ATSAMG53N19B-AU - 512KB Flash Cortex-M4 MCU 48MHz | Microchip
부품 번호: ATSAMG53N19B-AU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.93 | $5.93 |
| 10 | $5.34 | $53.40 |
| 100 | $4.76 | $476.00 |
| 500 | $4.1 | $2,050.00 |
| 1,000 | $3.5 | $3,500.00 |
ATSAMG53N19B-AU 개요
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core designed by ARM for embedded applications, combining deterministic interrupt response with DSP extensions and an optional single-precision Floating Point Unit. In the broader product taxonomy, it sits below application processors and above 8/16-bit MCUs, occupying the mainstream performance tier for industrial IoT, motor control, and human-machine interface (HMI) designs. The Cortex-M4 core executes the Thumb-2 instruction set, allowing dense code with predictable cycle counts.
Key features of the ATSAMG53N19B-AU include 512KB of in-system programmable Flash for application code, 96KB of SRAM for data and stack, 16KB of additional SRAM for backup retention, and an internal 12 MHz RC oscillator that can be re-calibrated against an external crystal for USB/SERCOM timing accuracy. The device exposes up to 38 GPIO pins organized across multiple peripheral I/O groups, plus a 12-bit 1 Msps ADC, four 16-bit timer/counters, two I2S/TDM interfaces, and a USB 2.0 Full-Speed device/host controller with on-chip transceiver.
Architecturally, the SAM G53 uses a single AHB-Lite bus matrix connecting the Cortex-M4 core to Flash, SRAM, and peripherals through distinct bridges, with a DMA controller (channels for peripheral-to-memory, memory-to-memory, and peripheral-to-peripheral moves) reducing CPU load during data streaming. The integrated FPU accelerates single-precision signal-processing tasks such as audio decimation, sensor fusion, and PID loops in motor control, allowing software implementations that previously required a DSP.
Typical applications include industrial control and sensor hubs, USB peripherals (HID, CDC, audio class), CAN-based building automation nodes, low-cost graphical HMI panels, and consumer audio devices. The 48MHz core and FPU also suit simple digital signal processing such as audio rate conversion, low-bandwidth motion estimation, and audio codec front-ends where deterministic latency matters.
When designing with this part, plan for a 1.62V-3.6V supply rail with a 100nF + 4.7uF decoupling network placed close to the LQFP pins; the LQFP-100 pad layout allows easy 2-layer or 4-layer PCB implementation. Use the on-chip FPU for floating-point DSP but verify that the compiler emits hardware FPU instructions to gain the expected speedup over a Cortex-M3 equivalent.
This page synthesizes distributor pricing, parametric drop-in alternatives sourced from the Microchip SAM G53 family, and practical design notes beyond a raw datasheet reprint.
드롭인 대체품: ATSAMG53N19B-AU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMG53N19B-AU (동일 폼 팩터 및 풋프린트) — 차이점: Program Memory (Flash), USB, ADC, Package, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMG53N19A-AU
✅ 드롭인✓ 재고 있음
$1.05 / 개
데이터시트 보기 →ATSAME53N19A-AU
✅ 드롭인✓ 재고 있음
$5.4 / 개
데이터시트 보기 →ATSAME53N20A-AU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.3 / 개
데이터시트 보기 →ATSAME53N20A-AU-EFP
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.35 / 개
데이터시트 보기 →ATSAME54N19A-AU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.42 / 개
데이터시트 보기 →ATSAME54N19A-AU-EFP
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.28 / 개
데이터시트 보기 →ATSAME54N19A-AUT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.94 / 개
데이터시트 보기 →ATSAMG53N19B-AU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 with FPU |
| Core Architecture | ARM 32-bit |
| Series | SAM G53 |
| 최대 클록 주파수 | 48 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| RAM Size | 96 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| ADC | 12-bit |
| Number of I/Os | 38 |
| 핀 수 | 100 |
| 패키지 | LQFP-100 (14x14 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) |
| Packaging | Tray |
| RoHS 상태 | Compliant |
ATSAMG53N19B-AU lqfp-100 (14x14 mm) 핀 구성 가이드
ATSAMG53N19B-AU(lqfp-100 (14x14 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMG53N19B-AU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMG53N19B-AU 적합 용도: 6 애플리케이션s: USB HID / CDC Peripherals, Industrial Sensor Hubs and CAN Nodes, Audio Decoder / USB Speaker Front-End, Low-Cost Graphical HMI Panels, Home Automation / IoT Edge Nodes, Motor Control and PID Loops.
USB HID / CDC Peripherals
The ATSAMG53N19B-AU is well-matched to USB Full-Speed HID, CDC, and composite-device designs because of its integrated USB 2.0 FS device/host controller with on-chip transceiver. Placed on a 3.3V rail with 1k5 pull-up on D+, the part enumerates without an external PHY. The 48MHz Cortex-M4 with FPU delivers enough throughput for low-rate audio class, mass storage, and HID++ extensions. Practical alternatives like the ATSAME53N19A-AU double the headroom with same-footprint compatibility.
추천
Industrial Sensor Hubs and CAN Nodes
Industrial sensor hubs benefit from the ATSAMG53N19B-AU's 12-bit 1 Msps ADC, four 16-bit timers, CAN controller, multiple SERCOM interfaces, and industrial -40C to +85C temperature grade. The Cortex-M4 FPU accelerates sensor-fusion math, while 96KB SRAM absorbs short DMA bursts from simultaneous ADC and CAN traffic. The wide 1.62V-3.6V supply tolerates 24V-bus-derived rails after a switching converter stage, simplifying industrial power-tree design.
추천
Audio Decoder / USB Speaker Front-End
Audio-class USB speakers benefit from the ATSAMG53N19B-AU's integrated USB Full-Speed, two I2S/TDM interfaces, and 48MHz Cortex-M4 with FPU for software audio decode (e.g., MP3, AAC-LC, or SBC). Internal DMA offloads streaming from the core while the FPU handles resampling. The 96KB SRAM handles audio buffer and decoder stack simultaneously. For higher-end audio, drop in the ATSAME53N19A-AU on the same PCB for 120 MHz headroom.
추천
Low-Cost Graphical HMI Panels
HMI panel designs use the ATSAMG53N19B-AU's SPI/QSPI peripherals to drive small TFTs and touch controllers, with the 12-bit ADC used for backlight feedback and touch sensing. The 512KB Flash accommodates a small GUI library and fonts, while 96KB SRAM holds frame buffers for low-resolution color displays. Pin-multiplex flexibility on the 100-pin LQFP simplifies the parallel/SPI TFT interface and capacitive touch routing on a 2-layer board.
추천
Home Automation / IoT Edge Nodes
Battery-powered IoT edge nodes benefit from the ATSAMG53N19B-AU's 1.62V-3.6V supply, low-power sleep modes, and integrated USB for configuration/charging. The Cortex-M4 with FPU runs local anomaly detection and sensor-fusion before sending compressed data over SPI/I2C to a wireless companion IC. Industrial temperature grade survives outdoor installations, and 512KB Flash is plenty for an RTOS plus application logic. The same-footprint ATSAME53N19A-AU is a painless upgrade if compute demands grow.
추천
Motor Control and PID Loops
Motor control applications benefit from the ATSAMG53N19B-AU's hardware PWM timers, fast 12-bit ADC with DMA support, and floating-point unit for time-critical PID loops. The Cortex-M4 FPU executes single-precision math at hardware speed, reducing ISR latency for FOC and six-step commutation algorithms. The 100-pin LQFP exposes enough I/O for three-phase drivers, encoder feedback, and overcurrent/overvoltage protection in a single chip.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMG53N19B-AU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMG53N19A-AU | ATSAME53N19A-AU | ATSAME53N20A-AU | ATSAME54N19A-AU | ATSAME53N20A-AU-EFP | ATSAME54N19A-AU-EFP | ATSAME54N19A-AUT |
|---|---|---|---|---|---|---|---|---|
| Package | LQFP-100 (14x14 mm) | LQFP-100 - same | LQFP-100 - same | LQFP-100 - same | LQFP-100 - same | LQFP-100 - same | LQFP-100 - same | LQFP-100 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 + FPU | ARM Cortex-M4 + FPU | ARM Cortex-M4 + FPU | ARM Cortex-M4 + FPU | ARM Cortex-M4 + FPU | ARM Cortex-M4 + FPU | ARM Cortex-M4 + FPU | ARM Cortex-M4 + FPU |
| Max Clock Frequency | 48 MHz | 48 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Program Memory (Flash) | 512 KB | 512 KB | 512 KB | 1024 KB | 512 KB | 1024 KB (EFP) | 512 KB (EFP) | 512 KB (tape & reel) |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| ADC | 12-bit 1 Msps | 12-bit 1 Msps | 12-bit 1 Msps | 12-bit 1 Msps | 12-bit 1 Msps + analog features | 12-bit 1 Msps | 12-bit 1 Msps + analog features | 12-bit 1 Msps + analog features |
| USB | USB 2.0 FS host/device, on-chip PHY | USB 2.0 FS host/device | USB 2.0 FS host/device | USB 2.0 FS host/device | USB 2.0 FS host/device | USB 2.0 FS host/device | USB 2.0 FS host/device | USB 2.0 FS host/device |
주요 차별점
- Lower active power vs 120 MHz SAME53 family (vs ATSAME53N19A-AU)
- Larger Flash than SAM3 Cortex-M3 predecessors (vs ATSAM3X8C)
- Pin-compatible upgrade path to SAME53 family (vs ATSAME53N19A-AU)
설계 노트
Place 100nF + 4.7uF decoupling capacitors as close as possible to the VDD pins of the ATSAMG53N19B-AU, with one bulk capacitor per VDD pin group. The LQFP-100 package spreads supply pins around the perimeter; a 2-layer board can satisfy this with carefully placed decoupling caps on the bottom side. Use a star-ground layout for analog VDDANA to avoid injecting digital switching noise into ADC readings; a ferrite bead between digital VDD and analog VDDANA is recommended for precision ADC sampling.
Route the USB DP/DM differential pair with 90 ohms differential impedance and matched length within 2mm of each other; keep the pair on the top side over a continuous ground plane. Use a 1.5kohm pull-up resistor on D+ for Full-Speed device enumeration, and place ESD protection diodes (TVS) within 5mm of the USB connector. For crystal traces (e.g., 12 MHz HSE on XIN/XOUT), keep the traces short, symmetric, and surrounded by a ground pour to minimize load capacitance drift and EMI.
The LQFP-100 package is rated for industrial temperature -40C to +85C with thermal resistance theta_JA on the order of 30-40 C/W on a 2-layer board with minimal copper pour. For higher ambient temperatures or enclosed housings, increase top-layer copper under the exposed thermal dissipation area to keep junction temperature within margin. Add 1.5mm thermal vias on the perimeter of the LQFP-100 footprint to pull heat into inner copper planes. Estimated junction-temperature rise: at 48 MHz with full peripheral activity, the part draws about 30 mA which translates to roughly 3.3V * 0.03A = 100mW, giving about a 4C rise on a typical 4-layer board.
Do not leave the NRST pin floating - install a 10kohm pull-up and an NCP pin-tag reset button or supervisor. When using the on-chip bootloader via ROM (SAM-BA), make sure SWDIO/SWCLK are accessible in production for firmware recovery. Avoid routing I2C lines longer than 100mm without pull-ups; the I2C pads on SAM G53 are 5V-tolerant but not 5V-driving, so level translation is required when interfacing to a 5V master. Do not assume the internal RC oscillator is accurate enough for USB; switch to the 12 MHz HSE crystal at startup and re-calibrate the 48 MHz PLL against it.
규정 준수 정보
RoHS and REACH compliance confirmed for the ATSAMG53 family on the Microchip product page. Industrial temperature grade -40C to +85C suitable for industrial markets. Halogen-free status to be confirmed against the device-specific Material Declaration. AEC-Q100 is not applicable since this is a general-purpose MCU, not an automotive-qualified part.
