ATSAM4E16EB-CN - Cortex-M4 120MHz 1MB Flash MCU | Microchip
MPN: ATSAM4E16EB-CN β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.9 | $8.90 |
| 10 | $8.1 | $81.00 |
| 100 | $7.25 | $725.00 |
| 500 | $6.6 | $3,300.00 |
| 1,000 | $6.05 | $6,050.00 |
ATSAM4E16EB-CN Overview
A 32-bit microcontroller is the central processing element of an embedded system, combining a processor core, memory, and peripherals on a single silicon die. Within the power-management hierarchy of embedded devices, the MCU sits above simple 8-bit controllers and below application processors, making it the standard choice for real-time control, connectivity, and human-interface tasks. The SAM4E family is Microchip (formerly Atmel) ARM Cortex-M4 line of general-purpose MCUs.
Key differentiating features include the Cortex-M4 core with a hardware floating point unit (FPU) for efficient DSP and math-intensive code, a high data bandwidth bus architecture, 120 MHz maximum operating frequency, and 1 MB of on-chip Flash for large application firmware images. The full-speed USB device port and dual ADC/DAC analog subsystem reduce external component count in measurement and communication designs.
Architecturally, the SAM4E16E series targets applications that need both compute throughput and deterministic real-time behavior. The ARMv7E-M architecture supports DSP instructions, and the FPU accelerates single-precision math used in motor control algorithms, sensor fusion, and communication stacks. The extended-temperature (-CN) grading supports deployment outside benign office environments.
Typical applications include industrial motor control and automation nodes, embedded networking equipment with USB connectivity, and precision data acquisition systems that leverage the dual ADC/DAC resources.
Design consideration: BGA packages require controlled-impedance multilayer PCB fabrication and reflow assembly; confirm your CM and inspection capability (X-ray for ball integrity) before committing to the 144-LFBGA footprint.
This page synthesizes distributor pricing and availability, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAM4E16EB-CN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4E16EB-CN (same form factor and footprint) β differing in Temperature Grade, Package, RoHS Status, Core Processor, Flash Memory.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM4E16EB-CNR
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View Datasheet βATSAM4E16EA-CN
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM4E16EA-CUR
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ATSAM4E16EA-CU
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ATSAM4E16CA-CN
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM4E16EB-CN Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Maximum Clock Frequency | 120 MHz |
| Flash Memory | 1 MB (1M x 8) |
| Floating Point Unit | Yes (single precision) |
| USB | Full-Speed USB |
| Analog Peripherals | Dual ADC / DAC |
| Supply Voltage | 1.2 V / 3.3 V |
| Package | 144-LFBGA (10 x 10 mm) |
| Mounting Type | Surface Mount |
| Temperature Grade | Extended temperature (EXT TEMP) |
| Material Declaration Level | MRL B |
| Package Material | Green |
| RoHS Status | Compliant (green package) |
ATSAM4E16EB-CN green Pin Configuration Guide
Pin configuration for ATSAM4E16EB-CN (green package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4E16EB-CN.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4E16EB-CN is suitable for 6 applications: Industrial Motor Control, Embedded Networking and USB Equipment, Precision Data Acquisition Systems, Building Automation and IoT Gateways, Test and Measurement Instrumentation, Automotive-Adjacent Industrial Displays and HMI.
Industrial Motor Control
The ATSAM4E16EB-CN fits industrial motor control because its 120 MHz ARM Cortex-M4 with a hardware single-precision FPU executes field-oriented control (FOC) algorithms with the arithmetic throughput that fixed-point MCUs lack, and the dual ADC enables near-simultaneous sampling of phase currents for correct dq-axis current regulation. Microchip positions the SAM4E16E specifically as having a floating point unit and high data bandwidth architecture for such compute-dense control loops. In a typical implementation, the MCU runs the current loop at PWM frequency, reads current shunts through the ADCs, and drives an inverter gate-driver stage; the FPU removes the software overhead of Q-format fixed-point scaling, shortening control-loop latency. The extended-temperature -CN grade suits drive electronics mounted near heat sources inside cabinets or machinery. Designers should budget ADC sampling windows against PWM edges to keep current measurement synchronized with switching events.
Recommended
Embedded Networking and USB Equipment
For embedded networking devices, the ATSAM4E16EB-CN's 1 MB of Flash and full-speed USB peripheral allow a single chip to host firmware stacks, configuration storage, and host/device connectivity. The high data bandwidth architecture that Microchip highlights for the SAM4E16E benefits packet buffering and protocol processing, while the 120 MHz clock provides headroom for CRC computation and multiple communication interfaces running concurrently. Typical usage places the MCU as a USB device presenting CDC or vendor-specific classes to a host PC, or as a bridge between field buses and USB service ports. The 144-ball LFBGA package supplies the generous GPIO allocation needed to bit-bang or connect auxiliary serial links, status indicators, and board-management signals. Because FS USB tops out at 12 Mbit/s, designers needing higher throughput should treat USB as a service and configuration channel rather than a data plane, routing bulk telemetry over faster serial peripherals instead.
Recommended
Precision Data Acquisition Systems
The ATSAM4E16EB-CN suits precision data acquisition through its dual ADC/DAC analog subsystem, allowing simultaneous multi-channel sampling and analog output generation without external converters in moderate-resolution systems. The DigiKey and FindIC listings specifically call out 'dual ADC/DAC' as a defining feature of this part number. The 120 MHz Cortex-M4 with FPU processes oversampled streams, applies digital filtering, and performs floating-point calibration math locally, reducing host loading in distributed measurement topologies. Typical deployment: the ADCs sample sensor channels under timer-triggered sequencing, firmware decimates and linearizes data, and the DACs drive actuators or stimulus outputs in closed-loop test equipment. The extended-temperature grade supports measurements in unconditioned industrial environments. Designers should verify converter resolution, sample rate, and reference voltage options in the SAM4E datasheet peripheral chapter, and keep analog reference routing physically separated from the BGA's high-speed digital balls to preserve noise performance.
Recommended
Building Automation and IoT Gateways
In building automation, the ATSAM4E16EB-CN works as a gateway or controller node combining the 120 MHz Cortex-M4 compute capability with enough Flash (1 MB) to hold both application logic and protocol stacks concurrently. The full-speed USB port provides commissioning and diagnostic interfaces to service laptops, while extended GPIO count from the 144-ball package accommodates multiple field buses (for example several UART/SPI/I2C channels for sensor and actuator wiring), relays, and status LEDs. Microchip's positioning of the SAM4E16E for high-bandwidth applications aligns with gateway workloads that aggregate many slower endpoints. Real-time responsiveness for HVAC or lighting control loops is preserved by the deterministic Cortex-M4 interrupt architecture. The extended-temperature -CN grading tolerates panel and rooftop installation conditions. For designs prioritizing power over performance, the same family's lower-speed variants can reduce quiescent consumption, so confirm operating versus sleep-mode current figures in the datasheet before finalizing the power budget.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment benefits from the ATSAM4E16EB-CN's combination of dual ADC/DAC, 120 MHz processing, and FPU. Handheld and bench instruments typically need front-end digitization, DSP post-processing (FFT windowing, averaging, calibration), and stimulus generation - the SAM4E16E covers all three from one die, and Microchip's marketing of its 'high data bandwidth architecture' reflects the streaming workloads such instruments generate. The 1 MB Flash holds application firmware, calibration tables, and USB device firmware for PC connectivity, eliminating a separate interface controller. In a typical bench-top implementation, the ADCs sample under DMA, the FPU accelerates floating-point signal math, and the DACs supply reference or excitation outputs. The extended-temperature grade permits use in portable instruments exposed to field conditions. Engineers should verify converter ENOB and timing specifications in the SAM4E datasheet when planning measurement accuracy budgets, and consider adding an external precision reference for metrology-grade designs.
Recommended
Automotive-Adjacent Industrial Displays and HMI
Human-machine interface (HMI) panels in industrial and heavy equipment environments map well onto the ATSAM4E16EB-CN: the 120 MHz Cortex-M4 and FPU handle touch-processing algorithms and simple graphics rendering, while the 1 MB Flash stores UI assets and language packs. The high pin count of the 144-LFBGA package drives parallel display interfaces, keypads, backlight control, and buzzer outputs simultaneously, and Microchip's high-data-bandwidth architecture claim applies to display buffer movement. The extended-temperature -CN grading is essential for HMI hardware mounted in sun-exposed cabins or outdoor panels where ambient temperatures exceed commercial limits. USB provides in-field firmware updates and data export for diagnostics. A typical architecture pairs the MCU with a parallel or serial display module and a resistive or capacitive touch controller on I2C. Designers should confirm the SAM4E's display interface capabilities and DMA throughput in the datasheet, since this family is not a dedicated graphics controller.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4E16EB-CN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4E16EB-CNR | ATSAM4E16EA-CN | ATSAM4E16EA-CU | ATSAM4E16CA-CN |
|---|---|---|---|---|---|
| Package | 144-LFBGA (10 x 10 mm) | 144-LFBGA (10 x 10 mm) - same | 144-LFBGA (10 x 10 mm) - same | Package suffix differs - verify with datasheet | 144-LFBGA (10 x 10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (Atmel) | Microchip Technology |
| Core / Max Frequency | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz |
| Flash Memory | 1 MB (1M x 8) | 1 MB (1M x 8) | 1 MB (1M x 8) | 1 MB (1M x 8) | 512 KB (-50%) |
| Floating Point Unit | Yes (single precision) | Yes | Yes | Yes | Yes |
| Supply Voltage | 1.2 V / 3.3 V | 1.2 V / 3.3 V | 1.2 V / 3.3 V | 1.2 V / 3.3 V | 1.2 V / 3.3 V |
Key Differentiators
- Full 1 MB Flash in the top memory option of the SAM4E family (vs ATSAM4E16CA-CN)
- Extended-temperature green MRL B grading (vs ATSAM4E16EA-CU)
- Integrated dual ADC/DAC reduces external analog BOM (vs ATSAM4E16EA-CN)
Design Notes
The 144-ball LFBGA (10 x 10 mm, 0.8 mm ball pitch class) demands a multilayer PCB with via-in-pad or dog-bone fanout under the BGA, and solder-mask-defined or non-solder-mask-defined pads per the Microchip packaging note. Plan at least four layers to route the 1.2 V core and 3.3 V I/O domains cleanly, and arrange decoupling capacitors on the back side of the BGA footprint closest to supply balls. Specify X-ray inspection at your contract manufacturer to verify ball collapse and detect head-in-pillow defects, which electrical test alone frequently misses on BGA assemblies.
The ATSAM4E16EB-CN uses a dual-rail scheme: a 1.2 V core domain (VDDCORE) and a 3.3 V I/O domain, per FindIC part data. Power-up ordering and ramp-rate requirements are defined in the SAM4E16E datasheet - violating core-before-I/O sequencing can latch up or damage the device. Provide bulk (10 uF) plus per-ball-group (100 nF) decoupling, and measure core current at 120 MHz worst-case workload to size the 1.2 V regulator correctly. Estimated: dynamic core current scales roughly linearly with frequency, so bench validation at your actual clock configuration is essential before finalizing regulator selection.
Microchip explicitly recommends on the ATSAM4E16E product page that new designs consider Revision B devices for prototypes and production, so check the device marking revision when receiving stock and during incoming inspection. Second, do not assume cross-family substitutions: ATSAM4E16EA-CU is frequently cross-referenced against ATSAM4E16EB-CN but its package suffix differs, which forces a PCB change. Finally, the extended-temperature -CN grade should be re-confirmed against the latest datasheet ordering-code table, since suffix semantics occasionally change between datasheet revisions.
Compliance Information
Distributor listings describe the package as GREEN with MRL B material declaration level, consistent with RoHS/lead-free compliance. REACH, halogen-free, and conflict-minerals status were not stated in the provided data - obtain declarations from Microchip or distributor compliance documentation.
