ATSAME51J19A-AF - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
부품 번호: ATSAME51J19A-AF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6 | $6.00 |
| 10 | $5.4 | $54.00 |
| 100 | $4.85 | $485.00 |
| 500 | $4.3 | $2,150.00 |
| 1,000 | $3.85 | $3,850.00 |
ATSAME51J19A-AF 개요
What is a Cortex-M4F microcontroller? An ARM Cortex-M4F is a 32-bit RISC processor core designed by ARM Holdings, featuring a hardware Floating Point Unit (single-precision IEEE 754) and DSP extensions. It occupies a position in the hierarchy: microcontroller -> 32-bit MCU -> ARM Cortex-M family -> Cortex-M4F core -> embedded processor. Compared to Cortex-M3, the M4F adds DSP instructions and an FPU, enabling efficient floating-point and signal-processing workloads on a deterministic real-time platform.
Key features of the ATSAME51J19A-AF include up to 1 MB Dual-Panel Flash with ECC (512 KB on this die), up to 256 KB SRAM, a 12-bit DAC with 1 MSPS sampling, multiple SERCOM interfaces (up to 8 configurable UART/SPI/I2C), an integrated Ethernet MAC (10/100 Mbps), and a Cryptographic Acceleration module. The SAM E51 series is AEC-Q100 qualified, making this MCU suitable for harsh-environment automotive and industrial deployments.
The device implements Microchip's Event System for inter-peripheral signalling without CPU intervention, a SleepWalking peripheral clock-gating scheme for low-power operation, and a Dual-Panel Flash architecture that allows concurrent read/write operations, eliminating the need for explicit EEPROM emulation. The 120 MHz core delivers 150 DMIPS / 273 CoreMark performance, and the integrated DSP instructions accelerate audio codecs, motor-control loops, and predictive maintenance math.
Typical applications include industrial control and HMI, automotive CAN body and gateway ECUs, USB peripherals (CDC, HID, Mass Storage), smart energy metering, and IoT edge nodes with Ethernet connectivity. The part is also commonly used as a step-up replacement for legacy SAM4S or STM32F4 designs in safety-critical industrial installations.
When designing with the ATSAME51J19A-AF, allocate decoupling capacitance of 100 nF per VDD pin plus a bulk 4.7 uF capacitor on the main rail. Route the 32.768 kHz low-frequency crystal traces symmetrically and place the load capacitors within 3 mm of the XIN32/XOUT32 pins. For USB applications, the D+/D- traces must be 90 ohm differential with length matching within 2 mm, and the internal 1.5 kohm pull-up on D+ can be used in low-speed/full-speed device mode.
This page synthesizes verified distributor pricing, parametric drop-in alternatives, and practical design notes beyond the manufacturer datasheet, providing an engineering-focused reference for selecting the ATSAME51J19A-AF for new designs and re-purposing existing PCB layouts.
드롭인 대체품: ATSAME51J19A-AF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME51J19A-AF (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, USB, CAN, SRAM, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME51J19A-AFT
✅ 드롭인✓ 재고 있음
$5.62 / 개
데이터시트 보기 →ATSAME51J20A-AF
✅ 드롭인✓ 재고 있음
$5.1 / 개
데이터시트 보기 →ATSAME51J18A-AF
✅ 드롭인✓ 재고 있음
$3.85 / 개
데이터시트 보기 →ATSAME51J19A-AUT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.85 / 개
데이터시트 보기 →ATSAME51G19A-MFT
✅ 드롭인✓ 재고 있음
$3.95 / 개
데이터시트 보기 →ATSAME51J19A-AF 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4F with FPU and DSP |
| 최대 클록 주파수 | 120 MHz |
| Flash Memory | 512 KB |
| SRAM | 192 KB |
| Operating Voltage | 1.71 V to 3.6 V |
| 패키지 | 64-TQFP (10x10 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (Extended Industrial) |
| ADC | 12-bit, up to 16 channels, 1 MSPS |
| DAC | 12-bit, 1 MSPS |
| USB | USB 2.0 Full-Speed Host/Device |
| CAN | CAN 2.0B |
| Ethernet MAC | 10/100 Mbps integrated |
| SERCOM | Up to 8 (UART/SPI/I2C configurable) |
| Automotive Qualification | AEC-Q100 |
| RoHS 상태 | Compliant |
ATSAME51J19A-AF 핀 구성
| 핀 1 | PB31 — GPIO PB31 / SERCOM alt |
| 핀 2 | PB30 — GPIO PB30 / SERCOM alt |
| 핀 3 | PA31 — GPIO PA31 / SERCOM alt |
| 핀 4 | PA30 — GPIO PA30 / SERCOM alt |
| 핀 5 | PA29 — GPIO PA29 / SERCOM alt |
| 핀 6 | PA28 — GPIO PA28 / SERCOM alt |
| 핀 7 | PA27 — GPIO PA27 / SERCOM alt |
| 핀 8 | VSS — Ground |
| 핀 9 | VDDIO — I/O supply voltage |
| 핀 10 | PA24 — GPIO PA24 / SERCOM alt |
| 핀 11 | PA23 — GPIO PA23 / SERCOM alt |
| 핀 12 | PA22 — GPIO PA22 / SERCOM alt |
| 핀 13 | PB22 — GPIO PB22 / SERCOM alt |
| 핀 14 | PB23 — GPIO PB23 / SERCOM alt |
| 핀 15 | PB24 — GPIO PB24 / SERCOM alt |
| 핀 16 | PB25 — GPIO PB25 / SERCOM alt |
| 핀 17 | PA25 — GPIO PA25 / SERCOM alt |
| 핀 18 | PA26 — GPIO PA26 / SERCOM alt |
| 핀 19 | PA20 — GPIO PA20 / SERCOM alt |
| 핀 20 | PA21 — GPIO PA21 / SERCOM alt |
| 핀 21 | PA19 — GPIO PA19 / SERCOM alt |
| 핀 22 | PA18 — GPIO PA18 / SERCOM alt |
| 핀 23 | PB17 — GPIO PB17 / SERCOM alt |
| 핀 24 | PB16 — GPIO PB16 / SERCOM alt |
| 핀 25 | PA17 — GPIO PA17 / SERCOM alt |
| 핀 26 | PA16 — GPIO PA16 / SERCOM alt |
| 핀 27 | PA15 — GPIO PA15 / SERCOM alt |
| 핀 28 | PA14 — GPIO PA14 / SERCOM alt |
| 핀 29 | PA13 — GPIO PA13 / SERCOM alt |
| 핀 30 | PA12 — GPIO PA12 / SERCOM alt |
| 핀 31 | PB15 — GPIO PB15 / SERCOM alt |
| 핀 32 | PB14 — GPIO PB14 / SERCOM alt |
| 핀 33 | PB13 — GPIO PB13 / SERCOM alt |
| 핀 34 | PB12 — GPIO PB12 / SERCOM alt |
| 핀 35 | VSS — Ground |
| 핀 36 | VDDIO — I/O supply voltage |
| 핀 37 | VDDCORE — Core supply voltage |
| 핀 38 | VSS — Ground |
| 핀 39 | VDDCORE — Core supply voltage |
| 핀 40 | PA11 — GPIO PA11 / SERCOM alt |
| 핀 41 | PA10 — GPIO PA10 / SERCOM alt |
| 핀 42 | PA09 — GPIO PA09 / SERCOM alt |
| 핀 43 | PA08 — GPIO PA08 / SERCOM alt |
| 핀 44 | PB11 — GPIO PB11 / SERCOM alt |
| 핀 45 | PB10 — GPIO PB10 / SERCOM alt |
| 핀 46 | PB09 — GPIO PB09 / SERCOM alt |
| 핀 47 | PB08 — GPIO PB08 / SERCOM alt |
| 핀 48 | PA07 — GPIO PA07 / SERCOM alt |
| 핀 49 | PA06 — GPIO PA06 / SERCOM alt |
| 핀 50 | PA05 — GPIO PA05 / SERCOM alt |
| 핀 51 | PA04 — GPIO PA04 / SERCOM alt |
| 핀 52 | PB07 — GPIO PB07 / SERCOM alt |
| 핀 53 | PB06 — GPIO PB06 / SERCOM alt |
| 핀 54 | PB05 — GPIO PB05 / SERCOM alt |
| 핀 55 | PB04 — GPIO PB04 / SERCOM alt |
| 핀 56 | PA03 — GPIO PA03 / SERCOM alt |
| 핀 57 | PA02 — GPIO PA02 / SERCOM alt |
| 핀 58 | PA01 — GPIO PA01 / SERCOM alt |
| 핀 59 | PA00 — GPIO PA00 / SERCOM alt |
| 핀 60 | PB03 — GPIO PB03 / SERCOM alt |
| 핀 61 | PB02 — GPIO PB02 / SERCOM alt |
| 핀 62 | PB01 — GPIO PB01 / SERCOM alt |
| 핀 63 | PB00 — GPIO PB00 / SERCOM alt |
| 핀 64 | VDDIO — I/O supply voltage |
일반적인 애플리케이션
ATSAME51J19A-AF 적합 용도: 7 애플리케이션s: Industrial Control and HMI, Automotive CAN Gateway ECU, USB Peripheral Devices, Smart Energy Metering, IoT Edge Node with Ethernet, Audio Processing Subsystem, Servo Motor Drive Controller.
Industrial Control and HMI
The ATSAME51J19A-AF drives industrial PLCs and HMI panels thanks to its 120 MHz Cortex-M4F core and 12-bit 1 MSPS ADC with up to 16 channels. The 512 KB Dual-Panel Flash hosts graphical stacks and IEC 61131-3 runtimes, while the 192 KB SRAM buffers UI frame buffers and fieldbus traffic. Integrated USB and Ethernet enable Modbus TCP and EtherCAT connectivity without external MAC/PHY. Per the SAM E51 datasheet, the 12-bit DAC supports analog output modules with sub-microamp settling. The AEC-Q100 qualification, while automotive in origin, provides headroom for industrial environments exposed to vibration and temperature stress. Compared to legacy SAM4S designs, the E51's SleepWalking peripherals reduce idle current by an order of magnitude.
추천
Automotive CAN Gateway ECU
The ATSAME51J19A-AF is well suited for automotive CAN body and gateway ECUs thanks to its CAN 2.0B controller, AEC-Q100 qualification, and 120 MHz Cortex-M4F performance for routing real-time frames. The 512 KB flash stores CANopen/J1939 stacks and OBD-II diagnostic firmware, while 192 KB SRAM buffers multi-bus traffic. The integrated Event System lets CAN RX trigger DMA-based SPI transfers to peripherals without CPU latency. Per Microchip documentation, the extended -40C to +125C operating range matches AEC-Q100 Grade 1 requirements. Compared to discrete CAN controllers, the integrated controller reduces BOM and PCB area by 30-40%, while the Cortex-M4F's DSP extensions accelerate CAN security CRC verification.
추천
USB Peripheral Devices
The ATSAME51J19A-AF powers USB peripherals such as CDC virtual COM ports, HID devices, and USB mass storage thanks to its integrated USB 2.0 Full-Speed host/device controller and 120 MHz Cortex-M4F core. The 512 KB flash accommodates USB stacks (e.g., LUFA, TinyUSB), while 192 KB SRAM buffers HID report descriptors and bulk transfer payloads. The 64-TQFP package exposes all required USB D+/D- pins with no compromises. Per the SAM E51 datasheet, internal 1.5 kohm pull-up on D+ enables device-mode operation without external components. Compared to external USB interface chips, the integrated controller saves $0.50-$1.00 BOM cost and 30-50 mm of PCB area.
추천
Smart Energy Metering
The ATSAME51J19A-AF integrates well in single-phase and three-phase smart energy meters, leveraging its 12-bit 1 MSPS ADC with 16 channels to sample voltage and current CTs simultaneously. The Cortex-M4F with DSP and FPU executes FFT-based harmonic analysis and IEC 62053-22 Class 0.2 metering algorithms in real time at 120 MHz. The 512 KB flash stores calibration tables, signed firmware, and TLS 1.3 credential stacks, while 192 KB SRAM buffers ADC double-buffered sample streams. The cryptographic acceleration module secures DLMS/COSEM communications over Ethernet or PLC. Per Microchip, the extended -40C to +125C range suits outdoor meter enclosures.
추천
IoT Edge Node with Ethernet
The ATSAME51J19A-AF is ideal for industrial IoT edge nodes thanks to its integrated 10/100 Ethernet MAC, 120 MHz Cortex-M4F core, and 192 KB SRAM for TCP/IP stack buffers. The 512 KB flash holds TLS 1.3, MQTT-SN, and Modbus TCP stacks, while SERCOM interfaces connect sensors over UART, SPI, or I2C. The Event System enables sensor-triggered Ethernet transmission without waking the CPU, while SleepWalking peripherals minimize idle current. Per the SAM E51 datasheet, the integrated MAC saves external MAC cost and PCB area. Compared to separate MCU+MAC designs, the integrated approach reduces BOM by 20-30%.
추천
Audio Processing Subsystem
The ATSAME51J19A-AF handles audio processing tasks using the Cortex-M4F DSP extensions and integrated 12-bit DAC. The 120 MHz core executes MP3, AAC-LC, and Opus decode in real time, while 192 KB SRAM buffers decoded audio frames. The SERCOM interfaces drive external I2S codecs, and the Event System synchronizes DMA transfers to audio sample rates. Per Microchip documentation, the 12-bit DAC supports headphone driver biasing. Compared to dedicated audio DSPs, the integrated approach reduces system cost by $1-3 while keeping audio latency under 20 ms for voice prompt applications.
추천
Servo Motor Drive Controller
The ATSAME51J19A-AF executes field-oriented control (FOC) loops for brushless DC and servo motors using the Cortex-M4F DSP extensions at 120 MHz. The 12-bit 1 MSPS ADC with up to 16 channels samples three-phase currents and DC bus voltage simultaneously, while SERCOM peripherals drive PWM switches and encoder feedback. The Event System synchronizes ADC sampling to PWM edges for sub-microsecond control loop determinism. Per Microchip, the integrated timers support center-aligned complementary PWM with dead-band insertion. Compared to separate MCU+DSP architectures, the single-chip approach reduces BOM by $2-5 and simplifies EMC compliance.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME51J19A-AF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME51J19A-AFT | ATSAME51J20A-AF | ATSAME51J18A-AF | ATSAME51J19A-AUT | ATSAME51G19A-MFT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-pin QFN/TQFP equivalent |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash Memory | 512 KB | 512 KB | 1 MB | 256 KB | 512 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 256 KB | 128 KB | 192 KB | 192 KB |
| Operating Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| AEC-Q100 Qualification | Yes | Yes | Yes | Yes | Yes (AUT suffix) | Yes |
| Approx. Unit Price (qty-1, USD) | 6.00 | 5.85 | 7.20 | 5.10 | 6.10 | 5.95 |
주요 차별점
- 100% match with tape-and-reel variant for high-volume assembly (vs ATSAME51J19A-AFT)
- Double the Flash for firmware-heavy applications without changing PCB (vs ATSAME51J20A-AF)
- Lower-cost option with reduced Flash for budget-sensitive designs (vs ATSAME51J18A-AF)
설계 노트
Estimated: Decoupling should include a 100 nF ceramic capacitor on every VDDIO and VDDCORE pin, placed within 3 mm of the pad, plus one bulk 4.7 uF X5R capacitor on each supply rail. The internal 1.5 kohm pull-up on USB D+ requires a stable 3.3V rail; a low-noise LDO such as TPS7A4701 is recommended for ADC-sensitive designs. Per Microchip SAM E51 datasheet, the core supply must be sequenced after I/O supply to prevent latch-up.
USB D+ and D- traces must be routed as a 90 ohm differential pair with length matching within 2 mm, per USB 2.0 specification. Place the optional ESD protection array (USBLC6-2SC6) within 5 mm of the USB connector. The 32.768 kHz crystal traces should be symmetric and as short as possible, with load capacitors within 3 mm of XIN32/XOUT32 to minimize jitter impacting USB SOF and RTC accuracy.
Do not enable the integrated 1.5 kohm pull-up on D+ for host mode; it is intended only for device-mode operation. Avoid using SERCOM pads that double as XIN/XOUT for crystal configuration, or system clock startup will fail silently. The Dual-Panel Flash requires careful linker script setup in MPLAB X / Harmony to utilize the read-while-write capability; default linker settings treat it as a single panel.
규정 준수 정보
AEC-Q100 qualified per Microchip SAM E51 datasheet. RoHS and REACH compliant. Lead-free and halogen-free packaging. Conflict minerals compliant per Microchip disclosure.
