAM4E Ethernet MCU family (vs ATSAM4E16EB-CN)
- Integrated FPU on Cortex-M4 at 120 MHz (vs Cortex-M3 based competitors (e.g., STM32F2 class))
- Extended temperature qualification (vs Standard commercial-grade MCUs)
설계 노트
The 144-LFBGA (10x10 mm, 1.4 mm thick) uses 0.8 mm ball pitch, so fanout requires either via-in-pad or dog-bone escape routing on at least a 4-layer PCB with dedicated power and ground planes. Trace geometry must match the BGA escape pitch, and assembly requires X-ray or AOI inspection for solder-ball integrity. If your production line cannot handle BGA rework, consider the LQFP-144 ATSAM4E8EA-CU, which is functionally equivalent but changes the footprint.
Per the Arrow listing, the device uses 1.2V (core), 2.5V, and 3.3V supply domains. Typically the 1.2V core rail is generated by the on-chip regulator from 3.3V with an external filter capacitor per the datasheet - verify the VDDCORE connection in the SAM4E datasheet before layout. Decouple each VDD/VDDIO ball with 100 nF placed within 2 mm of the ball, plus bulk 10 uF near the part. Sequencing and brown-out behavior should be validated at minimum and maximum ambient temperatures.
Estimated: engineers migrating firmware from SAM4E parts with more Flash to the 512KB ATSAM4E8E occasionally exceed code space after adding TLS or OTA banking - size your linker map early or select the ATSAM4E16EB-CN drop-in with 1MB. Also, MSL rating means BGA units must be baked before reflow if floor-life is exceeded, otherwise popcorn cracking can occur during reflow. Follow the moisture-barrier-bag handling flow per J-STD-033 for open trays.
규정 준수 정보
Mouser listing indicates GREEN package (RoHS-typical designation) but explicit RoHS/REACH certificates were not present in the verified data; consult Microchip's product page for official compliance documentation.
