ATSAM4N16CA-CU - 100MHz Cortex-M4 1MB MCU | Microchip
부품 번호: ATSAM4N16CA-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.55 | $55.50 |
| 100 | $4.98 | $498.00 |
| 500 | $4.52 | $2,260.00 |
| 1,000 | $4.05 | $4,050.00 |
ATSAM4N16CA-CU 개요
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, non-volatile program memory, volatile data memory, and peripherals into one chip. Within the power-management hierarchy of embedded systems, the MCU sits at the heart of firmware execution, sensor interfacing, and actuator control, sitting above discrete logic and below application processors.
Key features of the SAM4N16C include the ARM Cortex-M4 core with DSP-friendly instruction extensions, 1 MB of single-cycle flash organized as 1M x 8, 80 KB of SRAM for data buffers and stacks, and the low power consumption that characterizes the SAM4N series. The -CU ordering code denotes the TFBGA GREEN, industrial temperature, MRL A variant in tray packaging.
Technically, the SAM4N family balances compute throughput against static and dynamic power draw. The Cortex-M4 pipeline delivers deterministic real-time response while the on-chip flash controller supports the full 100 MHz core clock. Peripherals typical of the SAM4N series - serial communication interfaces, timers, ADC channels, and general-purpose I/O - let one chip replace a multi-chip logic and control solution in compact BGA-based boards.
Typical applications include industrial automation nodes, consumer and appliance control boards, and energy metering products - three markets Microchip explicitly names for the SAM4N series. The 9x9 mm TFBGA footprint suits space-constrained, two-sided PCB designs where QFP packages would consume too much board area.
Design consideration: because the SAM4N series is pin-to-pin compatible with the SAM4S, SAM3S, SAM3N, and SAM7S families per the Microchip datasheet, reserve board layout reuse by choosing the memory density that matches long-term firmware growth - the 512 KB ATSAM4N8CA-CU shares the same footprint if cost dominates.
This page synthesizes distributor pricing tiers, drop-in alternatives from the SAM4N and SAM4S families, design notes, and an FAQ not found on the manufacturer datasheet alone.
드롭인 대체품: ATSAM4N16CA-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4N16CA-CU (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Operating Temperature, Core Architecture, SRAM, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4N16CA-CUR
✅ 드롭인✓ 재고 있음
$4.58 / 개
데이터시트 보기 →ATSAM4N8CA-CU
✅ 드롭인✓ 재고 있음
$2.02 / 개
데이터시트 보기 →ATSAM4S8CA-CUR
✅ 드롭인✓ 재고 있음
$5.05 / 개
데이터시트 보기 →ATSAM4S16CA-CU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.89 / 개
데이터시트 보기 →ATSAM4SD16CA-CU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.2 / 개
데이터시트 보기 →ATSAM3N1CB-CU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM4N16CA-CU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Max Clock Frequency | 100 MHz |
| Flash Memory | 1 MB (1M x 8) |
| SRAM | 80 KB |
| 공급 전압 | 2.5 V / 3.3 V |
| 패키지 | 100-TFBGA (9x9 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | Industrial temperature range (-40C to +85C) |
| Series | SAM4N |
| Packaging Variant | Tray, MRL A, GREEN |
| Product Family Compatibility | Pin-to-pin compatible with SAM4S, SAM3S, SAM3N, SAM7S |
| RoHS 상태 | Compliant (GREEN package) |
| 장착 스타일 | SMD/SMT |
| Applications Focus | Industrial automation, consumer and appliance, energy metering |
| Moisture Sensitivity Level | MSL A (MRL A per Mouser listing) |
ATSAM4N16CA-CU 100-tfbga (9x9 mm) 핀 구성 가이드
ATSAM4N16CA-CU(100-tfbga (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4N16CA-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4N16CA-CU 적합 용도: 6 애플리케이션s: Industrial Automation Nodes, Energy Metering Products, Consumer and Appliance Control Boards, Space-Constrained Embedded Systems (BGA Designs), Low-Power Battery and Metering Endpoints, Migration and Second-Source Consolidation Designs.
Industrial Automation Nodes
The ATSAM4N16CA-CU fits industrial automation control nodes because Microchip explicitly targets the SAM4N series at 'industrial automation' markets, and its 100 MHz Cortex-M4 core delivers deterministic real-time response for I/O scanning, protocol handling (Modbus/CAN-style framing in firmware), and sensor polling. With 1 MB of flash, engineers can host a full communication stack plus OTA-reserve code space, while 80 KB of SRAM buffers multiple fieldbus frames and data-logging queues. The 9x9 mm TFBGA package lets I/O-dense nodes fit on compact two-sided PCBs. Operating from 3.3 V over industrial temperature, the low static power draw of the SAM4N family also suits always-on monitoring endpoints where a switching regulator feeds the MCU rail and duty-cycled sleep modes extend system efficiency.
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Energy Metering Products
Energy metering is one of the three markets Microchip names for the SAM4N series in the family datasheet, and the ATSAM4N16CA-CU aligns well with metering requirements. The Cortex-M4 core at 100 MHz performs RMS computation, power-factor math, and DSP-style filtering with single-cycle MAC instructions, while the on-chip ADC samples voltage and current channels. 1 MB of flash accommodates tariff tables, calibration coefficients, and multiple communication profiles, and 80 KB of SRAM retains load-profile history between flash writes. The GREEN TFBGA-100 package meets RoHS obligations for global meter deployments, and industrial temperature rating covers outdoor meter enclosures. Firmware-based metrology also lets one PCB serve multiple regional standards by re-flashing, reducing SKU proliferation across single-phase meter variants.
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Consumer and Appliance Control Boards
The SAM4N datasheet lists 'consumer and appliance' as a core target market, and the ATSAM4N16CA-CU suits appliance main-control boards that need more compute than 8-bit MCUs but without application-processor cost. The 100 MHz Cortex-M4 handles user-interface scanning (capacitive touch decoded in firmware), motor-control loops, and simultaneous serial management of displays and sensors. The 1 MB flash stores localization assets, multiple UI themes, and connectivity stacks; 80 KB of SRAM supports state machines for wash/heat cycles. The compact 9x9 mm TFBGA frees board area for power electronics on appliance PCBs, and the GREEN package satisfies global RoHS. Running from 3.3 V, it interfaces directly with 3.3 V display modules and external EEPROM without level shifting.
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Space-Constrained Embedded Systems (BGA Designs)
For handheld instruments, gateways, and dense sensor hubs where board area is the binding constraint, the 100-ball TFBGA (9x9 mm) package of the ATSAM4N16CA-CU saves substantial area versus 100-pin LQFP alternatives, enabling four-layer two-sided routing with escape routing on 0.8 mm ball pitch. The 1 MB flash eliminates external SPI flash in many designs, and 80 KB SRAM runs an RTOS with protocol buffers comfortably. Per Microchip, SAM4N is pin-to-pin compatible with SAM4S, SAM3S, SAM3N, and SAM7S, so a single BGA land pattern supports a whole roadmap: ship a 512 KB product today and migrate to 1 MB or SAM4S peripherals later without respin. Verify reflow profile per MSL A rating before mass assembly.
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Low-Power Battery and Metering Endpoints
The SAM4N series emphasizes 'low power consumption' in the Microchip datasheet, making the ATSAM4N16CA-CU appropriate for battery-backed endpoints such as water/gas meter modules, data loggers, and remote sensors. The Cortex-M4's low-power sleep and wait modes let the MCU idle between measurement events, waking on RTC or external interrupts to sample sensors, compute results, and return to sleep; the 2.5 V operating option reduces logic power versus 3.3 V rails. With 1 MB flash, firmware can embed full scaling and self-diagnostics without external memory, and 80 KB SRAM retains buffered readings between radio or bus transmissions. Pairing the MCU with a low-Iq LDO or buck converter and duty-cycling the ADC keeps average consumption within coin-cell or primary-lithium budgets for multi-year deployment.
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Migration and Second-Source Consolidation Designs
Because Microchip engineered the SAM4N series for pin-to-pin compatibility with SAM4S, SAM3S, SAM3N, and SAM7S devices, the ATSAM4N16CA-CU is a strategic choice for consolidation designs: one 100-TFBGA land pattern covers legacy SAM7S/SAM3N refresh programs and new Cortex-M4 products alike. Teams maintaining long-lifecycle industrial and metering products can drop this 1 MB Cortex-M4 part onto an existing SAM3N-PCB footprint to gain 8x the flash and a modern DSP-capable core with no relayout, then optionally step to ATSAM4S16CA for ECC flash. This path reduces qualification effort, spares inventory diversity, and de-risks end-of-life events - a documented Microchip migration strategy rather than a third-party promise.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM4N16CA-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4N16CA-CUR | ATSAM4N8CA-CU | ATSAM4S8CA-CUR | ATSAM3N1CB-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M4, 100 MHz | ARM Cortex-M4, 100 MHz | ARM Cortex-M4, 100 MHz | ARM Cortex-M4, 120 MHz class (SAM4S) | ARM Cortex-M3 (lower performance) |
| Flash Memory | 1 MB | 1 MB | 512 KB | 512 KB (ECC-capable on SAM4S) | 128 KB |
| Family Pin Compatibility | SAM4N (compatible with SAM4S/SAM3S/SAM3N/SAM7S) | Same family - identical | Same family - identical footprint | SAM4S - pin-compatible per Microchip | SAM3N - pin-compatible per Microchip |
주요 차별점
- Double the flash of the ATSAM4N8CA-CU on an identical footprint (vs ATSAM4N8CA-CU)
- Cortex-M4 DSP capability versus the pin-compatible SAM3N family (vs ATSAM3N1CB-CU)
- Entry-level power/cost positioning within the Cortex-M4 portfolio (vs ATSAM4S16CA-CU)
설계 노트
The 100-TFBGA 9x9 mm package uses 0.8 mm ball pitch; plan fan-out with via-in-pad or dog-bone escape on a minimum 4-layer stackup (signal / GND / power / signal). Reserve a dedicated ground plane under the BGA for return paths, and place the 100 nF decoupling network so at least one capacitor sits within 2 mm of each VDD ball group per the SAM4N datasheet power recommendations. Because SAM4N is pin-compatible with SAM4S/SAM3S, populate DNP footprints for peripheral differences so the same PCB accepts higher-family parts later.
The device supports 2.5 V and 3.3 V operation; use 3.3 V for maximum peripheral speed margin and 2.5 V when interfacing to 2.5 V logic or minimizing core power. Estimated: at a typical 100 MHz active current in the tens-of-mA class (verify exact figure in the SAM4N datasheet electrical characteristics), a 3.3 V rail supplying 50 mA dissipates roughly 165 mV-scale load on the regulator - well within a standard 300 mA LDO, but battery endpoints should duty-cycle sleep modes instead of relying on active-mode figures.
Do not assume the ATSAM4N16CA-CU and ATSAM4N16CA-CUR differ electrically - they are the same die with tray vs tape-and-reel packing; ordering the wrong format only affects assembly logistics. When migrating from SAM3N to SAM4N, review peripheral register maps and flash wait-state settings: the Cortex-M4 at 100 MHz requires the correct flash accelerator/wait-state configuration at startup, and boot code written for 96 MHz-class SAM3N parts may need updating. Also confirm MSL A reflow handling per the Mouser 'MRL A' designation before first BGA assembly run.
규정 준수 정보
Listed as TFBGA GREEN, IND TEMP, MRL A by Mouser and DigiKey; Microchip GREEN denotes RoHS-compliant, halogen-free, lead-free packaging. No AEC-Q100 automotive qualification indicated in provided data.
