ATSAM4E16EB-CNR - Cortex-M4 120MHz 1MB MCU | Microchip
부품 번호: ATSAM4E16EB-CNR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.23 | $13.23 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ATSAM4E16EB-CNR 개요
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals on one die, sitting at the heart of the embedded-systems hierarchy: MCU -> embedded processor -> SoC. The SAM4E family belongs to Microchip (formerly Atmel) ARM-based flash MCU lineup, positioned for industrial and connectivity-oriented designs that need both processing throughput and rich analog/digital integration.
Key features of the ATSAM4E16EB-CNR include the ARM Cortex-M4 core with hardware floating point unit (FPU), a high data bandwidth bus architecture, 1 MB of on-chip Flash for code storage, and a 120 MHz maximum operating frequency. The extended-temperature, green (RoHS-oriented) LFBGA package supports high-density PCB layouts where a 10x10 mm footprint conserves board area compared with larger LQFP alternatives.
Technically, the SAM4E16E series combines the Cortex-M4 pipeline with Microchip's SAM peripheral set, targeting applications such as industrial networking, gateways, and control nodes where the MCU must service multiple communication interfaces concurrently. The floating point unit accelerates control-loop math (PID filtering, DSP routines) without software emulation overhead, and the wide Flash array supports large protocol stacks and OTA-style firmware images.
Typical applications include industrial automation controllers, building automation and gateways, embedded networking equipment, and motor-control or instrumentation nodes that benefit from 120 MHz deterministic execution and hardware FPU math.
Design consideration: BGA packages require controlled-impedance, fine-pitch PCB fabrication with X-ray inspection capability for rework; plan your stack-up and land-pattern (per the Microchip LFBGA144 footprint in the datasheet) before committing layout.
This page synthesizes distributor pricing, drop-in alternatives from the SAM4E family, and practical design notes not found in the manufacturer datasheet, giving engineers a single citable reference for sourcing and selection decisions.
드롭인 대체품: ATSAM4E16EB-CNR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4E16EB-CNR (동일 폼 팩터 및 풋프린트) — 차이점: Floating Point Unit, Package, RoHS Status, Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4E16EB-CN
✅ 드롭인✓ 재고 있음
$6.05 / 개
데이터시트 보기 →ATSAM4E16EA-CU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM4E16EB-CNR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 120 MHz |
| Flash Memory Size | 1 MB (1M x 8) |
| 패키지 | 144-LFBGA (10x10 mm) |
| Number of Terminals | 144 |
| 실장 유형 | Surface Mount |
| Package Code | FBGA, Square |
| Terminal Form | Ball |
| Temperature Grade | Industrial / Extended |
| Floating Point Unit | Yes (Cortex-M4 FPU) |
| RoHS 상태 | Compliant (green package per Mouser) |
| Packaging | Tape & Reel (MRL B, T&R per Mouser) |
ATSAM4E16EB-CNR fbga, square 핀 구성 가이드
ATSAM4E16EB-CNR(fbga, square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4E16EB-CNR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4E16EB-CNR 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Building Automation Gateways, Motor Control Drives, Test and Measurement Instrumentation, Embedded Networking Equipment, Security and Access Control Panels.
Industrial Automation Controllers
The ATSAM4E16EB-CNR fits industrial controller nodes because its 120 MHz Cortex-M4 with hardware FPU executes deterministic control loops (PID, motion profiles) while servicing multiple communication interfaces concurrently. The 1 MB Flash holds full protocol stacks plus field-updatable firmware images, and the 144-LFBGA provides abundant GPIO for I/O expansion. In a PLC-style control card, the MCU typically runs the real-time scan loop with the FPU accelerating floating-point scaling and filtering at microsecond latency; the wide Flash array supports dual-bank OTA updates without external memory. Industrial temperature grading ensures reliable operation in cabinet environments.
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Building Automation Gateways
Gateway nodes bridging field buses to IP networks benefit from the SAM4E16E's high data bandwidth architecture and 120 MHz throughput. The ATSAM4E16EB-CNR's 1 MB Flash accommodates a full TCP/IP stack alongside legacy protocol handlers (Modbus, DALI-style links) simultaneously - capacity that smaller 512 KB variants cannot guarantee once TLS and web-server code are included. The hardware FPU accelerates encryption and signal-processing helpers. The 10x10 mm LFBGA keeps the gateway main board compact while retaining enough balls for multiple UARTs, Ethernet MAC connectivity, and board-management functions in a single chip.
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Motor Control Drives
The Cortex-M4 FPU in the ATSAM4E16EB-CNR performs field-oriented control (FOC) mathematics - Clarke/Park transforms and PI current loops - at 120 MHz without software float emulation, meeting typical 10-20 kHz PWM current-loop deadlines. The SAM4E peripheral set includes PWM and ADC resources suited to three-phase inverter control, and the 1 MB Flash stores sensorless observer algorithms plus parameter tables. The 144-ball package offers the PWM outputs, quadrature encoder inputs, and communication ports (CAN-class links) that drive boards need, all within a 10x10 mm footprint that fits dense power-electronics layouts.
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Test and Measurement Instrumentation
Bench and portable instruments need both DSP-class math and responsive user interfaces; the ATSAM4E16EB-CNR delivers both at 120 MHz with FPU-accelerated waveform math (FFT windows, averaging, calibration interpolation). The 1 MB Flash supports feature-rich firmware with menus, data logging, and USB-class communication without external code memory. Its 144-LFBGA footprint supplies enough GPIO for keypads, display interfaces, and front-panel indicators, while the industrial temperature grade supports bench-environment reliability. The high bandwidth bus architecture keeps ADC streaming and display refresh from starving each other in multi-block designs.
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Embedded Networking Equipment
Networked nodes such as industrial switches, access controllers, and sensor aggregators leverage the SAM4E16E's high data bandwidth architecture to move packet buffers between peripherals and SRAM with minimal CPU stalls. At 120 MHz, the ATSAM4E16EB-CNR sustains line-rate framing tasks for 10/100-class links while the FPU offloads statistics and filtering math. The 1 MB Flash is critical here: network firmware with dual-image fail-safe update requires roughly double the footprint of a static application, which is exactly why designers select the 16E Flash tier over smaller SAM4E variants in this application.
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Security and Access Control Panels
Access-control panels combine credential reading, decision logic, and network reporting; the ATSAM4E16EB-CNR handles all three on one chip. Its 120 MHz Cortex-M4 provides responsive scanning of reader interfaces and tamper inputs, while the FPU accelerates any cryptographic helper routines used in credential validation. The 1 MB Flash stores credential databases, event logs buffering logic, and field-updatable firmware - capacity headroom that reduces BOM complexity by avoiding external serial Flash. The 144-LFBGA's pin count supports multiple reader buses, relays, and tamper loops simultaneously in the 10x10 mm footprint.
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엔지니어링 참조 데이터: ATSAM4E16EB-CNR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4E16EB-CN | ATSAM4E16EA-CU |
|---|---|---|---|
| Package | 144-LFBGA (10x10 mm) | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same family package |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Frequency | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB |
| Floating Point Unit | Yes | Yes | Yes |
주요 차별점
- Maximum 1 MB Flash in SAM4E family tier (vs ATSAM4E16CB-CN)
- Identical-die tray alternative enables flexible sourcing (vs ATSAM4E16EB-CN)
- Cortex-M4 with hardware FPU at 120 MHz (vs ATSAM4E16EA-CU)
설계 노트
The 144-LFBGA (10x10 mm) package demands fine-pitch BGA fabrication: typical 0.8 mm ball pitch requires a minimum 4-layer stackup with via-in-pad or dogbone fanout. Confirm your PCB fabricator supports the land pattern defined in the Microchip SAM4E datasheet, and plan X-ray inspection for assembly verification since ball joints are hidden after reflow.
Provide clean, well-decoupled supply rails per the SAM4E datasheet power section: place 100 nF ceramic capacitors at each VDD ball pair group plus bulk 10 uF capacitance near the package. At 120 MHz, core current transients are fast; a solid ground return under the BGA area reduces ground bounce. Estimated decoupling values here are typical practice - verify exact capacitor count against the official datasheet pin/ball description.
Microchip notes on the SAM4E16E product page that Revision B is highly recommended for new prototypes and production. When sourcing, confirm the silicon revision and the exact temperature/packing suffix (-CNR vs -CN vs -CU) on purchase orders; mixing suffixes changes packing format and temperature options even though the die is shared. Also budget rework cost: BGA reballing requires specialist equipment, so use the drop-in ATSAM4E16EB-CN (same die) rather than redesigning.
규정 준수 정보
Green package designation and EXT TEMP grade per Mouser listing ('LFBGA, GREEN, EXT TEMP, MRL B, T&R'). Industrial temperature grade per Vyrian listing. Formal REACH/halogen-free declarations not present in provided data - consult Microchip compliance portal.
