ATSAMA5D26A-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
부품 번호: ATSAMA5D26A-CNR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.42 | $164.20 |
| 100 | $14.15 | $1,415.00 |
| 500 | $12.3 | $6,150.00 |
| 1,000 | $10.85 | $10,850.00 |
ATSAMA5D26A-CNR 개요
What is an MPU? A microprocessor unit (MPU) is a system-on-chip class of integrated circuit that integrates a CPU core, memory controllers, peripheral interfaces, and often security accelerators into a single device. Within the embedded hierarchy, an MPU sits above a microcontroller (MCU): Cortex-A5 MPUs run a full operating system such as Linux (typically mainline Linux with the AT91 distribution) and target applications requiring rich GUI, networking stacks, or high-throughput data processing. MPUs require external DRAM and boot media, distinguishing them from MCUs that integrate flash and SRAM internally.
Key features of the ATSAMA5D26A-CNR include an Arm Cortex-A5 core with Neon and FPU, hardware crypto accelerators (AES, SHA, TRNG), a 12-bit ADC, dual CAN-FD controllers, USB HSIC, and a Class-D audio amplifier interface. The part includes an ARM TrustZone-aware secure boot mechanism and on-the-fly AES decryption (OTFDC) for external QSPI flash, enabling encrypted code-at-rest solutions. Operating voltage spans 0.85 V to 1.2 V core and 1.65 V to 3.6 V I/O, with industrial temperature grade -40C to +85C.
The device integrates a sophisticated peripheral set: 12-bit 1 MSPS ADC with up to 12 channels, two HS USB ports (one with HSIC), two CAN-FD, three I2S/SSC for audio, a graphics LCD controller up to XGA (1024x768), camera interface, EMAC with 1588 PTP support, and 12 FLEXCOMs configurable as USART/UART/SPI/TWI. The 289-ball LFBGA uses a 14x14 mm body with 0.5 mm pitch, optimized for compact industrial designs.
Typical applications include industrial IoT gateways, building automation HMI panels, smart energy concentrators, medical patient monitoring terminals, POS and retail terminals, and ruggedized field instruments. The combination of Cortex-A5 throughput, hardware crypto, and Linux ecosystem makes the SAMA5D2 family a strong fit where an MCU is too small and a full Cortex-A53 SoC is over-spec.
When designing with the ATSAMA5D26A-CNR, plan power rails carefully: the core requires a DC-DC switching regulator or LDO generating 1.0-1.2 V at up to ~500 mA peak, while the DDR I/O rail needs termination voltage (DDR2) or reference voltage (DDR3L/LPDDR). Use the SAM-BA boot assistant or a recovery SD card image for first-stage programming. Run DDR3L at 1.35 V only, never at the 1.5 V standard, to stay within the supported VDDQ range.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated in the manufacturer datasheet, providing engineers with a single reference for sourcing and BOM risk mitigation.
드롭인 대체품: ATSAMA5D26A-CNR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D26A-CNR (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Package, Core Architecture, USB, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D26A-CN
✅ 드롭인✓ 재고 있음
$15.2 / 개
데이터시트 보기 →ATSAMA5D26B-CNR
✅ 드롭인✓ 재고 있음
$9.1 / 개
데이터시트 보기 →ATSAMA5D26A-CU
✅ 드롭인✓ 재고 있음
$16.1 / 개
데이터시트 보기 →ATSAMA5D23A-CNR
✅ 드롭인✓ 재고 있음
$11.2 / 개
데이터시트 보기 →ATSAMA5D24A-CU
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →ATSAMA5D26A-CNR 최대 정격 & 전기적 특성
| Core Architecture | Arm Cortex-A5 with Neon and FPU |
| Maximum Core Frequency | 500 MHz |
| Internal SRAM | 128 KB |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| External Memory Support | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC |
| 패키지 | 289-ball LFBGA, 14x14 mm, 0.5 mm pitch |
| 동작 온도 | -40C to +85C (Industrial) |
| Core Voltage | 0.85 V to 1.2 V |
| I/O Voltage | 1.65 V to 3.6 V |
| ADC | 12-bit, up to 12 channels, 1 MSPS |
| CAN-FD Controllers | 2 |
| USB Interfaces | 2x USB HS (one with HSIC) |
| Ethernet | 10/100 EMAC with 1588 PTP |
| Hardware Crypto | AES, SHA, TRNG, OTFDC |
| LCD Controller | Up to XGA (1024x768) |
| RoHS 상태 | Compliant (GREEN, per PCB Electronics) |
| 실장 유형 | Surface Mount (BGA) |
ATSAMA5D26A-CNR 289-ball lfbga, 14x14 mm, 0.5 mm pitch 핀 구성 가이드
ATSAMA5D26A-CNR(289-ball lfbga, 14x14 mm, 0.5 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D26A-CNR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D26A-CNR 적합 용도: 8 애플리케이션s: Industrial IoT Gateways, Building Automation HMI Panels, Medical Patient Monitoring Terminals, Smart Energy Concentrators, POS and Retail Terminals, Ruggedized Field Instruments, Industrial Control Touchscreens, Smart Home Edge Hubs.
Industrial IoT Gateways
The ATSAMA5D26A-CNR is well suited for industrial IoT gateway designs where Linux-based protocol translation, edge analytics, and secure connectivity are required. Its 500 MHz Cortex-A5 core delivers enough throughput to run MQTT brokers, OPC-UA servers, and edge ML inference while keeping power below 1 W active. The hardware AES/SHA accelerators offload TLS 1.3 handshakes, and the dual CAN-FD ports interface directly with industrial fieldbus segments. The industrial -40C to +85C temperature grade and 289-LFBGA package support ruggedized gateway enclosures. Engineers typically pair this MPU with a Wi-Fi/BLE module via the SDIO/SPI interfaces and an LTE modem over USB for cellular backhaul.
추천
Building Automation HMI Panels
The ATSAMA5D26A-CNR drives graphical HMI panels in building automation systems, where the integrated XGA-resolution LCD controller and 2D graphics accelerator deliver crisp touch interfaces. Its low power envelope suits always-on wall-mounted controllers that must meet Energy Star standby limits. The 12-bit ADC reads analog temperature and humidity sensors, while the EMAC with IEEE 1588 PTP synchronizes BACnet time-stamped events across the building network. Industrial temperature grade supports unheated electrical closets and outdoor enclosure retrofits.
추천
Medical Patient Monitoring Terminals
Medical bedside terminals use the ATSAMA5D26A-CNR as the application processor for patient data aggregation and display. The Cortex-A5 with Neon accelerates DSP algorithms for ECG waveform processing, while hardware AES ensures HIPAA-compliant encryption of patient records at rest. The two CAN-FD ports interface with medical device buses, and the EMAC supports hospital Ethernet with QoS tagging. Linux BSP enables long-term support cycles critical for FDA-cleared devices with multi-year field deployments.
추천
Smart Energy Concentrators
Smart energy data concentrators aggregate meter readings from multiple households via M-Bus, wM-Bus, or PLC, and the ATSAMA5D26A-CNR handles the protocol stack plus secure cloud uploads. The hardware TRNG seeds TLS session keys, while the on-the-fly AES decryptor protects firmware updates in the field. Industrial temperature grade is essential for utility cabinet installations subject to direct sun exposure. The 128 KB SRAM buffers burst meter readings before compression and upload.
추천
POS and Retail Terminals
POS terminals leverage the ATSAMA5D26A-CNR's Cortex-A5 throughput to run Android- or Linux-based payment stacks with encryption acceleration. The integrated LCD controller drives the cashier display, while the camera interface supports barcode scanning modules. The two USB HS ports connect receipt printers and customer-facing displays, and the EMAC links to the store network. Hardware AES enables PCI-PTS compliant PIN encryption and contactless payment card processing.
추천
Ruggedized Field Instruments
Field measurement instruments such as gas analyzers, flow meters, and vibration monitors use the ATSAMA5D26A-CNR for on-instrument analytics and remote telemetry. The industrial -40C to +85C temperature grade and low power consumption support battery- or solar-powered installations in harsh outdoor environments. The 12-bit 1 MSPS ADC captures transducer signals directly, and the CAN-FD ports interface with vehicle and machinery buses in mobile applications. Linux BSP enables long-life software maintenance contracts.
추천
Industrial Control Touchscreens
Touchscreen-based industrial control panels benefit from the ATSAMA5D26A-CNR's XGA LCD controller combined with the I2S audio interface for audible alarms and voice prompts. The 12 FLEXCOMs provide ample UART/SPI/I2C for connecting PLCs, motor drives, and sensor arrays. Hardware AES secures configuration parameters and prevents unauthorized parameter tampering. The 289-LFBGA package allows compact panel designs where board space is at a premium.
추천
Smart Home Edge Hubs
Smart home edge hubs aggregate Zigbee, Z-Wave, BLE, and Wi-Fi devices and expose them to cloud services; the ATSAMA5D26A-CNR provides the Linux application processor to run the hub software stack. The hardware crypto accelerators offload TLS connections to multiple cloud endpoints, while the Cortex-A5 handles concurrent protocol translation workloads. Industrial temperature grade ensures reliability in utility rooms and garages. The 128 KB SRAM supports local automation rules that continue to run during cloud outages.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D26A-CNR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D26A-CN | ATSAMA5D26B-CNR | ATSAMA5D26A-CU | ATSAMA5D23A-CNR | ATSAMA5D24A-CU |
|---|---|---|---|---|---|---|
| Package | 289-LFBGA (14x14 mm) | 289-LFBGA (same) | 289-LFBGA (same) | 289-LFBGA (same) | 289-LFBGA (same) | 289-LFBGA (same) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | Arm Cortex-A5 + Neon + FPU | Arm Cortex-A5 + Neon + FPU | Arm Cortex-A5 + Neon + FPU | Arm Cortex-A5 + Neon + FPU | Arm Cortex-A5 + Neon + FPU | Arm Cortex-A5 + Neon + FPU |
| Maximum Core Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Peripheral Set | Full (D26A tier: 2x CAN-FD, 12 FLEXCOM, dual USB, EMAC, LCD) | Full (D26A) | Full (D26B) | Full (D26A) | Reduced (D23A tier) | Mid (D24A tier) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +105C (Extended) | -40C to +85C | -40C to +85C |
| Hardware Crypto (AES/SHA/TRNG) | Yes | Yes | Yes | Yes | Yes | Yes |
| Approximate Unit Price (qty 100) | $14.15 | $14.15 | $15.20 | $16.80 | $11.50 | $12.80 |
주요 차별점
- Full-featured peripheral set in 289-LFBGA (vs ATSAMA5D23A-CNR)
- Silicon revision B with errata fixes available (vs ATSAMA5D26A-CNR (this part, rev A))
- Industrial temperature grade with full peripheral count (vs ATSAMA5D26A-CU)
- Mid-tier peripheral integration in same LFBGA footprint (vs ATSAMA5D24A-CU)
설계 노트
The ATSAMA5D26A-CNR requires multiple voltage rails: VDDCore 0.85-1.2 V at up to ~500 mA peak, VDDVDDPLL 1.2 V for the PLL, VDDBU 1.65-3.6 V for the backup domain, and VDDANA 3.3 V for the ADC. Use a buck DC-DC regulator such as the Microchip MCP16311 for VDDCore to minimize dissipation. Decouple each rail with 100 nF X7R capacitors within 2 mm of every supply pin; place 10 uF bulk capacitors near the BGA's power balls. Power sequencing: bring up VDDCore before VDDIOM and VDDANA, with no strict delay requirement per datasheet. For DDR3L operation, generate VTT termination voltage with a dedicated LDO and isolate VTT traces from noisy digital planes.
The 289-LFBGA package at 0.5 mm pitch requires a 4-layer PCB minimum with 0.5 oz copper and laser-drilled microvias for the inner ball pads. Use Microchip's reference design land pattern exactly as documented; non-solder-mask-defined pads improve yield. Escape the inner balls using a 0.2 mm trace with 0.3 mm spacing on the outer layers and 0.15 mm trace on inner layers. Matched-impedance routing for the DDR interface is mandatory: target 50 ohm single-ended and 100 ohm differential per JEDEC specifications. Place the DDR chip directly under or adjacent to the MPU with no stubs; keep the DQ/DQS trace lengths matched within 25 mil.
The 289-LFBGA package has a typical theta_JA of approximately 25 C/W with a 4-layer JEDEC-compliant test board. At full 500 MHz operation with typical industrial workload, the device dissipates around 0.8-1.0 W, resulting in a 25 C junction temperature rise above ambient - well within the -40C to +85C industrial range. Estimated: based on datasheet typical power consumption figures, not measured. For closed enclosures with limited airflow, ensure ambient temperature does not exceed 60 C to maintain 25 C thermal margin. The exposed pad on the LFBGA's underside is the primary thermal conduction path and must be soldered to a continuous ground pour.
Common pitfalls include (1) using standard 1.5 V DDR3 instead of 1.35 V DDR3L, which violates VDDQ spec and may damage the controller; (2) omitting the backup battery on VDDBU, which loses RTC and secure-key storage on power-down; (3) routing USB HS without 90-ohm differential impedance and proper ESD protection, causing enumeration failures; (4) failing to populate the boot mode straps correctly, causing the device to enter SAM-BA recovery instead of normal boot. Always consult the SAMA5D2 hardware design checklist before committing to layout. Estimated power figures are based on datasheet typical values; actual dissipation depends on peripheral activity and software workload.
규정 준수 정보
RoHS compliance per PCB Electronics distributor listing (GREEN designation). AEC-Q100 not qualified - automotive designs should use ATSAMA5D26A-CU (extended temperature grade) or ATSAMA5D27C-CU (higher integration).
