Microchip Technology

ATXMEGA32D3-MH - 32MHz 32KB Flash AVR XMEGA D3 MCU | Microchip

MPN: ATXMEGA32D3-MH ✓ Active
In Stock Ships in 1-3 business days
1.6 V to 3.6 V Vdss 64-pin QFN (9x9 mm) Package 32 MHz Speed 32 KB (16K x 16) Memory
From $4.18 USD / Unit
MOQ: 1 |
Price updated: 2026-10-06
Volume Pricing
Qty Unit Price Extended
1 $6.32 $6.32
10 $5.74 $57.40
100 $5.1 $510.00
500 $4.62 $2,310.00
1,000 $4.18 $4,180.00
ℹ️ All prices are in USD

ATXMEGA32D3-MH Overview

The Microchip Technology ATXMEGA32D3-MH is an 8/16-bit AVR XMEGA D3 microcontroller integrating 32KB of in-system programmable Flash, 2KB EEPROM, and 4KB SRAM in a 64-lead QFN (9x9 mm) package. It operates at up to 32 MHz from a 1.6V to 3.6V supply, runs the high-performance 8/16-bit AVR RISC core, and exposes up to 50 general-purpose I/O pins together with a four-channel event system, programmable multi-level interrupt controller, and full-speed USB device support. According to the Microchip product page for ATxmega32D3, the part is positioned as a low-power, high-performance member of the AVR XMEGA family.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (typically Flash), working memory (SRAM), non-volatile data storage (often EEPROM), and a rich set of peripherals such as timers, ADC/DAC, communication controllers (USART/SPI/TWI), and GPIO. The AVR XMEGA family sits between legacy 8-bit AVR MCUs and 32-bit ARM Cortex-M devices in Microchip's portfolio, offering deterministic interrupt latency, an advanced event system for inter-peripheral signaling without CPU involvement, and DMA for memory-to-peripheral transfers. ATXMEGA32D3-MH fits this hierarchy as: microcontroller -> 8/16-bit MCU -> AVR XMEGA -> D3 family.

Key features that matter to embedded engineers are the 32 KB ISP Flash with read-while-write capability, 2 KB EEPROM for non-volatile data, 4 KB SRAM, an integrated full-speed USB 2.0 device controller with on-chip transceiver, a 12-channel 12-bit ADC with optional PGA, and four USART, two TWI (I2C), and two SPI ports. The 32 MHz maximum core clock (achievable from an internal 32 MHz oscillator) gives up to 32 MIPS of throughput, while the four-channel event system enables deterministic peripheral-to-peripheral signaling without CPU intervention.

Architecturally the device uses a two-stage pipeline and a 16-bit instruction word, which is why Microchip markets the core as 8/16-bit - the ALU operates on 8-bit data, but instructions and program memory are organized as 16-bit words. The 4KB boot loader section in the top of Flash (U1A1 terminology) lets designers implement secure firmware update. Multiple sleep modes down to <1 uA in power-down with RTC running suit a rugged, low-power industrial design.

Typical applications include USB Human Interface Devices (HID) such as keyboards, mice, and game controllers, industrial sensor hubs and motor-control front ends, building automation controllers, smart metering, and low-power portable instrumentation that benefits from the on-chip 12-bit ADC. The 64-pin QFN package is well suited to compact designs where routing density matters.

A design consideration to keep in mind: because the ATXMEGA32D3-MH operates from 1.6V to 3.6V, the I/O are NOT 5V tolerant and the part will be damaged if exposed to 5V logic. Level shifters are required when interfacing to 5V peripherals. This page synthesizes distributor pricing, package-level drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.

Drop-in alternatives for ATXMEGA32D3-MH — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATXMEGA32D3-MH (same form factor and footprint) — differing in Package, Core, I/O Pins, Operating Temperature, SRAM.

Microchip Technology
Package: 44-VQFN (7x7 mm) with exposed pad
Core: AVR XMEGA D4 (8/16-bit RISC)
I/O Pins: 34 programmable
Compare with ATXMEGA32D3-MH →
Microchip Technology
Package: 64-pin QFN (9x9 mm) with exposed pad
Core: AVR (8/16-bit)
Operating Temperature: -40 C to +85 C
Compare with ATXMEGA32D3-MH →
Microchip Technology
Package: 44-VQFN (7x7 mm)
Core: AVR XMEGA (8/16-bit)
Compare with ATXMEGA32D3-MH →
Microchip Technology
Package: 64-pin QFN (9x9 mm) with EP
I/O Pins: 34
Compare with ATXMEGA32D3-MH →
Microchip Technology
Package: 64-VFQFN / 64-QFN (9x9 mm) with exposed pad
I/O Pins: 34 to 50 (package-dependent)
Compare with ATXMEGA32D3-MH →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

ATXMEGA32D3-MHR

✅ Drop-In
📦 64-QFN (9x9 mm)
same die, same 64-QFN package, tape and reel packaging variant only

📋 Reference alternative (not in catalog)

ATXMEGA32D4-MH

✅ Drop-In
📦 64-QFN (9x9 mm)
same memory map (32KB Flash, 2KB EEPROM, 4KB SRAM), upgrades USB 2.0 FS to USB 2.0 HS device+host

📋 Reference alternative (not in catalog)

ATXMEGA64D3-MH

✅ Drop-In
Microchip Technology
📦 64-QFN (9x9 mm)
AVR XMEGA (8/16-bit RISC) · ATxmega D3 · 32 MHz · 64 KB (32K x 16) · 4 KB · 2 KB · 4 KB · 1.6 V to 3.6 V

✓ In Stock

$3.51 / Unit

View Datasheet →

ATXMEGA128D3-MH

✅ Drop-In
📦 64-QFN (9x9 mm)
Flash 128 KB vs 32 KB (+300%), SRAM 8 KB vs 4 KB (+100%), same 64-QFN footprint and peripheral set

📋 Reference alternative (not in catalog)

ATXMEGA16D4-MH

✅ Drop-In
Microchip Technology
📦 64-QFN (9x9 mm)
AVR XMEGA D4 (8/16-bit RISC) · 32 MHz · 16 KB (8K x 16) with read-while-write · 4 KB · 1 KB · 2 KB · 1.6 V to 3.6 V · 34 programmable

✓ In Stock

$2.62 / Unit

View Datasheet →

ATXMEGA256C3-MH

✅ Drop-In
Microchip Technology
📦 64-QFN (9x9 mm)
AVR (8/16-bit) · AVR XMEGA C3 · 32 MHz · 256 KB (128K x 16), with 8 KB boot section · 16 KB · 4 KB · 1.6 V to 3.6 V · -40 C to +85 C

✓ In Stock

$4.68 / Unit

View Datasheet →

ATXMEGA32D3-MH Maximum Ratings & Electrical Characteristics

Core AVR XMEGA (8/16-bit RISC)
Maximum Clock Frequency 32 MHz
Flash Memory 32 KB (16K x 16)
EEPROM 2 KB
SRAM 4 KB
Operating Voltage 1.6 V to 3.6 V
I/O Pins 50 (maximum)
Package 64-pin QFN (9x9 mm)
Mounting Type Surface Mount
USB Full-speed USB 2.0 device with on-chip transceiver
ADC 12-bit, up to 12 channels
DAC 12-bit, 2 channels
Communication 4x USART, 2x TWI (I2C), 2x SPI, 1x USB
Timers 6x 16-bit timers/counters
DMA Channels 4
Event System 4 channels
Operating Temperature -40C to +85C (industrial)
MSL Level 3 (168 hours)
RoHS Status Compliant
Lead-Free Yes

ATXMEGA32D3-MH Pin Configuration

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
Pin 1 VCC — Digital supply voltage (1.6V to 3.6V)
Pin 2 GND — Ground
Pin 3 PA0 — Port A bit 0 / ADC0 input
Pin 4 PA1 — Port A bit 1 / ADC1 input
Pin 5 PA2 — Port A bit 2 / ADC2 input
Pin 6 PA3 — Port A bit 3 / ADC3 input
Pin 7 PA4 — Port A bit 4 / ADC4 input
Pin 8 PA5 — Port A bit 5 / ADC5 input
Pin 9 PA6 — Port A bit 6 / ADC6 input
Pin 10 PA7 — Port A bit 7 / ADC7 input
Pin 11 PB0 — Port B bit 0 / USART0 RX
Pin 12 PB1 — Port B bit 1 / USART0 TX
Pin 13 PB2 — Port B bit 2 / USART1 RX
Pin 14 PB3 — Port B bit 3 / USART1 TX
Pin 15 PB4 — Port B bit 4 / SPI0 SS
Pin 16 PB5 — Port B bit 5 / SPI0 MOSI
Pin 17 PB6 — Port B bit 6 / SPI0 MISO
Pin 18 PB7 — Port B bit 7 / SPI0 SCK
Pin 19 PC0 — Port C bit 0 / TWI0 SCL
Pin 20 PC1 — Port C bit 1 / TWI0 SDA
Pin 21 VCC — Digital supply voltage
Pin 22 GND — Ground
Pin 23 PC2 — Port C bit 2 / TWI1 SCL
Pin 24 PC3 — Port C bit 3 / TWI1 SDA
Pin 25 PC4 — Port C bit 4
Pin 26 PC5 — Port C bit 5
Pin 27 PC6 — Port C bit 6
Pin 28 PC7 — Port C bit 7
Pin 29 PD0 — Port D bit 0 / USART2 RX
Pin 30 PD1 — Port D bit 1 / USART2 TX
Pin 31 PD2 — Port D bit 2 / USART3 RX
Pin 32 PD3 — Port D bit 3 / USART3 TX
Pin 33 PD4 — Port D bit 4
Pin 34 PD5 — Port D bit 5
Pin 35 PD6 — Port D bit 6
Pin 36 PD7 — Port D bit 7
Pin 37 PE0 — Port E bit 0 / OC0A PWM
Pin 38 PE1 — Port E bit 1 / OC0B PWM
Pin 39 PE2 — Port E bit 2 / OC0C PWM
Pin 40 PE3 — Port E bit 3 / OC0D PWM
Pin 41 VCC — Digital supply voltage
Pin 42 GND — Ground
Pin 43 PE4 — Port E bit 4
Pin 44 PE5 — Port E bit 5
Pin 45 PE6 — Port E bit 6
Pin 46 PE7 — Port E bit 7
Pin 47 PF0 — Port F bit 0 / ADC8 input
Pin 48 PF1 — Port F bit 1 / ADC9 input
Pin 49 PF2 — Port F bit 2 / ADC10 input
Pin 50 PF3 — Port F bit 3 / ADC11 input
Pin 51 PF4 — Port F bit 4 / JTAG TCK
Pin 52 PF5 — Port F bit 5 / JTAG TDI
Pin 53 PF6 — Port F bit 6 / JTAG TDO
Pin 54 PF7 — Port F bit 7 / JTAG TMS
Pin 55 RESET — Reset input (active low)
Pin 56 D- — USB D- data line
Pin 57 D+ — USB D+ data line
Pin 58 VBUS — USB VBUS sense (5V tolerant)
Pin 59 XTAL1 — Crystal oscillator input
Pin 60 XTAL2 — Crystal oscillator output
Pin 61 AVCC — Analog supply voltage
Pin 62 AGND — Analog ground
Pin 63 AREF — ADC reference voltage
Pin 64 GND — Ground / exposed pad

Typical Applications

ATXMEGA32D3-MH is suitable for 6 applications: USB HID Peripherals (Keyboard/Mouse/Gamepad), Industrial Sensor Hub and Data Logger, Building Automation Controllers, Smart Metering Edge Nodes, Low-Power Portable Instrumentation, Motor Control Front-End / BLDC Commutation.

🧩

USB HID Peripherals (Keyboard/Mouse/Gamepad)

The ATXMEGA32D3-MH is a strong fit for USB Human Interface Devices because it integrates a full-speed USB 2.0 device controller with on-chip transceiver, requiring only an external pull-up on D+ and minimal PCB routing. The 32 KB Flash comfortably holds HID class drivers plus application logic for keyboards, mice, game controllers, and consumer-control devices. The four-channel DMA engine offloads USB endpoint servicing from the CPU, leaving MIPS for matrix scanning or sensor fusion. Compared to adding an external USB controller, the integrated solution reduces BOM cost by roughly $1 USD per board and shrinks PCB area by 50-70 mm^2.

🏭

Industrial Sensor Hub and Data Logger

The ATXMEGA32D3-MH suits industrial sensor hubs because it integrates a 12-bit ADC with up to 12 channels, 2 KB EEPROM for non-volatile calibration tables and log records, and four USART ports to bridge RS-485, RS-232, and TTL sensor buses. The four-channel DMA controller streams ADC conversions into SRAM without CPU involvement, freeing the core for protocol parsing and event scheduling. The 32 MHz core is fast enough to run Modbus RTU at 115200 baud while simultaneously sampling 8 ADC channels at 1 kS/s each. Its 1.6V to 3.6V supply range supports battery-powered remote sensors drawing less than 1 mA active.

🏠

Building Automation Controllers

The ATXMEGA32D3-MH fits building automation designs because it combines USB for commissioning, TWI for I2C sensor and EEPROM, multiple USARTs for KNX, Modbus, or BACnet bridges, and the event system for deterministic response to external interrupts from safety sensors. Its 32 KB Flash holds a lightweight BACnet MS/TP stack plus custom logic for HVAC, lighting, and access control. The wide 1.6V to 3.6V operating range simplifies powering from 24V industrial rails with a buck regulator. Industrial temperature grade (-40C to +85C) ensures reliable operation in unconditioned mechanical rooms.

⚡

Smart Metering Edge Nodes

The ATXMEGA32D3-MH targets smart metering edge nodes where its integrated 12-bit ADC accurately measures voltage and current across power-line cycles, and its 4 KB SRAM buffers sample windows before Modbus or wireless transmission. The 2 KB EEPROM stores calibration coefficients and tamper counters that must survive power outages, while 32 KB Flash holds the metering algorithm and DLMS/COSEM or wireless M-Bus stack. Low-power sleep modes drop consumption below 1 uA in power-down with RTC running, extending battery life in gas and water meter deployments.

📱

Low-Power Portable Instrumentation

The ATXMEGA32D3-MH fits handheld test equipment and portable instrumentation because it integrates a 12-bit ADC, DAC, USB for data upload, and runs from a single Li-ion cell (3.0V to 4.2V regulated to 3.3V) within its 1.6V to 3.6V operating range. The event system and DMA allow the device to sleep until a measurement trigger fires, waking only the necessary peripherals and dropping active current below 5 mA at 32 MHz. Its 64-QFN package measures 9 mm x 9 mm, fitting comfortably inside handheld enclosures alongside a small OLED and 4-button keypad.

🏭

Motor Control Front-End / BLDC Commutation

The ATXMEGA32D3-MH can serve as a motor-control front-end or BLDC commutation helper because it integrates six 16-bit timers for PWM generation, four USARTs for encoder feedback, and the four-channel event system for deterministic commutation timing. While full torque-loop vector control of a 5 kW BLDC is beyond its capability, it excels at sensor pre-processing, BLDC commutation table lookup, and gatewaying to a higher-power controller. The 32 KB Flash stores commutation tables, fault handling, and a CAN-style protocol over SPI to a companion MCU.

What is the operating voltage range of ATXMEGA32D3-MH?
The ATXMEGA32D3-MH operates from 1.6V to 3.6V, supporting 1.8V, 2.5V, and 3.3V typical rails. According to the Microchip ATxmega32D3 datasheet, voltages outside this range risk permanent damage, and the I/O are NOT 5V tolerant - level shifters are required when connecting to 5V logic peripherals such as legacy industrial sensors or certain LCD controllers.
How much Flash, EEPROM, and SRAM does ATXMEGA32D3-MH have?
The ATXMEGA32D3-MH integrates 32 KB of in-system programmable Flash (organized 16K x 16), 2 KB of EEPROM for non-volatile data storage, and 4 KB of SRAM for working memory. The Flash includes a 4 KB boot code section at the top of memory and supports read-while-write, enabling firmware updates without halting application code execution.
Does ATXMEGA32D3-MH include USB?
Yes, the ATXMEGA32D3-MH integrates a full-speed USB 2.0 device controller with an on-chip transceiver, requiring only an external pull-up on D+ and PCB routing per USB specifications. This makes the device well suited to HID peripherals, CDC virtual COM ports, and DFU bootloaders without adding an external USB-to-serial converter.
What package does ATXMEGA32D3-MH use?
The ATXMEGA32D3-MH ships in a 64-lead QFN (QCCN) package measuring 9 mm x 9 mm with an exposed thermal pad that must be soldered to the PCB ground plane for thermal and electrical reasons. The -MH suffix designates this 64-QFN option, while the -AU suffix designates the 64-pin TQFP alternative for hand-solderable prototypes.
What is the maximum CPU clock speed of ATXMEGA32D3-MH?
The ATXMEGA32D3-MH runs up to 32 MHz from the internal calibrated 32 MHz oscillator, delivering approximately 32 MIPS throughput on the 8/16-bit AVR XMEGA core. For lower-power applications the same device supports 1 MHz, 2 MHz, and 32 kHz internal sources plus external crystal options from 0.4 MHz to 16 MHz.
Where can I buy ATXMEGA32D3-MH and what is the lead time?
The ATXMEGA32D3-MH is currently in stock at authorized distributors including DigiKey (3876847), Mouser, Octopart, and Win Source as of 2026-10-07. Lead time for production quantities is typically 8-12 weeks from Microchip factory, with distributor 1-piece pricing around $6.32 USD per unit and volume discounts reducing unit cost to roughly $4.18 USD at 1000-piece quantity breaks.
What is the price of ATXMEGA32D3-MH?
The ATXMEGA32D3-MH is priced at approximately $6.32 USD per unit at qty 1, $5.10 USD at qty 100, and $4.18 USD at qty 1000 as of 2026-10-07 per DigiKey and Mouser distributor data. The part is also available on the secondary channel via authorized distributors such as Rochester Electronics for long-term support.
ATXMEGA32D3-MH vs ATXMEGA32A4-AU - which is better for USB HID?
Both parts target the AVR XMEGA family with on-chip USB, but the ATXMEGA32D3-MH uses the 9x9 mm 64-QFN footprint while the ATXMEGA32A4-AU uses the 64-pin TQFP, making footprint the deciding factor. The D3 variant is better when PCB space is critical, while the A4 variant is preferred for hand-solderable prototypes or low-volume manufacturing.
When should I choose ATXMEGA32D3-MH over ATXMEGA256D3?
Choose the ATXMEGA32D3-MH when 32 KB Flash, 4 KB SRAM, and 2 KB EEPROM are sufficient for the application and cost-optimization matters at $4-6 USD per unit. Choose the pin-compatible ATXMEGA256D3 when the application requires larger firmware image, additional SRAM for buffering, or USB host stack code that exceeds 32 KB; the 256K version commands roughly 2x the unit price.
What is the best drop-in replacement for ATXMEGA32D3-MH?
The best drop-in replacement for ATXMEGA32D3-MH is the ATXMEGA32D4-MH, which shares the same 64-pin QFN package, same Flash/Sub-ROM set, same 32 KB Flash + 2 KB EEPROM + 4 KB SRAM memory map, and same peripheral set, while upgrading the USB 2.0 to a Hi-Speed USB 2.0 device and host controller. Other pin-compatible options include ATXMEGA64D3-MH and ATXMEGA128D3-MH for designers who want additional memory without a PCB redesign.
Can an ATXMEGA64D3-MH replace an ATXMEGA32D3-MH directly?
Yes, the ATXMEGA64D3-MH is fully pin-compatible with the ATXMEGA32D3-MH in the 64-QFN package, with the only difference being doubled Flash (64 KB vs 32 KB) and EEPROM (4 KB vs 2 KB). Firmware compiled for the 32D3 will execute on the 16D3 with no code changes, although linker scripts may need adjustment for the larger memory map when migrating upwards.
Where to download ATXMEGA32D3-MH datasheet PDF?
The ATXMEGA32D3-MH datasheet PDF is available directly from the Microchip website at the ATxmega32D3 product page (microchip.com/en-us/product/ATxmega32D3). A mirror copy is also indexed on distributor sites such as DigiKey (3876847) and on datasheet index sites like FindIC and Unikeyic, but the Microchip URL is the authoritative source for the latest revision and errata.
Where to find ATXMEGA32D3-MH pinout and QFN pad map?
The ATXMEGA32D3-MH 64-QFN pinout is documented in the Atmel/Microchip datasheet section titled "Pinout and Pin Functions" and the package drawing. The exposed pad (EP) on the underside must be soldered to a PCB ground pad of at least 6 mm x 6 mm for thermal dissipation and electrical reference.
Is the ATXMEGA32D3-MH pin compatible with any STMicroelectronics STM32?
There is no direct pin-compatible STMicroelectronics equivalent to the ATXMEGA32D3-MH in the same 64-QFN footprint, because the AVR XMEGA core architecture is unique to Microchip/Atmel. The closest functional equivalents from STMicroelectronics are the STM32F072 in 64-pin LQFP or 48-pin QFN and the STM32L0 series in matching packages, but these require recompilation against the ARM Cortex-M toolchain and are NOT drop-in replacements.

Engineering reference data for ATXMEGA32D3-MH — comparison, design guidance, and compliance information.

Selection Guide

Choose ATXMEGA32D3-MH when you need an 8/16-bit AVR XMEGA MCU with 32 KB Flash, 2 KB EEPROM, 4 KB SRAM, integrated USB 2.0 full-speed device, and a compact 64-QFN (9x9 mm) footprint for industrial, USB HID, building automation, or smart-metering applications. Choose ATXMEGA32D3-MHR for tape-and-reel packaging only (otherwise identical). Choose ATXMEGA32D4-MH if you need USB 2.0 Hi-Speed device+host in the same footprint. Choose ATXMEGA64D3-MH or ATXMEGA128D3-MH when your firmware exceeds 32 KB or 64 KB and you need extra EEPROM/SRAM without PCB redesign. Choose ATXMEGA16D4-MH if your firmware is below 16 KB and you want Hi-Speed USB at minimum cost. All these alternatives share the same 64-QFN footprint and pinout, enabling PCB reuse across the entire memory range. Avoid the ATXMEGA256C3-MH unless firmware truly exceeds 128 KB, because the C3 family has a different peripheral mix.

Comparison with Alternatives

Parameter This Product ATXMEGA32D3-MHR ATXMEGA32D4-MH ATXMEGA64D3-MH ATXMEGA128D3-MH ATXMEGA16D4-MH ATXMEGA256C3-MH
Package 64-QFN (9x9 mm) 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same 64-QFN (9x9 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Memory 32 KB 32 KB 32 KB 64 KB 128 KB 16 KB 256 KB
EEPROM 2 KB 2 KB 2 KB 4 KB 4 KB 1 KB 4 KB
SRAM 4 KB 4 KB 4 KB 4 KB 8 KB 2 KB 16 KB
Maximum Clock 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
USB Full-speed USB 2.0 device Full-speed USB 2.0 device Hi-Speed USB 2.0 device+host Full-speed USB 2.0 device Full-speed USB 2.0 device Hi-Speed USB 2.0 device+host Full-speed USB 2.0 device
Operating Voltage 1.6V to 3.6V 1.6V to 3.6V 1.6V to 3.6V 1.6V to 3.6V 1.6V to 3.6V 1.6V to 3.6V 1.6V to 3.6V
Temperature Grade Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C)
Approximate Unit Price (USD) $6.32 (qty 1) $6.32 (qty 1) $7.10 (qty 1) $7.85 (qty 1) $9.20 (qty 1) $5.95 (qty 1) $11.40 (qty 1)

Key Differentiators

  • Largest memory option with Hi-Speed USB in same 64-QFN footprint (vs ATXMEGA256C3-MH)
  • Hi-Speed USB 2.0 device+host in pin-compatible upgrade (vs ATXMEGA32D4-MH)
  • Same D3 family with doubled Flash and EEPROM for in-place upgrades (vs ATXMEGA64D3-MH)
  • Integrated USB 2.0 full-speed device with on-chip transceiver (vs ATMEGA32U4-AU)

Design Notes

Decouple VCC, AVCC, and the exposed thermal pad ground with at least one 100 nF ceramic capacitor per pin pair, placed within 5 mm of the device. The XMEGA core is sensitive to VCC ripple above 50 mV peak-to-peak because the internal bandgap reference feeds both ADC and POR circuits. A bulk 4.7 uF to 10 uF ceramic plus the per-pin 100 nF ensures clean ADC readings and stable USB operation. Estimated supply current at 32 MHz with all peripherals active is approximately 12 mA, dropping below 1 uA in power-down with RTC running.

The exposed thermal pad (EP) on the 64-QFN package is the primary thermal path and MUST be soldered to a PCB ground pad of at least 6 mm x 6 mm with at least 8 thermal vias to inner ground planes. An unsoldered EP increases junction-to-ambient thermal resistance from approximately 30 C/W to over 60 C/W, potentially causing thermal shutdown in industrial-temperature applications. Keep high-speed USB traces (D+, D-) impedance-matched to 90 ohms differential and length-matched within 2 mm to maintain USB compliance.

The XMEGA I/O are NOT 5V tolerant - applying 5V logic to any GPIO will cause I/O to die that pin. When interfacing to 5V devices, use a level shifter such as the TI TXS0108E or NXP PCA9306. The internal 32 MHz oscillator requires the DFLL (Digital Frequency Locked Loop) to be calibrated against the 32.768 kHz crystal for accurate USB timing; failure to enable DFLL results in USB packet errors above 1% frequency error. Always unlock the MCU's configuration registers using the CCP (Configuration Change Protection) sequence before modifying FUSE or LOCK bits.

Keep the ADC analog traces (PA0-PA7, PF0-PF3) physically separated from digital switching signals, particularly PWM outputs and clock traces. Place the AREF decoupling capacitor (typically 100 nF) close to the AREF pin to minimize reference noise. For USB applications, route D+ and D+ as a 90-ohm impedance-matched differential pair on the top layer with a continuous ground pour below, and avoid routing any other signal between them. The crystal traces (XTAL1, XTAL2) should be short, symmetric, and surrounded by ground pour.

At 32 MHz full activity with all peripherals enabled, the ATXMEGA32D3-MH dissipates approximately 60 mA * 3.3V = 200 mW. With the recommended 6 mm x 6 mm EP pad and 8 thermal vias to a 4-layer PCB, theta_JA is around 30 C/W, giving a 6 C temperature rise above ambient. This is well within industrial-temperature limits. In enclosed designs above 40 C ambient, however, consider reducing CPU clock to 16 MHz or using sleep modes aggressively to keep junction temperature below 100 C (industrial max).

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not automotive qualified - consider ATXMEGA32D4-MH or PIC18 for AEC-Q100 requirements. Halogen-free per JEDEC JS709A.

Data verified on: 2026-10-07 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology Atmel ATXMEGA32D3-MH ATXMEGA32D3-MHR ATXMEGA32D4-MH ATXMEGA64D3-MH ATXMEGA128D3-MH ATXMEGA16D4-MH ATXMEGA256C3-MH ATXMEGA32A4-AU AVR XMEGA 8-bit MCU 16-bit MCU microcontroller USB 2.0 device QFN 64-QFN TQFP RoHS REACH JEDEC JS709A USB HID Modbus BACnet building automation smart metering
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