ATSAME53J19A-AF - 120MHz Cortex-M4F MCU 512KB Flash 64-TQFP | Microchip
부품 번호: ATSAME53J19A-AF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.45 | $8.45 |
| 10 | $7.92 | $79.20 |
| 100 | $7.18 | $718.00 |
| 500 | $6.55 | $3,275.00 |
| 1,000 | $5.9 | $5,900.00 |
ATSAME53J19A-AF 개요
What is a Cortex-M4F microcontroller? An ARM Cortex-M4F MCU is a 32-bit microcontroller core that combines digital signal processing instructions with a hardware single-precision floating-point unit. In the system hierarchy, the ATSAME53J19A-AF sits at the intersection of microcontroller -> ARM Cortex-M processor -> SAM E53 family -> embedded processing platform, typically used as the main application processor in connected industrial equipment.
Key differentiating features include an integrated 10/100 Ethernet MAC for wired connectivity, a high-speed USB 2.0 Full-Speed PHY, a 12-bit 1 MSPS ADC, dual CAN-FD controllers, and a hardware cryptographic accelerator supporting AES, SHA, and TRNG. The peripheral set also features up to six SERCOM interfaces, an on-board FPU, and a memory protection unit. The 64-pin TQFP-EP package provides manageable thermal characteristics for 120 MHz operation while supporting industrial extended temperature ranges.
The architecture pairs an M4F core with a multi-layer bus matrix that allows simultaneous DMA-driven peripheral activity and CPU execution. The dual-panel Flash with ECC enables robust in-application programming and improved endurance, while SRAM with ECC enhances reliability in safety-conscious designs. This combination of compute, connectivity, and security peripherals allows system consolidation that previously required an MCU plus a separate connectivity IC.
Typical applications include industrial Ethernet nodes, building automation controllers, USB-to-Ethernet bridges, smart sensors with on-device analytics, and low-power HMI panels. In each case the integrated Ethernet MAC and USB PHY reduce BOM, while the cryptographic accelerator offloads secure boot and TLS handshakes from the CPU. Engineers designing with this part also frequently pair it with external PHY transceivers such as the KSZ8061 or LAN8720A for 10/100 BASE-TX physical-layer connection.
When designing with the ATSAME53J19A-AF, verify that your PCB layout allocates sufficient copper around the exposed pad (TQFP-EP variant depending on suffix) to meet thermal targets at 120 MHz with all SERCOM and USB interfaces active. Plan power-rail decoupling with at least one 100 nF X7R per VDD pin plus a bulk 4.7 uF capacitor close to the core supply, and consider using the internal RTC with a 32.768 kHz crystal for accurate timekeeping in sleep modes. This page synthesizes distributor pricing, package-specific alternatives, and PCB layout guidance not found in the manufacturer datasheet alone.
드롭인 대체품: ATSAME53J19A-AF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME53J19A-AF (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet MAC, Core Architecture, USB, Package, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME53J18A-AF
✅ 드롭인✓ 재고 있음
$4.5 / 개
데이터시트 보기 →ATSAME53N19A-AF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAME53J19A-MU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAMD51J19A-AFT
✅ 드롭인✓ 재고 있음
$4.8 / 개
데이터시트 보기 →ATSAME51J19A-AF
✅ 드롭인✓ 재고 있음
$3.85 / 개
데이터시트 보기 →ATSAME53J19A-AF 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M4F (32-bit) with FPU |
| Maximum CPU Frequency | 120 MHz |
| Program Flash Memory | 512 KB (dual-panel, with ECC) |
| SRAM | 256 KB (with ECC) |
| 패키지 | 64-pin TQFP (10x10 mm) |
| Supply Voltage (VDDIO) | 3.3 V typical |
| 동작 온도 | Extended industrial range (per AF suffix) |
| Ethernet MAC | 10/100 Mbps integrated |
| USB | USB 2.0 Full-Speed integrated PHY |
| CAN-FD Controllers | 2 |
| ADC | 12-bit, up to 1 MSPS |
| SERCOM Interfaces | Up to 6 (UART/SPI/I2C configurable) |
| Cryptographic Accelerator | AES, SHA, TRNG |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
ATSAME53J19A-AF 핀 구성
| 핀 1 | PA00 — GPIO/SERCOM1.0/XIN |
| 핀 2 | PA01 — GPIO/SERCOM1.1/XOUT |
| 핀 3 | PA02 — GPIO/AIN0 |
| 핀 4 | PA03 — GPIO/AIN1/REF |
| 핀 5 | VDDIO — I/O supply voltage |
| 핀 6 | GND — Ground |
| 핀 7 | PA04 — GPIO/AIN2 |
| 핀 8 | PA05 — GPIO/AIN3 |
| 핀 9 | PA06 — GPIO/AIN4 |
| 핀 10 | PA07 — GPIO/AIN5 |
| 핀 11 | VDDIN — Main voltage regulator input |
| 핀 12 | GND — Ground |
| 핀 13 | PA08 — GPIO/SERCOM0.0 |
| 핀 14 | PA09 — GPIO/SERCOM0.1 |
| 핀 15 | PA10 — GPIO/SERCOM0.2 |
| 핀 16 | PA11 — GPIO/SERCOM0.3 |
| 핀 17 | PA12 — GPIO/SERCOM2.0 |
| 핀 18 | PA13 — GPIO/SERCOM2.1 |
| 핀 19 | PA14 — GPIO/SERCOM2.2 |
| 핀 20 | PA15 — GPIO/SERCOM2.3 |
| 핀 21 | PA16 — GPIO/SERCOM3.0 |
| 핀 22 | PA17 — GPIO/SERCOM3.1 |
| 핀 23 | PA18 — GPIO/SERCOM3.2 |
| 핀 24 | PA19 — GPIO/SERCOM3.3 |
| 핀 25 | PA20 — GPIO/SERCOM5.2 |
| 핀 26 | PA21 — GPIO/SERCOM5.3 |
| 핀 27 | PA22 — GPIO/SERCOM3.0 |
| 핀 28 | PA23 — GPIO/SERCOM3.1 |
| 핀 29 | PA24 — GPIO/SERCOM4.0 |
| 핀 30 | PA25 — GPIO/SERCOM4.1 |
| 핀 31 | PA27 — GPIO |
| 핀 32 | GND — Ground |
| 핀 33 | VDDIO — I/O supply voltage |
| 핀 34 | PA28 — GPIO |
| 핀 35 | PB00 — GPIO |
| 핀 36 | PB01 — GPIO |
| 핀 37 | PB02 — GPIO/SERCOM5.0 |
| 핀 38 | PB03 — GPIO/SERCOM5.1 |
| 핀 39 | PB04 — GPIO/SERCOM4.0 |
| 핀 40 | PB05 — GPIO/SERCOM4.1 |
| 핀 41 | PB06 — GPIO/SERCOM4.2 |
| 핀 42 | PB07 — GPIO/SERCOM4.3 |
| 핀 43 | PB08 — GPIO/SERCOM4.0 |
| 핀 44 | PB09 — GPIO/SERCOM4.1 |
| 핀 45 | PB10 — GPIO/SERCOM4.2 |
| 핀 46 | PB11 — GPIO/SERCOM4.3 |
| 핀 47 | PB12 — GPIO/SERCOM5.0 |
| 핀 48 | PB13 — GPIO/SERCOM5.1 |
| 핀 49 | PB14 — GPIO/SERCOM5.2 |
| 핀 50 | PB15 — GPIO/SERCOM5.3 |
| 핀 51 | PB16 — GPIO/SERCOM5.0 |
| 핀 52 | PB17 — GPIO/SERCOM5.1 |
| 핀 53 | PB18 — GPIO |
| 핀 54 | PB19 — GPIO |
| 핀 55 | PB20 — GPIO |
| 핀 56 | PB21 — GPIO |
| 핀 57 | PB22 — GPIO |
| 핀 58 | PB23 — GPIO |
| 핀 59 | PB24 — GPIO |
| 핀 60 | PB25 — GPIO |
| 핀 61 | PB26 — GPIO |
| 핀 62 | PB27 — GPIO |
| 핀 63 | RESET — Reset input (active low) |
| 핀 64 | VDDIO — I/O supply voltage |
일반적인 애플리케이션
ATSAME53J19A-AF 적합 용도: 6 애플리케이션s: Industrial Ethernet Node Controller, USB-to-Ethernet Bridge Gateway, Building Automation Controller, Connected Smart Sensor Hub, Low-Power HMI Touch Panel, Secure IoT Edge Device with TLS.
Industrial Ethernet Node Controller
The ATSAME53J19A-AF is well suited to industrial Ethernet nodes such as EtherCAT or PROFINET edge devices. Its 120 MHz Cortex-M4F core with FPU executes real-time Ethernet stacks while the integrated 10/100 Ethernet MAC removes the need for a separate connectivity controller, and the 512 KB dual-panel Flash with ECC stores both application code and secure firmware updates. The two CAN-FD controllers support bridge functions between Ethernet and CAN networks common in factory automation. Typical implementations pair the MCU with a KSZ8061 PHY for 100BASE-TX and add 4.7 uF plus 100 nF decoupling on VDDIO. The hardware AES/SHA accelerator offloads TLS handshakes from the CPU, enabling faster secure boot and authenticated communication without performance penalty.
추천
USB-to-Ethernet Bridge Gateway
The integrated USB 2.0 Full-Speed PHY and 10/100 Ethernet MAC make the ATSAME53J19A-AF ideal for USB-to-Ethernet bridge gateways that connect legacy USB peripherals to a wired network. The 120 MHz M4F core with single-precision FPU can sustain TCP/IP throughput required for industrial tethering and instrumentation bridging, while 256 KB SRAM with ECC provides buffers for protocol stacks without corruption risk. The SERCOM interfaces allow SPI-based external flash for filesystem caching. Design considerations include placing a 24 MHz crystal within 5 mm of the XIN/XOUT pins and adding common-mode chokes on Ethernet differential pairs. The ATSAMD51J19A-AU-EFP variant is a popular companion when lower-speed bridging is acceptable.
추천
Building Automation Controller
For HVAC, lighting, and access-control panels, the ATSAME53J19A-AF delivers the connectivity and security peripherals needed in modern building automation. The Cortex-M4F core runs BACnet or Modbus stacks, the CAN-FD controllers integrate with elevator and access subsystems, and the 12-bit 1 MSPS ADC reads analog sensors such as temperature or CO2 directly. The hardware cryptographic accelerator enables secure boot and TLS for cloud-connected panels, while 256 KB SRAM with ECC maintains data integrity for safety-relevant logging. Engineers typically combine the MCU with a serial NOR flash via SERCOM for OTA update storage, and pair with an ATSAMDA1-XPRO for evaluation.
추천
Connected Smart Sensor Hub
The ATSAME53J19A-AF functions as a smart sensor hub aggregating multiple analog and digital sensors and publishing over Ethernet or USB. Six SERCOM interfaces support SPI or I2C sensors, the 12-bit ADC samples analog channels at up to 1 MSPS, and the hardware TRNG/AES secures wireless key material. The 120 MHz M4F core executes on-sensor analytics such as FFT or vibration analysis that previously required an external DSP. The dual-panel Flash with ECC supports in-field firmware updates, and 256 KB SRAM accommodates real-time buffers without external memory. Design tip: place the MCU's VDDIN decoupling within 3 mm of the pin and route the USB DP/DM pair as a 90 ohm differential.
추천
Low-Power HMI Touch Panel
Touch-enabled HMI panels benefit from the ATSAME53J19A-AF's 120 MHz M4F core for responsive graphics rendering plus the Ethernet MAC for networked panels. The 512 KB Flash stores LVGL or emWin graphics libraries, while 256 KB SRAM holds 16-bit or 24-bit frame buffers for small QVGA displays. The hardware crypto accelerator protects signed UI assets, and the SERCOM interfaces drive SPI displays or I2C touch controllers. The package supports extended industrial temperature operation required in factory and outdoor installations. Typical designs pair the MCU with a TFT driver over SPI and add an external 16 MB QSPI flash for asset storage.
추천
Secure IoT Edge Device with TLS
For IoT edge devices that terminate TLS or perform mutual authentication with cloud services, the ATSAME53J19A-AF integrates the AES, SHA, and TRNG accelerators needed to offload cryptography from the M4F core. The 512 KB Flash stores TLS libraries and X.509 certificates, while 256 KB SRAM with ECC buffers encrypted payloads reliably. The 10/100 Ethernet MAC enables direct cloud connectivity, or the USB PHY supports tethered provisioning during manufacturing. Engineers frequently use the SERCOM interfaces for an external ATECC608B secure element when FIPS-grade key storage is needed. The Cortex-M4F plus hardware crypto combination is rare at this price point, making the SAM E53 a strong choice for retrofit security upgrades.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME53J19A-AF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME53J18A-AF | ATSAME53N19A-AF | ATSAMD51J19A-AFT | ATSAME51J19A-AF |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 512 KB | 256 KB (-50%) | 512 KB | 512 KB | 512 KB |
| SRAM | 256 KB | 128 KB (-50%) | 256 KB | 256 KB | 256 KB |
| Integrated Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | No | No |
| USB PHY | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) |
| CAN-FD Controllers | 2 | 2 | 2 | 1 | 1 |
주요 차별점
- Integrated 10/100 Ethernet MAC plus dual CAN-FD (vs ATSAMD51J19A-AFT)
- Higher memory density at same pin count (vs ATSAME53J18A-AF)
- Hardware AES/SHA/TRNG cryptographic accelerator (vs ATSAME51J19A-AF)
설계 노트
Place at least one 100 nF X7R ceramic decoupling capacitor on every VDDIO and VDDIN pin, with traces shorter than 3 mm to minimize inductance. Add a 4.7 uF bulk capacitor on the main VDDIN rail close to the MCU. The SAM E53's internal voltage regulator supplies the core logic from VDDIN; do not exceed the absolute maximum of 3.8 V. For noise-sensitive analog sampling (12-bit ADC), use a separate analog supply (VDDANA) and tie VDDIO together through ferrite beads to isolate digital switching noise.
Estimated: At 120 MHz with all peripherals active, the SAM E53 core draws approximately 30 mA from VDDIN, dissipating roughly 100 mW. The 64-pin TQFP package has a thermal resistance of approximately 40 C/W theta-JA on a standard 4-layer JEDEC test board. Junction temperature rise above ambient is therefore ~4 C under typical loads; at extended industrial temperatures (105 C ambient) the junction remains within the 125 C maximum rating without a heatsink, but you should still verify with a thermal probe under your worst-case firmware workload.
Route the USB DP/DM pair as a 90 ohm differential with matched length to within 150 mil; keep the pair over a continuous ground reference plane and avoid splits. Place the 12 MHz or 24 MHz crystal (per XOSCCTRL configuration) within 5 mm of the XIN/XOUT pins and guard the traces with ground copper. For Ethernet RMII, route REFCLK with controlled 50 ohm impedance and place the PHY within 50 mm of the MAC pins to keep timing margins. Add a 100 nF cap on each VDDIO pin and consider a common-mode choke on Ethernet TX/RX pairs.
Do not skip configuring the NVMCTRL peripheral for dual-panel Flash mode before performing in-application programming; single-panel writes may fail silently on ECC-protected regions. When migrating from SAM D51 to SAM E53 firmware, verify that the Ethernet MAC and second CAN-FD instances are properly clocked from GCLK3 - the SAM E53 adds an additional clock domain compared to the D51. Finally, always lock the Flash with NVMCTRL.CTRLB after programming to prevent accidental writes.
The SERCOM pads can be assigned to multiple functions; misconfiguration of the peripheral multiplexer is a common source of 'dead' pins. Use Atmel Start or MPLAB Harmony's pin manager to lock the SERCOM pad assignments early. For high-speed SPI to external QSPI flash, add a 33 ohm series resistor near the MCU pin to dampen reflections and keep trace lengths under 25 mm with 50 ohm characteristic impedance.
규정 준수 정보
RoHS compliant per Microchip product page. AEC-Q100 qualification not listed for the AF suffix - check ATSAME53J19A-AUTR automotive variant for AEC-Q100 grade. Lead-free and halogen-free packaging per Microchip material declarations.
