BSC9132NSE7KNKB - QorIQ Qonverge SoC, 2x e500+2x SC3850 | NXP
부품 번호: BSC9132NSE7KNKB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $335 | $167,500.00 |
| 1,000 | $305 | $305,000.00 |
BSC9132NSE7KNKB 개요
A multicore SoC (System-on-Chip) is a highly integrated processor that merges general-purpose CPU cores, DSP cores, hardware accelerators, memory controllers, and I/O peripherals onto one silicon die. The BSC9132 belongs to NXP's QorIQ Qonverge platform, which sits at the intersection of MPU (microprocessor) and DSP (digital signal processor) products; it functions as a baseband processor that performs physical-layer modulation, demodulation, and Layer-2 protocol processing without requiring an external companion processor.
Key headline features include two PowerPC e500 cores running up to 1 GHz, two StarCore SC3850 DSP cores running up to 1 GHz, an integrated MAPLE-B2P hardware accelerator for baseband forward-error-correction offload, a 32-bit DDR3 memory controller with ECC, integrated SEC security engine for cryptographic acceleration, and a SerDes-based multi-protocol fabric. The device is offered in a 780-ball FCBGA with commercial 0C to +105C temperature range.
Architecturally the BSC9132 uses a coherent CoreNet fabric that ties CPU, DSP, and accelerator blocks together, allowing shared-memory programming across heterogeneous cores. The MAPLE-B2P block offloads turbo-decoding and Viterbi decoding, freeing DSP cycles for Layer-1 synchronization and channel estimation. The DDR3 controller supports up to DDR3-1066 with ECC for reliability in carrier-grade deployments.
Typical applications include small-cell LTE femtocell base stations, LTE/WiMAX PHY Layer-1 cards, smart-grid communication controllers, industrial deterministic networking platforms, and secure defense radio systems. The combination of CPU + DSP + hardware accelerator makes it well suited to any system that must execute both control-plane and signal-processing workloads concurrently.
Design consideration: this BGA-780 part requires a multilayer PCB with via-in-pad and controlled-impedance SerDes routing; thermal management is critical because the device dissipates significant power at full CPU plus DSP loading. Software development requires NXP's CodeWarrior or Linux SDK with SMP Linux 3.x and StarCore DSP toolchain.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone, including parametric match percentages and cross-sourcing from NXP's Qonverge family portfolio.
드롭인 대체품: BSC9132NSE7KNKB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: BSC9132NSE7KNKB (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, RoHS Status, Security Engine.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
BSC9132NXE7KNKB
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →BSC9131NSE7KNKB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
BSC9132NSE7MNK
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
BSC9132NSE7KNKB 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | QorIQ Qonverge BSC9132 |
| Product Type | Multicore SoC (CPU + DSP + Accelerator) |
| CPU Cores | 2x PowerPC e500 |
| CPU Core Frequency | 1 GHz (up to) |
| DSP Cores | 2x StarCore SC3850 |
| DSP Core Frequency | 1 GHz (up to) |
| Hardware Accelerator | MAPLE-B2P (turbo / Viterbi decode) |
| 데이터 버스 폭 | 32-bit |
| Memory Controller | DDR3 with ECC |
| Security Engine | SEC (cryptographic accelerator) |
| 패키지 | 780-FCBGA (23x23 mm) |
| 동작 온도 | 0C to +105C |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
BSC9132NSE7KNKB 780-fcbga (23x23 mm) 핀 구성 가이드
BSC9132NSE7KNKB(780-fcbga (23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BSC9132NSE7KNKB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BSC9132NSE7KNKB 적합 용도: 6 애플리케이션s: Small-Cell LTE Base Station, LTE/WiMAX Physical Layer Card, Smart-Grid Communication Controller, Defense / Military Radio Platform, Industrial Deterministic Networking Platform, Enterprise VoIP / Unified-Communications Appliance.
Small-Cell LTE Base Station
The BSC9132NSE7KNKB fits small-cell LTE base station baseband cards because it combines dual PowerPC e500 control-plane cores with dual StarCore SC3850 signal-processing cores and the MAPLE-B2P accelerator on a single die. The 1 GHz CPU clock, MAPLE-B2P turbo/Viterbi offload, and DDR3-ECC memory controller meet real-time LTE PHY budgets for femtocell and picocell deployments. Placed on a small-cell baseband card, the SoC executes Layer-1 modulation, Layer-2 protocol stacks, and IQ data routing without a companion processor. The integrated SEC engine secures backhaul traffic via hardware-accelerated cipher suites, reducing software overhead. Designers benefit from consolidated BOM and reduced board area compared with discrete CPU + DSP architectures.
추천
LTE/WiMAX Physical Layer Card
The BSC9132NSE7KNKB is purpose-built for LTE/WiMAX PHY Layer-1 cards because its SC3850 DSP cores at 1 GHz, MAPLE-B2P accelerator, and coherent CoreNet fabric execute PHY synchronization, channel estimation, and FEC decoding under hard real-time deadlines. The DDR3 controller with ECC handles the large IQ-sample buffers required for OFDMA modulation, while the SEC engine accelerates Kasumi / Snow 3G cipher for user-plane integrity. Placed between RF front-end and upper-layer processing, the SoC consolidates baseband, control, and security into one chip. The 780-FCBGA package supports controlled-impedance SerDes break-out for CPRI/OBSAI backhaul interfaces, simplifying RF-to-bus connectivity.
추천
Smart-Grid Communication Controller
The BSC9132NSE7KNKB fits smart-grid communication controllers because its dual PowerPC e500 cores handle industrial protocol stacks (IEC 61850, DNP3, Modbus) while the StarCore SC3850 DSP cores process simultaneous power-line communication or wireless metering data streams. The 0C to +105C temperature range and DDR3 with ECC support reliable operation in substation environments with extended thermal stress. The SEC engine provides secure firmware attestation and cryptographic isolation for critical-infrastructure compliance, while MAPLE-B2P accelerates FEC on noisy power-line channels. Designers benefit from a single-chip solution that replaces separate CPU + DSP daughter-card stacks, reducing mean time between failure in long-life grid deployments.
추천
Defense / Military Radio Platform
The BSC9132NSE7KNKB suits defense radio platforms because its CPU + DSP + hardware accelerator topology supports software-defined radio (SDR) waveforms including HAVE QUICK, SINCGARS, and modern wideband tactical radios. The MAPLE-B2P accelerator handles low-latency FEC required by tactical waveforms, while the SEC engine provides tamper-resistant crypto for classified traffic. The coherent CoreNet fabric allows shared-memory programming across CPU and DSP cores, simplifying SDR waveform porting. Designers validate against MIL-STD-810 environmental conditions and MIL-STD-461 EMI limits with the 780-FCBGA mounted on ruggedized multilayer PCBs. The same BSP / toolchain used in commercial LTE deployments shortens qualification cycles.
추천
Industrial Deterministic Networking Platform
The BSC9132NSE7KNKB serves industrial deterministic networking platforms because its PowerPC e500 cores run real-time OS (RTOS) schedulers at 1 GHz while the SC3850 DSP cores process deterministic audio/video or vibration signal streams. The DDR3 controller with ECC and the SEC engine deliver the reliability required for industrial Ethernet gateways, PROFINET controllers, and TSN bridges. The 780-FCBGA 23x23 mm footprint allows compact industrial footprint designs with adequate thermal headroom. Designers pair the SoC with NXP's industrial PHY and switch portfolio (SJA1105, TJA1101) to build full industrial Ethernet solutions. The same OS image works across the Qonverge family, simplifying field upgrades.
추천
Enterprise VoIP / Unified-Communications Appliance
The BSC9132NSE7KNKB suits enterprise VoIP / unified-communications appliances because the dual e500 cores execute packet processing, SIP/H.323 stacks, and QoS scheduling, while the StarCore SC3850 DSP cores handle narrowband / wideband audio codecs (G.722, Opus, SILK) at low latency. The MAPLE-B2P offloads acoustic-echo-cancellation FEC for handset-grade voice quality, and DDR3-ECC provides deterministic latency for conference bridge buffers. Placed on a 1U appliance mainboard, the SoC handles up to hundreds of concurrent VoIP sessions without external DSP chips. Designers benefit from consolidating control-plane, media-plane, and security onto one BGA component, simplifying thermal and EMC design.
추천
추천 제품 요약
엔지니어링 참조 데이터: BSC9132NSE7KNKB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | BSC9132NXE7KNKB | BSC9131NSE7KNKB | BSC9132NSE7MNK |
|---|---|---|---|---|
| Package | 780-FCBGA (23x23 mm) | 780-FCBGA (23x23 mm) - same | 780-FCBGA (23x23 mm) - same | 780-FCBGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | 2x e500 @ 1 GHz | 2x e500 @ 1 GHz | 2x e500 @ 1 GHz | 2x e500 @ 1 GHz |
| DSP Cores | 2x SC3850 @ 1 GHz | 2x SC3850 @ 1 GHz | 1x SC3850 @ 1 GHz (-50%) | 2x SC3850 @ 1 GHz |
| Hardware Accelerator | MAPLE-B2P | MAPLE-B2P | MAPLE-B (older generation, lower throughput) | MAPLE-B2P |
| Memory Controller | DDR3 with ECC, 32-bit | DDR3 with ECC, 32-bit | DDR3 with ECC, 32-bit | DDR3 with ECC, 32-bit |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | Active | Active | Active | Active |
주요 차별점
- Higher DSP cluster count for parallel baseband workloads (vs BSC9131NSE7KNKB)
- MAPLE-B2P accelerator generation (vs BSC9131NSE7KNKB)
- Same family, same package, same toolchain (vs BSC9132NSE7MNK)
설계 노트
The BSC9132NSE7KNKB dissipates significant power at full dual e500 + dual SC3850 + MAPLE-B2P loading; in a typical 4G/4.5G small-cell deployment the device draws 8-12 W. The 780-FCBGA 23x23 mm package requires a multilayer PCB with at least 8 thermal vias under the die shadow, plus a heat spreader or heatsink for sustained load. Junction temperature must remain below 105C; monitoring via on-die thermal diodes is recommended.
Route the SerDes lanes (CPRI/OBSAI/PCIe) with 85-ohm differential impedance and length-matching tolerance within 0.15 mm between pair members. Use the NXP reference design footprint for the 780-FCBGA including via-in-pad and microvia stack-up to escape the inner-row BGA signals. Decoupling requires 0.1 uF X7R close to every power pin plus bulk polymer / tantalum capacitors at each voltage rail entry point.
Do not power the device outside the manufacturer datasheet power-sequencing requirements; the BSC9132 enforces a strict VDD / VDD_CORE / VDD_DDR ramp order and monitors via the internal SEC engine. Reboot can be triggered if rail sequencing violates spec, leaving the device in a non-recoverable state without external reset. Designers must implement proper POR sequencing as described in section 4 of the manufacturer datasheet.
DDR3 interfaces on the BSC9132NSE7KNKB require matched-length routing and careful trace impedance control; the ECC byte lane must be routed to a populated DRAM device and validated through IBIS simulation. SSTL-15 signaling is used; reference the NXP reference board design files for byte-lane pairing and capacitor placement. Mismatched write/read timing budgets will surface as intermittent data-corruption under load.
규정 준수 정보
RoHS and lead-free compliant per NXP product page. Not AEC-Q100 qualified (commercial 0C to +105C). REACH and conflict-mineral compliance indicated; halogen-free status not explicitly stated in available data.
