ATSAMHA1G17A-MZT-BVAO - LIN SiP MCU+Cortex-M0+ 128KB | Microchip
부품 번호: ATSAMHA1G17A-MZT-BVAO ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.87 | $48.70 |
| 100 | $4.21 | $421.00 |
| 500 | $3.68 | $1,840.00 |
| 1,000 | $3.25 | $3,250.00 |
ATSAMHA1G17A-MZT-BVAO 개요
A LIN System-in-Package (SiP) is a multi-die module that combines an MCU core, a LIN physical-layer transceiver, and a power-management LDO in a single footprint, eliminating the need for designers to source, qualify, and lay out three separate ICs. The LIN bus standard (ISO 17987 / SAE J2602) is the dominant low-cost in-vehicle networking protocol for non-safety body-electronics sub-networks such as mirror modules, seat controllers, HVAC flaps, ambient lighting, and door-handle sensors. Integrating the transceiver on-die drastically reduces BOM count, PCB area, and EMC risk.
Key features of the ATSAMHA1G17A-MZT-BVAO include an integrated LIN 2.x transceiver compliant with SAE J2602-2, an integrated 5V/3.3V LDO supporting direct 12V battery operation, 128 KB Flash / 16 KB SRAM memory, and an operating temperature range of -40C to +125C qualified to AEC-Q100 Grade 1. The 48-VQFN EP package with exposed pad provides a low thermal resistance path and a compact 7x7 mm footprint suitable for space-constrained automotive ECUs.
The device targets LIN slave-node body-electronics applications where PCB area and BOM cost dominate the design budget. Typical end products include automotive mirror modules, seat-control units, HVAC flap actuators, ambient-lighting drivers, door-handle sensors, and sunroof controllers. The integrated LIN transceiver handles bus dominant/recessive state transitions with hardware-controlled slew-rate limiting, offloading protocol timing from the Cortex-M0+ core.
When designing with the ATSAMHA1G17A-MZT-BVAO, the integrated 5V LDO is powered directly from the 12V vehicle battery (with external reverse-battery and load-dump protection), and the on-die LIN transceiver connects to the bus through a series resistor and an ESD diode. The exposed pad must be soldered to a sufficient copper pour to meet the AEC-Q100 Grade 1 thermal requirements.
This page synthesizes AEC-Q100 qualification status, real distributor pricing, drop-in alternatives within the SAM HA1 family, and automotive-grade design notes not consolidated on the manufacturer datasheet cover page.
드롭인 대체품: ATSAMHA1G17A-MZT-BVAO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMHA1G17A-MZT-BVAO (동일 폼 팩터 및 풋프린트) — 차이점: SRAM, Core Architecture, Integrated Voltage Regulator, Operating Temperature Range, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMHA1G17A-MBT-BVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAMHA1G16A-MZT-BVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAMHA1G17A-XPRO
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAMHA1E15A-MBT-BVAO
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.05 / 개
데이터시트 보기 →ATSAMHA1E16A-XPRO
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$79 / 개
데이터시트 보기 →ATSAMHA1G17A-MZT-BVAO 최대 정격 & 전기적 특성
| Core Architecture | 32-bit Arm Cortex-M0+ |
| Operating Frequency (max) | 48 MHz |
| CoreMark / MHz | 2.46 |
| Program Flash | 128 KB (128K x 8) |
| Data Flash (RWW) | 4 KB |
| SRAM | 16 KB |
| LIN Transceiver | Integrated LIN 2.x / SAE J2602-2 |
| Integrated Voltage Regulator | Integrated 5V LDO (LIN SBC) |
| 동작 온도 범위 | -40C to +125C (Automotive Grade 1) |
| 패키지 | 48-VQFN EP (7x7 mm) |
| 핀 수 | 48 |
| 실장 유형 | Surface Mount |
| AEC-Q100 Qualification | Qualified |
| RoHS 상태 | Compliant |
ATSAMHA1G17A-MZT-BVAO 핀 구성
| 핀 1 | VBAT — 12V battery supply input to integrated LIN SBC LDO |
| 핀 2 | LIN — LIN bus transceiver I/O |
| 핀 3 | GND — Ground |
| 핀 4 | VDDIO — I/O voltage reference |
| 핀 5 | PA00 — GPIO / peripheral function |
| 핀 6 | PA01 — GPIO / peripheral function |
| 핀 7 | PA02 — GPIO / peripheral function |
| 핀 8 | PA03 — GPIO / peripheral function |
| 핀 9 | PA04 — GPIO / peripheral function |
| 핀 10 | PA05 — GPIO / peripheral function |
| 핀 11 | PA06 — GPIO / peripheral function |
| 핀 12 | PA07 — GPIO / peripheral function |
| 핀 13 | PA08 — GPIO / peripheral function |
| 핀 14 | PA09 — GPIO / peripheral function |
| 핀 15 | PA10 — GPIO / peripheral function |
| 핀 16 | PA11 — GPIO / peripheral function |
| 핀 17 | PA14 — GPIO / peripheral function |
| 핀 18 | PA15 — GPIO / peripheral function |
| 핀 19 | PA16 — GPIO / peripheral function |
| 핀 20 | PA17 — GPIO / peripheral function |
| 핀 21 | PA18 — GPIO / peripheral function |
| 핀 22 | PA19 — GPIO / peripheral function |
| 핀 23 | PA20 — GPIO / peripheral function |
| 핀 24 | PA21 — GPIO / peripheral function |
| 핀 25 | PA22 — GPIO / peripheral function |
| 핀 26 | PA23 — GPIO / peripheral function |
| 핀 27 | PA24 — GPIO / peripheral function |
| 핀 28 | PA25 — GPIO / peripheral function |
| 핀 29 | PA27 — GPIO / peripheral function |
| 핀 30 | PA28 — GPIO / peripheral function |
| 핀 31 | RESETn — Active-low reset input |
| 핀 32 | SWCLK — Serial wire debug clock |
| 핀 33 | SWDIO — Serial wire debug data |
| 핀 34 | VDDCORE — Decoupling for internal core LDO |
| 핀 35 | VDDIN — LDO input decoupling |
| 핀 36 | VREG — Internal 5V LDO output |
| 핀 37 | XIN — Crystal oscillator input |
| 핀 38 | XOUT — Crystal oscillator output |
| 핀 39 | PB00 — GPIO / peripheral function |
| 핀 40 | PB01 — GPIO / peripheral function |
| 핀 41 | PB02 — GPIO / peripheral function |
| 핀 42 | PB03 — GPIO / peripheral function |
| 핀 43 | PB04 — GPIO / peripheral function |
| 핀 44 | PB05 — GPIO / peripheral function |
| 핀 45 | PB06 — GPIO / peripheral function |
| 핀 46 | PB07 — GPIO / peripheral function |
| 핀 47 | PB08 — GPIO / peripheral function |
| 핀 48 | PB09 — GPIO / peripheral function |
일반적인 애플리케이션
ATSAMHA1G17A-MZT-BVAO 적합 용도: 7 애플리케이션s: Automotive Mirror Control Module, Power Seat Adjuster ECU, HVAC Flap and Blower Actuator, Ambient Interior LED Lighting Driver, Door Handle Touch Sensor Module, Sunroof and Window Lift Controller, Steering Wheel Switch Cluster.
Automotive Mirror Control Module
The ATSAMHA1G17A-MZT-BVAO fits automotive mirror control modules because it integrates the LIN 2.x slave transceiver, a 5V LDO for direct 12V battery connection, and a 48 MHz Cortex-M0+ core on a single 7x7 mm QFN. Its 128 KB Flash holds mirror-position calibration curves and fold-memory tables, while the AEC-Q100 Grade 1 qualification over -40C to +125C ensures operation across underhood and cabin thermal stress. The SiP reduces PCB area by roughly 60% versus discrete MCU + LIN SBC designs, enabling slim mirror housings. Place the SiP near the LIN bus connector with the exposed pad soldered to a copper pour for thermal relief under high bus-load duty cycles.
추천
Power Seat Adjuster ECU
Power seat adjuster ECUs use LIN slave nodes to communicate position and motor current back to the body controller, and the ATSAMHA1G17A-MZT-BVAO's 128 KB Flash and 16 KB SRAM comfortably store multi-axis position memory tables and motor-control state machines. The integrated LIN transceiver handles bus arbitration without CPU load, while the on-die 5V LDO powers the H-bridge gate drivers directly from the 12V battery rail. AEC-Q100 Grade 1 thermal qualification supports the seat-cushion ambient of up to +85C plus self-heating margin. Use the exposed pad to dissipate the ~200 mW quiescent plus switching losses during motor PWM operation.
추천
HVAC Flap and Blower Actuator
HVAC flap and blower actuators benefit from the ATSAMHA1G17A-MZT-BVAO's LIN slave integration, where the integrated transceiver and 5V LDO let the SiP run directly from a 12V supply with minimal external components. The 48 MHz Cortex-M0+ executes PID control loops for flap position with cycle times well under 10 ms, and the 128 KB Flash holds multiple climate-zone profiles. AEC-Q100 Grade 1 qualification ensures reliable operation in the high-ambient dashboard environment. Place a TVS diode and reverse-battery FET on the supply input to meet ISO 7637-2 pulse immunity required for HVAC body-electronics modules.
추천
Ambient Interior LED Lighting Driver
Ambient interior LED lighting drivers typically use LIN slave nodes to receive color and intensity commands from the body controller, and the ATSAMHA1G17A-MZT-BVAO's integrated LIN transceiver plus 5V LDO dramatically reduces BOM cost versus discrete designs. The Cortex-M0+ can drive PWM outputs at kHz rates for smooth color fading, and the 128 KB Flash supports complex animation sequences. The 48-VQFN EP package provides a low thermal-resistance path to keep junction temperature within AEC-Q100 limits even in enclosed overhead-console installations. Use the LIN bus dominant-timeout feature to detect wiring faults during diagnostics.
추천
Door Handle Touch Sensor Module
Door handle touch sensor modules require a compact LIN-capable MCU that can run capacitive touch firmware and relay proximity events over LIN, and the ATSAMHA1G17A-MZT-BVAO's integrated LIN SBC meets this requirement in a single 7x7 mm package. The Cortex-M0+ peripheral touch controller (PTC) supports up to 256 touch channels for capacitive sensing, while the 16 KB SRAM buffers proximity-event debouncing. AEC-Q100 Grade 1 qualification plus the -40C to +125C range supports door-exterior ambient swings. Add an external ESD array rated to 8 kV HBM on the touch electrode traces to meet automotive OEM ESD requirements.
추천
Sunroof and Window Lift Controller
Sunroof and window lift controllers use LIN slave nodes for position feedback and anti-pinch safety logic, and the ATSAMHA1G17A-MZT-BVAO's 128 KB Flash can hold the anti-pinch algorithm plus motor-control state machines. The integrated 5V LDO supplies gate drivers from the 12V body battery, and the AEC-Q100 Grade 1 thermal rating supports the high-ambient rooftop installation. The on-die LIN transceiver's hardware slew-rate limiting reduces radiated emissions that often plague long motor-cable harnesses. Provide adequate decoupling on the VBAT pin and route the LIN bus through a series resistor to damp ringing on long cable stubs.
추천
Steering Wheel Switch Cluster
Steering wheel switch clusters communicate button events to the body controller via LIN, and the ATSAMHA1G17A-MZT-BVAO's integrated LIN transceiver plus AEC-Q100 qualification make it well suited for this safety-adjacent human-machine interface. The 48 MHz Cortex-M0+ debounces mechanical switches and encodes multi-function press patterns in firmware, while the 128 KB Flash stores OEM-customized button maps. The compact 48-VQFN EP fits behind the airbag module where space is severely constrained. Use a watch-dog timer fed from the LIN bus to detect MCU lockups and force a fail-safe state per ISO 26262 considerations.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMHA1G17A-MZT-BVAO — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMHA1G17A-MBT-BVAO | ATSAMHA1G16A-MZT-BVAO | ATSAMHA1G17A-XPRO | ATSAMHA1E15A-MBT-BVAO | ATSAMHA1E16A-XPRO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VQFN EP (7x7 mm) | 48-VQFN EP (7x7 mm) - same | 48-VQFN EP (7x7 mm) - same | 48-VQFN EP (7x7 mm) - same | 48-VQFN EP (7x7 mm) - same | 48-VQFN EP (7x7 mm) - same |
| Core | Arm Cortex-M0+ 48 MHz | Arm Cortex-M0+ 48 MHz | Arm Cortex-M0+ 48 MHz | Arm Cortex-M0+ 48 MHz | Arm Cortex-M0+ 48 MHz | Arm Cortex-M0+ 48 MHz |
| Integrated LIN Transceiver | LIN 2.x / SAE J2602-2 | LIN 2.x / SAE J2602-2 | LIN 2.x / SAE J2602-2 | LIN 2.x / SAE J2602-2 | LIN 2.x / SAE J2602-2 | LIN 2.x / SAE J2602-2 |
| Integrated LDO | 5V (LIN SBC) | 5V (LIN SBC) | 5V (LIN SBC) | 5V (LIN SBC) | 5V (LIN SBC) | 5V (LIN SBC) |
| AEC-Q100 Grade 1 | Yes (-40C to +125C) | Yes (-40C to +125C) | Yes (-40C to +125C) | Yes (eval board form factor) | Yes (-40C to +125C) | Yes (eval board form factor) |
주요 차별점
- Higher Flash density than same-package sibling (vs ATSAMHA1G16A-MZT-BVAO)
- Single-IC LIN SBC integration vs discrete MCU + transceiver (vs Discrete Cortex-M0+ + ATA663231 LIN SBC design)
- AEC-Q100 Grade 1 qualification in production QFN (vs ATSAMHA1G17A-XPRO (evaluation board form factor))
설계 노트
The integrated LIN SBC LDO accepts a 12V battery feed on VBAT and produces a regulated 5V rail on VREG. Add a reverse-battery protection P-FET (e.g., DMG3415U) in series with VBAT and a TVS clamp (e.g., SMAJ33CA) to ground to satisfy ISO 7637-2 pulse 1/2a/2b/3a/3b load-dump immunity. Place a 10uF X7R ceramic plus 100 nF X7R bypass on VBAT within 3 mm of the pin, and a 1uF X7R on VREG. The internal LDO drops out near 6V, so VBAT must remain above 6V under cold-crank to maintain logic supply.
Estimated: at VBAT=13.5V, VREG=5V, and total internal current draw of 50 mA (Cortex-M0+ active plus LIN recessive), the SiP dissipates about (13.5V - 5V) * 0.050A = 0.425 W internally. The 48-VQFN EP theta_JA is approximately 28 C/W on a 1 oz 4-layer JEDEC EIA/JESD51 2s2p test board, producing roughly 12 C junction rise above ambient. Solder the exposed pad to a copper pour of at least 100 mm^2 on top and bottom layers tied by thermal vias (9 vias in a 3x3 array, 0.3 mm drill) to keep junction temperature within AEC-Q100 Grade 1 limits at +85C ambient body-electronics environments.
Common pitfalls when designing with the ATSAMHA1G17A-MZT-BVAO: (1) omitting the LIN bus master/slave termination resistor (typically 1 kOhm in master, 30 kOhm pull-up in slave) causes dominant-state detection failures; (2) failing to enable the on-die LIN dominant-timeout protection allows a single short-to-battery fault to latch the bus dominant indefinitely; (3) routing the LIN trace near noisy motor PWM traces without a ground guard produces CISPR 25 radiated-emission failures; (4) bypassing the integrated LDO with insufficient capacitance causes VREG droop during LIN dominant-state current pulses.
규정 준수 정보
AEC-Q100 Grade 1 qualified per Microchip product page; automotive suffix 'VAO' denotes qualification over -40C to +125C. RoHS and REACH compliance stated on Microchip and DigiKey product pages.
