BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors
부품 번호: BSC9131NSN7KHKB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
BSC9131NSN7KHKB 개요
A QorIQ Qonverge SoC is a system-on-chip that integrates one or more processor cores, specialized accelerators, memory interfaces, and communications peripherals into a single package. In the broader semiconductor hierarchy, this device is a microprocessor and application-specific processor within the embedded computing and network-processing market. Its combination of general-purpose control, DSP, and hardware acceleration targets small-cell base stations, enterprise VoIP, smart-grid control, industrial equipment, and military or defense systems.
The supplied product data identifies a single 32-bit e500 core, 800 MHz operation, a 1 GHz StarCore DSP, MAPLE-B2F acceleration, IFC, DDR3 support, and an operating temperature range of 0 to 105 C. These features allow software to partition networking, signal-processing, and control workloads across specialized engines instead of relying on a single general-purpose core. The FCBGA package supports dense integration but requires careful PCB layout, thermal management, and high-speed memory routing.
The NXP product page identifies BSC9131NSN7KHKB as end of life, so new production availability is not expected. Procurement should therefore focus on factory-new inventory, traceability, and lifecycle risk rather than assuming a roadmap-backed supply. Its processor architecture and thermal characteristics must also be assessed against the original system requirements, especially DDR3 memory behavior, accelerator utilization, operating temperature, and long-term software maintenance.
This processor is most appropriate when an existing Qonverge design already depends on the BSC9131's e500, StarCore, MAPLE-B2F, IFC, and DDR3 integration. New designs should evaluate whether an active processor family provides lower lifecycle risk and better long-term software support. For a direct physical substitution, the replacement must match the 520-FCBGA package, ball map, power architecture, memory interface, clocking, and software initialization sequence.
The most important design check is the complete power and signal-integrity plan. Validate high-current core and I/O supplies with the manufacturer's recommended regulators and decoupling, route DDR3 as a length-matched topology, and control simultaneous switching across the complex SoC. Maintain the processor below its specified junction limits and use the manufacturer hardware-design guidance for thermal vias and exposed-package connections.
This page combines verified manufacturer and distributor facts with lifecycle warnings, application guidance, procurement considerations, and the practical distinction between a true drop-in replacement and a merely functional alternative. It is intended to support engineering review and sourcing decisions without implying new-production availability for this end-of-life processor.
드롭인 대체품: BSC9131NSN7KHKB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: BSC9131NSN7KHKB (동일 폼 팩터 및 풋프린트) — 차이점: Package, Processor Core, Product Type, Lifecycle Status, Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC5554MZP132
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$92.3818 / 개
데이터시트 보기 →LS1012AXN7HKA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$19.127 / 개
데이터시트 보기 →LS1021AXE7KQB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →TMS320C6748EZWT4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →MPC5554MZP132
✅ 드롭인✓ 재고 있음
$92.3818 / 개
데이터시트 보기 →BSC9131NSN7KHKB 최대 정격 & 전기적 특성
| Product Type | QorIQ Qonverge network processor SoC |
| General-Purpose CPU | PowerPC e500, 1 core, 32-bit |
| e500 Core Frequency | 800 MHz |
| DSP Processor | StarCore SC3850 at 1 GHz |
| Specialist Accelerator | MAPLE-B2F |
| 인터페이스 | IFC |
| External Memory Support | DDR3 |
| 패키지 | 520-FCBGA, 21 x 21 mm |
| 핀 수 | 520 balls |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 C to 105 C |
| Core Count | 1 core |
| Word Size | 32-bit |
| 수명 주기 상태 | End of Life |
BSC9131NSN7KHKB 520-fcbga, 21 x 21 mm 핀 구성 가이드
BSC9131NSN7KHKB(520-fcbga, 21 x 21 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BSC9131NSN7KHKB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BSC9131NSN7KHKB 적합 용도: 6 애플리케이션s: Small-Cell Base Station Signal Processing, Enterprise VoIP Media Gateway, Smart-Grid Control Equipment, Industrial Communication Controller, Military and Defense Communications Equipment, Multimedia and Speech Processing System.
Small-Cell Base Station Signal Processing
The BSC9131NSN7KHKB fits small-cell base-station designs that benefit from combining control processing and dedicated signal-processing resources. Its 800 MHz 32-bit PowerPC e500 core can handle network control tasks, while the 1 GHz StarCore SC3850 DSP and MAPLE-B2F accelerator address throughput-intensive signal processing. DDR3 support provides a high-bandwidth external-memory path for packet buffers and working data, while IFC supports integration with communications peripherals. The key trade-off is end-of-life availability: production planning must include controlled last-time-buy quantities, traceability, and a software-support strategy for the installed base.
추천
Enterprise VoIP Media Gateway
The BSC9131NSN7KHKB is suitable for enterprise voice gateways where packet handling, media processing, and real-time control must coexist. The single 32-bit e500 core at 800 MHz provides general-purpose control, while the 1 GHz StarCore SC3850 DSP and MAPLE-B2F accelerator can be assigned to voice codecs and media workloads. DDR3 supports the larger working sets associated with concurrent calls, and IFC offers a path to communications interfaces. Because the processor is End of Life, an existing deployment can benefit from planned inventory, but a new product should compare its obsolete-software risk against current network processors with longer lifecycle support.
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Smart-Grid Control Equipment
The BSC9131NSN7KHKB can support smart-grid control equipment that combines supervisory logic, communications, and specialized signal processing. The e500 core is suitable for protocol and supervisory tasks, while the StarCore SC3850 and MAPLE-B2F accelerator can accelerate waveform or monitoring functions that would otherwise burden a general-purpose CPU. The 0 C to 105 C rated operating range supports many industrial environments, although the enclosure must control heat rise around the 520-FCBGA package. Deployment planning should also address product cybersecurity, long-term firmware maintenance, and secure availability of the end-of-life device.
추천
Industrial Communication Controller
For industrial communication equipment, BSC9131NSN7KHKB combines a general-purpose 32-bit e500 processor with a 1 GHz StarCore DSP and MAPLE-B2F accelerator, allowing real-time data handling and network control to share one SoC. DDR3 can support communication buffers and larger protocol datasets, and IFC helps integrate communications logic. This combination is valuable when retrofitting a legacy system demands continuity with existing QorIQ software and peripherals. New equipment should instead evaluate active parts because processor longevity, security updates, and driver availability can outweigh the cost advantage of an end-of-life component with an elaborate footprint.
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Military and Defense Communications Equipment
The BSC9131NSN7KHKB may fit a legacy military or defense communications subsystem that requires deterministic local processing without a multi-chip DSP arrangement. The e500 core can supervise protocol and control functions, the StarCore SC3850 DSP can execute signal-processing workloads, and MAPLE-B2F adds specialist acceleration. DDR3 and IFC support integration into a broader processing architecture. However, the verified sources do not provide AEC-Q100, radiation, security-certification, or long-term program-support data, so those requirements must be verified independently rather than inferred from the NXP product type.
추천
Multimedia and Speech Processing System
The BSC9131NSN7KHKB supports multimedia designs that need a real-time DSP engine and a separate control processor. The 1 GHz StarCore SC3850 can process audio, video, or speech data, while the 800 MHz e500 core manages system control and networking, and MAPLE-B2F offloads suitable specialist tasks. DDR3 supplies bandwidth for frame and sample buffers. Compared with a standalone DSP, the integrated architecture can simplify board partitioning, but it introduces a large 520-FCBGA routing challenge and an end-of-life procurement risk. Existing systems may favor continuity; new systems should compare current DSP and application processors with supported software ecosystems.
추천
추천 제품 요약
엔지니어링 참조 데이터: BSC9131NSN7KHKB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC5554MZP132 | LS1012AXN7HKA | LS1021AXE7KQB | TMS320C6748EZWT4 |
|---|---|---|---|---|---|
| Package | 520-FCBGA, 21 x 21 mm | 520-FCBGA | 520-FCBGA | 520-FCBGA | 520-FCBGA |
| Brand | NXP Semiconductors | Freescale Semiconductor | NXP Semiconductors | NXP Semiconductors | Texas Instruments |
주요 차별점
- Integrates three distinct processing resources in one Qonverge SoC (vs TMS320C6748EZWT4)
- DDR3 and IFC integration supports communications-oriented designs (vs LS1012AXN7HKA)
- Broad 0 C to 105 C operating range (vs MPC5554MZP132)
- Purpose-built combination of e500 control and StarCore signal processing (vs LS1021AXE7KQB)
설계 노트
Design the power tree from the NXP BSC9131 hardware-design requirements rather than from distributor summaries. The SoC combines an 800 MHz e500 core, a 1 GHz StarCore DSP, a MAPLE-B2F accelerator, DDR3, and IFC, so rail sequencing, transient response, decoupling, and startup order must be validated together. Place high-frequency ceramic decoupling directly at the relevant supply balls, use the manufacturer's recommended regulator topology, and confirm droop during simultaneous processor and memory activity with high-bandwidth measurement.
The 520-FCBGA, 21 x 21 mm package demands exact escape-routing and thermal-via planning. Follow the NXP ball map and reference layout for power, ground, DDR3, and IFC; do not derive a layout from a generic 520-ball library. DDR3 routing should use the manufacturer's topology and length-matching rules, while exposed-package connections and via arrays should follow the official thermal and assembly guidance. A mechanically sound PCB is not sufficient; signal, power, and thermal validation must be performed together.
Estimate heat dissipation using the actual rail currents, core activity, DDR3 load, and ambient temperature; the supplied data does not provide enough electrical detail for a defensible numerical calculation. Verify operation across the full 0 C to 105 C device range with the intended enclosure, airflow, PCB copper, and nearby heat sources. Use the manufacturer's thermal model and exposed-pad connection requirements, then validate with thermocouples or an infrared inspection because FCBGA package behavior and board construction strongly affect junction temperature.
Do not treat a shared 520-FCBGA package as proof of drop-in compatibility. Before substitution, compare every ball, voltage rail, I/O standard, DDR3 topology, clock input, reset and boot behavior, IFC configuration, pin multiplexing, and firmware initialization sequence. The verified cross-reference results do not establish a qualified replacement, so any candidate should remain a redesign until schematic, layout, boot, and application-software validation are complete. For existing BSC9131 products, secure traceable inventory before making a rushed board-level substitution.
Keep high-speed DDR3 and clock routes short, continuous, and referenced to a solid ground plane, while separating noisy switching supplies and clocks from sensitive communications interfaces. Apply the manufacturer's recommended I/O and power filtering, and avoid routing incompatible signals beneath the SoC or between thermal-via fields. Because IFC supports communications peripherals, check its timing, impedance, and electromagnetic-compatibility requirements against the specific board stack-up. Pre-compliance testing should include conducted and radiated emissions, clock harmonics, and DDR3 edge-rate verification.
규정 준수 정보
The supplied verified data does not contain explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. No compliance claim has been inferred from the manufacturer or package type.
