BSC9131NJE1HHHB - QorIQ Qonverge SoC, 800MHz e500 + StarCore | NXP
부품 번호: BSC9131NJE1HHHB ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $43.82 | $43.82 |
| 10 | $41.2 | $412.00 |
| 100 | $38.5 | $3,850.00 |
| 500 | $35.75 | $17,875.00 |
| 1,000 | $32.9 | $32,900.00 |
BSC9131NJE1HHHB 개요
A QorIQ Qonverge SoC is a heterogeneous communications processor that combines a control-plane general-purpose CPU, a signal-processing DSP core, and hardware acceleration for baseband or packet processing in a single die. The BSC9131 specifically targets small-cell wireless base stations and other line-card applications where latency-sensitive control and high-throughput DSP must coexist on one chip, simplifying board design versus a discrete CPU + DSP architecture.
Key features include: 1x e500 core at 800 MHz for control-plane code, 1x SC3850 StarCore DSP at 800 MHz for PHY/baseband processing, an integrated MAPLE-B2F baseband accelerator, DDR3 memory controller with ECC, integrated SEC (Security Engine) for IPsec/cryptographic offload, dual 10/100/1000 Ethernet MACs, multiple SerDes lanes for SGMII/PCIe, and a temperature range of -40C to +105C. The 520-pin FCBGA package exposes the full SerDes, Ethernet, DDR3, and JTAG interfaces needed for small-cell line cards.
Architecturally, the e500 core runs the control-plane operating system and management stack while the SC3850 + MAPLE-B2F combination offloads L1/L2/L3 baseband DSP and Turbo/FFT operations, reducing overall BOM and power versus two discrete chips. SEC hardware accelerates encryption/decryption for secure backhaul links.
Typical applications include small-cell LTE/eNodeB base stations, enterprise VoIP gateways, smart-grid control nodes, and defense/industrial signal-processing platforms that need combined control + DSP on one SoC.
When designing with this device, plan PCB layout for the 520-ball FCBGA carefully - 0.8 mm or finer pitch BGA escape routing, controlled-impedance SerDes traces, and a multilayer stack-up with dedicated ground/power planes are required for signal integrity on DDR3 and SGMII links.
This page synthesizes distributor pricing, lifecycle status, and design considerations beyond the manufacturer datasheet, helping engineers evaluate the BSC9131NJE1HHHB for current and legacy designs.
드롭인 대체품: BSC9131NJE1HHHB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: BSC9131NJE1HHHB (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Operating Temperature, Package, RoHS Status, Security Engine.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
BSC9132NJE1HHHB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
BSC9131NSN1HHHB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
BSC9131NXN1HHHB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
BSC9131NJE1HHHB 최대 정격 & 전기적 특성
| Product Type | MPU + DSP SoC (Heterogeneous Multicore) |
| Series | QorIQ Qonverge BSC9131 |
| CPU Core 1 | PowerPC e500, 1 core, 32-bit, 800 MHz |
| DSP Core | StarCore SC3850, 800 MHz |
| Baseband Accelerator | MAPLE-B2F |
| Security Engine | SEC (IPsec / crypto accelerator) |
| Memory Controller | DDR3 with ECC |
| Ethernet | Dual 10/100/1000 MAC |
| 패키지 | 520-FCBGA, 21x21 mm |
| 동작 온도 | -40C to +105C |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
| 수명 주기 상태 | Last Time Buy (per NXP product page) |
BSC9131NJE1HHHB 520-fcbga, 21x21 mm 핀 구성 가이드
BSC9131NJE1HHHB(520-fcbga, 21x21 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BSC9131NJE1HHHB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BSC9131NJE1HHHB 적합 용도: 6 애플리케이션s: Small-Cell LTE eNodeB Base Station, Enterprise VoIP Media Gateway, Smart-Grid Control Node, Defense / Military Signal-Processing Platform, Industrial Machine Vision & DSP Controller, Wireless Backhaul Aggregator.
Small-Cell LTE eNodeB Base Station
The BSC9131NJE1HHHB's combination of an 800 MHz e500 control-plane core, an 800 MHz StarCore SC3850 DSP, and the MAPLE-B2F baseband accelerator is purpose-built for small-cell LTE eNodeB line cards. The e500 runs the Layer 2/3 control stack (RRC, S1-AP, OAM), while the SC3850 + MAPLE-B2F pair executes Layer 1 PHY processing - Turbo/Viterbi coding, FFT/iFFT, and CRC - far more efficiently than a software-only DSP path. The integrated SEC engine accelerates IPsec for secure backhaul, and the dual GbE MACs plus SerDes lanes provide S1/u-plane connectivity. Operating from -40C to +105C, it suits outdoor pico-cell and indoor femtocell deployments.
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Enterprise VoIP Media Gateway
In enterprise VoIP media gateways, the BSC9131NJE1HHHB handles SIP/H.323 signaling on the e500 control core while the StarCore SC3850 DSP executes voice codecs (G.711, G.722, G.729, Opus) and echo-cancellation algorithms. The MAPLE-B2F offloads compute-intensive DSP kernels, freeing the SC3850 for jitter buffer, PLC, and tone-detection tasks. The DDR3 controller with ECC supports reliable voice-packet buffering, and the SEC engine secures SIP/TLS media paths. Dual GbE MACs connect to LAN and WAN, and the -40C to +105C range supports thermally challenging closet deployments without active cooling.
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Smart-Grid Control Node
Smart-grid control nodes (substation controllers, distribution management units) benefit from the BSC9131NJE1HHHB's heterogeneous CPU+DSP architecture. The e500 runs IEC 61850 stack, DNP3, Modbus, and SCADA protocols while the SC3850 executes DSP-based power-line signal analysis (FFT, harmonic detection, transient capture). MAPLE-B2F accelerates the underlying math, reducing CPU/DSP loading. The SEC engine provides encryption/authentication for grid cybersecurity compliance (NERC CIP), and the -40C to +105C temperature range handles outdoor substation environments. Integrated GbE and SerDes support both IP-based and legacy serial substation bus connectivity.
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Defense / Military Signal-Processing Platform
The BSC9131NJE1HHHB is explicitly qualified for defense and military signal-processing applications. Its rugged -40C to +105C operating range, SEC engine for encrypted tactical communications, and combined e500 + SC3850 + MAPLE-B2F compute fabric suit SDR (software-defined radio), EW (electronic-warfare) processing, and ruggedized sensor platforms. The e500 runs the secure OS and mission-control code, while the SC3850 + MAPLE handle RF PHY, channelization, and direction-finding algorithms. The 520-FCBGA package supports ruggedized PCB designs with underfill and conformal coating for shock/vibration compliance per MIL-STD-810.
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Industrial Machine Vision & DSP Controller
In industrial machine vision systems, the BSC9131NJE1HHHB's StarCore SC3850 DSP at 800 MHz plus MAPLE-B2F acceleration handles real-time image preprocessing - FFT-based filtering, edge detection, and pattern matching - while the e500 runs the higher-level inspection logic and PLC/HMI integration. DDR3 with ECC ensures image data integrity in noisy industrial environments, and the SEC engine secures factory-network communications (OPC-UA, TLS). The GbE MACs and SerDes connect to industrial GigE Vision cameras and EtherCAT/PROFINET fieldbuses, and the -40C to +105C range suits cabinet-less factory deployments.
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Wireless Backhaul Aggregator
Wireless backhaul aggregators - small-cell concentrators, microwave-backhaul nodes, and rural 5G fixed-wireless access points - rely on the BSC9131NJE1HHHB for combined packet processing, encryption, and DSP-driven PHY optimization. The e500 runs routing protocols and management, the SEC engine accelerates IPsec tunnels for backhaul encryption, and the SC3850 + MAPLE-B2F handle adaptive modulation/coding and channel-equalization DSP. The dual GbE MACs and SerDes support both wireless modem links and wired backhaul aggregation, while the -40C to +105C range handles rooftop and outdoor-cabinet installations.
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추천 제품 요약
엔지니어링 참조 데이터: BSC9131NJE1HHHB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | BSC9132NJE1HHHB | BSC9131NSN1HHHB | LS1043AXE7QQB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Architecture | PowerPC e500 (1 core @ 800 MHz) | PowerPC e500 (2 cores @ 800 MHz) | PowerPC e500 (1 core @ 800 MHz) | ARM Cortex-A53 (4 cores @ 1.6 GHz) |
| DSP Core | StarCore SC3850 @ 800 MHz | StarCore SC3850 (2 cores @ 800 MHz) | StarCore SC3850 @ 800 MHz | No DSP (CPU-only) |
| Baseband Accelerator | MAPLE-B2F | MAPLE-B2F (dual) | MAPLE-B2F | None (no baseband accel) |
| Security Engine | SEC (IPsec/crypto) | SEC (IPsec/crypto) | SEC (IPsec/crypto) | SEC (updated) |
| Memory Controller | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3L/DDR4 with ECC |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Active |
주요 차별점
- Heterogeneous CPU + DSP + baseband accelerator in one die (vs T2081NSE7MQB (CPU-only QorIQ))
- Lower cost than dual-core BSC9132 for low-density small cells (vs BSC9132NJE1HHHB)
- MAPLE-B2F baseband hardware accelerator (vs LS1043AXE7QQB (Layerscape ARM, no MAPLE))
설계 노트
The 520-ball FCBGA at 21x21 mm with 0.8 mm ball pitch requires 8-12 layer PCB stack-up with microvia escape, via-in-pad for inner rows, and dedicated ground/power planes. Use controlled-impedance routing for DDR3 (50 ohm single-ended, 100 ohm differential) and SGMII SerDes (100 ohm differential). Follow NXP hardware design guide for layer stack-up, decoupling (place 100 nF X7R caps within 1 mm of each power pin, plus bulk 10-22 uF tantalum/ceramic), and length-matching rules for DDR3 (DQS to clock within 25 mil).
Estimated: at 800 MHz dual-core operation with SEC + MAPLE active, the BSC9131 can dissipate 5-8 W. The 520-FCBGA package has a theta_JA of approximately 8-12 C/W with optimized PCB layout (8+ ground/power layers, thermal vias under BGA). For continuous 8 W operation, provide a heatsink or forced airflow; for sealed enclosures, derate to 5-6 W maximum. Junction temperature must stay below 125C for reliable -40C to +105C ambient operation.
Do not design new products around BSC9131NJE1HHHB - the part is in NXP Last Time Buy with a published discontinuance notice. For new designs, evaluate Layerscape LS1043A/LS1046A as successors; for existing BSC9131-based designs, place final orders before the PCN cutoff and qualify the recommended NXP replacement device. Also confirm boot configuration pins (Reset configuration words) are correctly pulled - mismatched values will prevent the SoC from booting.
DDR3 layout: match DQ/DQS byte lanes within 25 mil, route DQS as center of each byte group with trace-length matching, and keep reference plane continuous under all DDR3 traces. SGMII/SerDes: use 100 ohm differential pairs with intra-pair skew under 5 mil, isolate from noisy digital traces by 3W rule. Both interfaces require AC coupling capacitors on the SerDes lines; place them symmetrically within 200 mil of the SoC ball.
규정 준수 정보
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified (industrial/telecom, not automotive). Lead-free BGA balls per NXP packaging specifications. Halogen-free status not stated explicitly in provided web data - marked unknown.
