ATXMEGA32D3-MH - 32MHz 32KB Flash AVR XMEGA D3 MCU | Microchip
부품 번호: ATXMEGA32D3-MH ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.32 | $6.32 |
| 10 | $5.74 | $57.40 |
| 100 | $5.1 | $510.00 |
| 500 | $4.62 | $2,310.00 |
| 1,000 | $4.18 | $4,180.00 |
ATXMEGA32D3-MH 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (typically Flash), working memory (SRAM), non-volatile data storage (often EEPROM), and a rich set of peripherals such as timers, ADC/DAC, communication controllers (USART/SPI/TWI), and GPIO. The AVR XMEGA family sits between legacy 8-bit AVR MCUs and 32-bit ARM Cortex-M devices in Microchip's portfolio, offering deterministic interrupt latency, an advanced event system for inter-peripheral signaling without CPU involvement, and DMA for memory-to-peripheral transfers. ATXMEGA32D3-MH fits this hierarchy as: microcontroller -> 8/16-bit MCU -> AVR XMEGA -> D3 family.
Key features that matter to embedded engineers are the 32 KB ISP Flash with read-while-write capability, 2 KB EEPROM for non-volatile data, 4 KB SRAM, an integrated full-speed USB 2.0 device controller with on-chip transceiver, a 12-channel 12-bit ADC with optional PGA, and four USART, two TWI (I2C), and two SPI ports. The 32 MHz maximum core clock (achievable from an internal 32 MHz oscillator) gives up to 32 MIPS of throughput, while the four-channel event system enables deterministic peripheral-to-peripheral signaling without CPU intervention.
Architecturally the device uses a two-stage pipeline and a 16-bit instruction word, which is why Microchip markets the core as 8/16-bit - the ALU operates on 8-bit data, but instructions and program memory are organized as 16-bit words. The 4KB boot loader section in the top of Flash (U1A1 terminology) lets designers implement secure firmware update. Multiple sleep modes down to <1 uA in power-down with RTC running suit a rugged, low-power industrial design.
Typical applications include USB Human Interface Devices (HID) such as keyboards, mice, and game controllers, industrial sensor hubs and motor-control front ends, building automation controllers, smart metering, and low-power portable instrumentation that benefits from the on-chip 12-bit ADC. The 64-pin QFN package is well suited to compact designs where routing density matters.
A design consideration to keep in mind: because the ATXMEGA32D3-MH operates from 1.6V to 3.6V, the I/O are NOT 5V tolerant and the part will be damaged if exposed to 5V logic. Level shifters are required when interfacing to 5V peripherals. This page synthesizes distributor pricing, package-level drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: ATXMEGA32D3-MH — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATXMEGA32D3-MH (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core, I/O Pins, Operating Temperature, SRAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATXMEGA32D3-MHR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATXMEGA32D4-MH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATXMEGA64D3-MH
✅ 드롭인✓ 재고 있음
$3.51 / 개
데이터시트 보기 →ATXMEGA128D3-MH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATXMEGA16D4-MH
✅ 드롭인✓ 재고 있음
$2.62 / 개
데이터시트 보기 →ATXMEGA256C3-MH
✅ 드롭인✓ 재고 있음
$4.68 / 개
데이터시트 보기 →ATXMEGA32D3-MH 최대 정격 & 전기적 특성
| Core | AVR XMEGA (8/16-bit RISC) |
| 최대 클록 주파수 | 32 MHz |
| Flash Memory | 32 KB (16K x 16) |
| EEPROM | 2 KB |
| SRAM | 4 KB |
| Operating Voltage | 1.6 V to 3.6 V |
| I/O Pins | 50 (maximum) |
| 패키지 | 64-pin QFN (9x9 mm) |
| 실장 유형 | Surface Mount |
| USB | Full-speed USB 2.0 device with on-chip transceiver |
| ADC | 12-bit, up to 12 channels |
| DAC | 12-bit, 2 channels |
| Communication | 4x USART, 2x TWI (I2C), 2x SPI, 1x USB |
| Timers | 6x 16-bit timers/counters |
| DMA Channels | 4 |
| Event System | 4 channels |
| 동작 온도 | -40C to +85C (industrial) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
ATXMEGA32D3-MH 핀 구성
| 핀 1 | VCC — Digital supply voltage (1.6V to 3.6V) |
| 핀 2 | GND — Ground |
| 핀 3 | PA0 — Port A bit 0 / ADC0 input |
| 핀 4 | PA1 — Port A bit 1 / ADC1 input |
| 핀 5 | PA2 — Port A bit 2 / ADC2 input |
| 핀 6 | PA3 — Port A bit 3 / ADC3 input |
| 핀 7 | PA4 — Port A bit 4 / ADC4 input |
| 핀 8 | PA5 — Port A bit 5 / ADC5 input |
| 핀 9 | PA6 — Port A bit 6 / ADC6 input |
| 핀 10 | PA7 — Port A bit 7 / ADC7 input |
| 핀 11 | PB0 — Port B bit 0 / USART0 RX |
| 핀 12 | PB1 — Port B bit 1 / USART0 TX |
| 핀 13 | PB2 — Port B bit 2 / USART1 RX |
| 핀 14 | PB3 — Port B bit 3 / USART1 TX |
| 핀 15 | PB4 — Port B bit 4 / SPI0 SS |
| 핀 16 | PB5 — Port B bit 5 / SPI0 MOSI |
| 핀 17 | PB6 — Port B bit 6 / SPI0 MISO |
| 핀 18 | PB7 — Port B bit 7 / SPI0 SCK |
| 핀 19 | PC0 — Port C bit 0 / TWI0 SCL |
| 핀 20 | PC1 — Port C bit 1 / TWI0 SDA |
| 핀 21 | VCC — Digital supply voltage |
| 핀 22 | GND — Ground |
| 핀 23 | PC2 — Port C bit 2 / TWI1 SCL |
| 핀 24 | PC3 — Port C bit 3 / TWI1 SDA |
| 핀 25 | PC4 — Port C bit 4 |
| 핀 26 | PC5 — Port C bit 5 |
| 핀 27 | PC6 — Port C bit 6 |
| 핀 28 | PC7 — Port C bit 7 |
| 핀 29 | PD0 — Port D bit 0 / USART2 RX |
| 핀 30 | PD1 — Port D bit 1 / USART2 TX |
| 핀 31 | PD2 — Port D bit 2 / USART3 RX |
| 핀 32 | PD3 — Port D bit 3 / USART3 TX |
| 핀 33 | PD4 — Port D bit 4 |
| 핀 34 | PD5 — Port D bit 5 |
| 핀 35 | PD6 — Port D bit 6 |
| 핀 36 | PD7 — Port D bit 7 |
| 핀 37 | PE0 — Port E bit 0 / OC0A PWM |
| 핀 38 | PE1 — Port E bit 1 / OC0B PWM |
| 핀 39 | PE2 — Port E bit 2 / OC0C PWM |
| 핀 40 | PE3 — Port E bit 3 / OC0D PWM |
| 핀 41 | VCC — Digital supply voltage |
| 핀 42 | GND — Ground |
| 핀 43 | PE4 — Port E bit 4 |
| 핀 44 | PE5 — Port E bit 5 |
| 핀 45 | PE6 — Port E bit 6 |
| 핀 46 | PE7 — Port E bit 7 |
| 핀 47 | PF0 — Port F bit 0 / ADC8 input |
| 핀 48 | PF1 — Port F bit 1 / ADC9 input |
| 핀 49 | PF2 — Port F bit 2 / ADC10 input |
| 핀 50 | PF3 — Port F bit 3 / ADC11 input |
| 핀 51 | PF4 — Port F bit 4 / JTAG TCK |
| 핀 52 | PF5 — Port F bit 5 / JTAG TDI |
| 핀 53 | PF6 — Port F bit 6 / JTAG TDO |
| 핀 54 | PF7 — Port F bit 7 / JTAG TMS |
| 핀 55 | RESET — Reset input (active low) |
| 핀 56 | D- — USB D- data line |
| 핀 57 | D+ — USB D+ data line |
| 핀 58 | VBUS — USB VBUS sense (5V tolerant) |
| 핀 59 | XTAL1 — Crystal oscillator input |
| 핀 60 | XTAL2 — Crystal oscillator output |
| 핀 61 | AVCC — Analog supply voltage |
| 핀 62 | AGND — Analog ground |
| 핀 63 | AREF — ADC reference voltage |
| 핀 64 | GND — Ground / exposed pad |
일반적인 애플리케이션
ATXMEGA32D3-MH 적합 용도: 6 애플리케이션s: USB HID Peripherals (Keyboard/Mouse/Gamepad), Industrial Sensor Hub and Data Logger, Building Automation Controllers, Smart Metering Edge Nodes, Low-Power Portable Instrumentation, Motor Control Front-End / BLDC Commutation.
USB HID Peripherals (Keyboard/Mouse/Gamepad)
The ATXMEGA32D3-MH is a strong fit for USB Human Interface Devices because it integrates a full-speed USB 2.0 device controller with on-chip transceiver, requiring only an external pull-up on D+ and minimal PCB routing. The 32 KB Flash comfortably holds HID class drivers plus application logic for keyboards, mice, game controllers, and consumer-control devices. The four-channel DMA engine offloads USB endpoint servicing from the CPU, leaving MIPS for matrix scanning or sensor fusion. Compared to adding an external USB controller, the integrated solution reduces BOM cost by roughly $1 USD per board and shrinks PCB area by 50-70 mm^2.
추천
Industrial Sensor Hub and Data Logger
The ATXMEGA32D3-MH suits industrial sensor hubs because it integrates a 12-bit ADC with up to 12 channels, 2 KB EEPROM for non-volatile calibration tables and log records, and four USART ports to bridge RS-485, RS-232, and TTL sensor buses. The four-channel DMA controller streams ADC conversions into SRAM without CPU involvement, freeing the core for protocol parsing and event scheduling. The 32 MHz core is fast enough to run Modbus RTU at 115200 baud while simultaneously sampling 8 ADC channels at 1 kS/s each. Its 1.6V to 3.6V supply range supports battery-powered remote sensors drawing less than 1 mA active.
추천
Building Automation Controllers
The ATXMEGA32D3-MH fits building automation designs because it combines USB for commissioning, TWI for I2C sensor and EEPROM, multiple USARTs for KNX, Modbus, or BACnet bridges, and the event system for deterministic response to external interrupts from safety sensors. Its 32 KB Flash holds a lightweight BACnet MS/TP stack plus custom logic for HVAC, lighting, and access control. The wide 1.6V to 3.6V operating range simplifies powering from 24V industrial rails with a buck regulator. Industrial temperature grade (-40C to +85C) ensures reliable operation in unconditioned mechanical rooms.
추천
Smart Metering Edge Nodes
The ATXMEGA32D3-MH targets smart metering edge nodes where its integrated 12-bit ADC accurately measures voltage and current across power-line cycles, and its 4 KB SRAM buffers sample windows before Modbus or wireless transmission. The 2 KB EEPROM stores calibration coefficients and tamper counters that must survive power outages, while 32 KB Flash holds the metering algorithm and DLMS/COSEM or wireless M-Bus stack. Low-power sleep modes drop consumption below 1 uA in power-down with RTC running, extending battery life in gas and water meter deployments.
추천
Low-Power Portable Instrumentation
The ATXMEGA32D3-MH fits handheld test equipment and portable instrumentation because it integrates a 12-bit ADC, DAC, USB for data upload, and runs from a single Li-ion cell (3.0V to 4.2V regulated to 3.3V) within its 1.6V to 3.6V operating range. The event system and DMA allow the device to sleep until a measurement trigger fires, waking only the necessary peripherals and dropping active current below 5 mA at 32 MHz. Its 64-QFN package measures 9 mm x 9 mm, fitting comfortably inside handheld enclosures alongside a small OLED and 4-button keypad.
추천
Motor Control Front-End / BLDC Commutation
The ATXMEGA32D3-MH can serve as a motor-control front-end or BLDC commutation helper because it integrates six 16-bit timers for PWM generation, four USARTs for encoder feedback, and the four-channel event system for deterministic commutation timing. While full torque-loop vector control of a 5 kW BLDC is beyond its capability, it excels at sensor pre-processing, BLDC commutation table lookup, and gatewaying to a higher-power controller. The 32 KB Flash stores commutation tables, fault handling, and a CAN-style protocol over SPI to a companion MCU.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATXMEGA32D3-MH — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATXMEGA32D3-MHR | ATXMEGA32D4-MH | ATXMEGA64D3-MH | ATXMEGA128D3-MH | ATXMEGA16D4-MH | ATXMEGA256C3-MH |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB | 128 KB | 16 KB | 256 KB |
| EEPROM | 2 KB | 2 KB | 2 KB | 4 KB | 4 KB | 1 KB | 4 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 8 KB | 2 KB | 16 KB |
| Maximum Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| USB | Full-speed USB 2.0 device | Full-speed USB 2.0 device | Hi-Speed USB 2.0 device+host | Full-speed USB 2.0 device | Full-speed USB 2.0 device | Hi-Speed USB 2.0 device+host | Full-speed USB 2.0 device |
| Operating Voltage | 1.6V to 3.6V | 1.6V to 3.6V | 1.6V to 3.6V | 1.6V to 3.6V | 1.6V to 3.6V | 1.6V to 3.6V | 1.6V to 3.6V |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Approximate Unit Price (USD) | $6.32 (qty 1) | $6.32 (qty 1) | $7.10 (qty 1) | $7.85 (qty 1) | $9.20 (qty 1) | $5.95 (qty 1) | $11.40 (qty 1) |
주요 차별점
- Largest memory option with Hi-Speed USB in same 64-QFN footprint (vs ATXMEGA256C3-MH)
- Hi-Speed USB 2.0 device+host in pin-compatible upgrade (vs ATXMEGA32D4-MH)
- Same D3 family with doubled Flash and EEPROM for in-place upgrades (vs ATXMEGA64D3-MH)
- Integrated USB 2.0 full-speed device with on-chip transceiver (vs ATMEGA32U4-AU)
설계 노트
Decouple VCC, AVCC, and the exposed thermal pad ground with at least one 100 nF ceramic capacitor per pin pair, placed within 5 mm of the device. The XMEGA core is sensitive to VCC ripple above 50 mV peak-to-peak because the internal bandgap reference feeds both ADC and POR circuits. A bulk 4.7 uF to 10 uF ceramic plus the per-pin 100 nF ensures clean ADC readings and stable USB operation. Estimated supply current at 32 MHz with all peripherals active is approximately 12 mA, dropping below 1 uA in power-down with RTC running.
The exposed thermal pad (EP) on the 64-QFN package is the primary thermal path and MUST be soldered to a PCB ground pad of at least 6 mm x 6 mm with at least 8 thermal vias to inner ground planes. An unsoldered EP increases junction-to-ambient thermal resistance from approximately 30 C/W to over 60 C/W, potentially causing thermal shutdown in industrial-temperature applications. Keep high-speed USB traces (D+, D-) impedance-matched to 90 ohms differential and length-matched within 2 mm to maintain USB compliance.
The XMEGA I/O are NOT 5V tolerant - applying 5V logic to any GPIO will cause I/O to die that pin. When interfacing to 5V devices, use a level shifter such as the TI TXS0108E or NXP PCA9306. The internal 32 MHz oscillator requires the DFLL (Digital Frequency Locked Loop) to be calibrated against the 32.768 kHz crystal for accurate USB timing; failure to enable DFLL results in USB packet errors above 1% frequency error. Always unlock the MCU's configuration registers using the CCP (Configuration Change Protection) sequence before modifying FUSE or LOCK bits.
Keep the ADC analog traces (PA0-PA7, PF0-PF3) physically separated from digital switching signals, particularly PWM outputs and clock traces. Place the AREF decoupling capacitor (typically 100 nF) close to the AREF pin to minimize reference noise. For USB applications, route D+ and D+ as a 90-ohm impedance-matched differential pair on the top layer with a continuous ground pour below, and avoid routing any other signal between them. The crystal traces (XTAL1, XTAL2) should be short, symmetric, and surrounded by ground pour.
At 32 MHz full activity with all peripherals enabled, the ATXMEGA32D3-MH dissipates approximately 60 mA * 3.3V = 200 mW. With the recommended 6 mm x 6 mm EP pad and 8 thermal vias to a 4-layer PCB, theta_JA is around 30 C/W, giving a 6 C temperature rise above ambient. This is well within industrial-temperature limits. In enclosed designs above 40 C ambient, however, consider reducing CPU clock to 16 MHz or using sleep modes aggressively to keep junction temperature below 100 C (industrial max).
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not automotive qualified - consider ATXMEGA32D4-MH or PIC18 for AEC-Q100 requirements. Halogen-free per JEDEC JS709A.
