BSC9132NSN7KNKB - QorIQ Qonverge SoC, 2x1GHz DSP+CPU | NXP
부품 번호: BSC9132NSN7KNKB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $130.46 | $130.46 |
| 10 | $117.41 | $1,174.10 |
| 100 | $104.37 | $10,437.00 |
| 500 | $91.32 | $45,660.00 |
| 1,000 | $78.28 | $78,280.00 |
BSC9132NSN7KNKB 개요
A heterogeneous multiprocessor SoC combines two instruction-set architectures and dedicated hardware acceleration on a single die. The e500 cores handle control-plane and protocol-stack tasks (Layer 2/3, OAM, scheduling), while the SC3850 DSP cores run time-critical baseband DSP workloads. The MAPLE-B2P block accelerates LTE physical-layer primitives such as FFT/iFFT, channel coding, and rate matching, freeing DSP cycles for algorithm development and reducing bill-of-materials cost.
Key features of the BSC9132NSN7KNKB include a 32-bit dual-core e500 CPU subsystem up to 1.333 GHz, dual SC3850 StarCore DSP cores at 1 GHz, integrated MAPLE-B2P LTE PHY accelerator, dual DDR3/DDR3L controllers with ECC support, and an operating temperature range of 0C to 105C. The 780-FCBGA package exposes SerDes lanes, multiple Ethernet MACs, PCIe, USB, and other high-speed peripherals commonly required in wireless infrastructure.
Typical applications include femtocell and picocell base stations, LTE PHY implementations, smart-meter gateways, VoIP media servers, and ruggedized industrial controllers. The integrated accelerator reduces external DSP count and the device's SoC integration shrinks PCB area versus discrete CPU-plus-DSP designs.
When designing with this part, allocate sufficient PCB layer count for the FCBGA breakout and follow NXP's reference-design stackup. Thermal management is critical at full load - design a copper spreader or heatsink and verify junction temperature against the 105C maximum at worst-case airflow.
드롭인 대체품: BSC9132NSN7KNKB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: BSC9132NSN7KNKB (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Operating Temperature, Package, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
BSC9132NXE7MNMB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
BSC9132NSN7KNMB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
BSC9132NSN7KNKB 최대 정격 & 전기적 특성
| Product Type | Heterogeneous Multiprocessor SoC (QorIQ Qonverge) |
| Core Processor | PowerPC e500 (32-bit, dual-core) |
| DSP Cores | 2x StarCore SC3850 @ 1 GHz |
| CPU Speed | Up to 1.333 GHz |
| Co-Processors/DSP | Signal Processing; SC3850 - Dual |
| Baseband Accelerator | MAPLE-B2P (LTE PHY) |
| RAM Controllers | DDR3, DDR3L (dual-channel with ECC) |
| Graphics Acceleration | No |
| Display & Touch Interfaces | No |
| Ethernet | Multiple MACs (1G/2.5G capable) |
| USB | USB 2.0 |
| PCI Express | PCIe Gen 1/Gen 2 lanes |
| 패키지 | 780-FCBGA, 23x23 mm |
| 동작 온도 | 0C to +105C |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Series | QorIQ Qonverge BSC |
BSC9132NSN7KNKB 780-fcbga, 23x23 mm 핀 구성 가이드
BSC9132NSN7KNKB(780-fcbga, 23x23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BSC9132NSN7KNKB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BSC9132NSN7KNKB 적합 용도: 6 애플리케이션s: Small-Cell LTE Base Station, Enterprise VoIP Media Gateway, Smart Grid Communications Controller, Industrial Defense Signal Processing Platform, Wireless Backhaul Small Cell Aggregator, Industrial IoT Gateway with Edge Analytics.
Small-Cell LTE Base Station
The BSC9132NSN7KNKB is purpose-built for femtocell, picocell, and enterprise small-cell LTE base stations. Its two PowerPC e500 cores handle Layer 2/3 protocol processing, the two StarCore SC3850 DSP cores execute time-critical PHY-layer DSP, and the integrated MAPLE-B2P accelerator offloads LTE primitives such as FFT/iFFT, turbo coding, and rate matching. This heterogeneous compute fabric in a single 780-FCBGA package replaces discrete CPU-plus-DSP architectures, reducing BOM cost, PCB area, and power consumption - critical for outdoor or wall-mounted small-cell enclosures. The 0C to 105C temperature range supports both indoor and outdoor deployments.
추천
Enterprise VoIP Media Gateway
The BSC9132NSN7KNKB fits enterprise VoIP and unified-communications media gateway designs that need both protocol-stack processing and DSP horsepower. The dual e500 cores run SIP/RTP stacks, call control, and OAM, while the SC3850 DSP cores execute voice codecs (G.711, G.729, Opus), echo cancellers, and acoustic processing in software. The integrated baseband accelerator is repurposed for packet-classification acceleration. Multiple Ethernet MACs, PCIe, and USB 2.0 interfaces simplify connectivity to LAN, TDM, and storage subsystems in a single-board gateway appliance.
추천
Smart Grid Communications Controller
For smart-grid substation controllers and distribution automation equipment, the BSC9132NSN7KNKB provides deterministic DSP performance for power-line communication (PLC) PHY, IEC 61850 protocol processing, and real-time control loops. The SC3850 DSP cores handle OFDM modulation/demodulation and channel estimation for G3-PLC or PRIME waveforms, while the e500 cores execute the IEC 61850 stack, DNP3, and supervisory logic. Dual DDR3 controllers with ECC deliver the memory bandwidth required for protocol-stack and waveform buffering, and the 105C junction rating supports substation thermal envelopes.
추천
Industrial Defense Signal Processing Platform
Ruggedized signal-processing platforms in defense and industrial markets leverage the BSC9132NSN7KNKB's heterogeneous compute to consolidate multiple functions on one device. The SC3850 DSP cores run radar, sonar, or SIGINT algorithms; the e500 cores handle data recording and network interfaces; the MAPLE accelerator is repurposed for forward-error-correction or cryptographic primitives. The 780-FCBGA package is suitable for conduction-cooled board assemblies meeting MIL-STD-810 thermal-shock profiles. Engineers should consult NXP's industrial-grade product tree for the appropriate temperature-suffix variant for extended-military deployments.
추천
Wireless Backhaul Small Cell Aggregator
Small-cell backhaul aggregators that combine Ethernet, microwave, and satellite links benefit from the BSC9132NSN7KNKB's mix of DSP and control compute. The DSP cores handle modem signal processing for non-line-of-sight microwave links or LEO-satellite waveforms, while the e500 cores run QoS scheduling, encryption, and management-plane protocols. Multiple SerDes lanes support SFP+ and direct-attached 10G connections; the integrated PCIe and USB 2.0 interfaces attach crypto accelerators and storage. The 780-FCBGA package allows dense PCB layouts required in pole-mount or rooftop enclosures.
추천
Industrial IoT Gateway with Edge Analytics
Industrial IoT edge gateways built around the BSC9132NSN7KNKB can perform on-premise analytics on sensor streams before backhauling to the cloud. The e500 cores run containerized edge applications and protocol translation (Modbus, OPC UA, MQTT), while the SC3850 DSP cores accelerate time-series analytics such as FFT-based vibration analysis or predictive-maintenance algorithms. The MAPLE-B2P block offloads packet inspection for industrial firewalls. Dual DDR3 with ECC delivers reliability for 24/7 operation, and the 105C rating supports unshielded cabinet installations near motors or process equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: BSC9132NSN7KNKB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | BSC9132NXE7MNMB |
|---|---|---|
| Package | 780-FCBGA (23x23) | 780-FCBGA (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | 2x PowerPC e500 @ up to 1.333 GHz | 2x PowerPC e500 @ up to 1.333 GHz |
| DSP Cores | 2x StarCore SC3850 @ 1 GHz | 2x StarCore SC3850 @ 1 GHz |
| Baseband Accelerator | MAPLE-B2P (LTE PHY) | MAPLE-B2P (LTE PHY) |
| Memory Controllers | Dual DDR3/DDR3L with ECC | Dual DDR3/DDR3L with ECC |
주요 차별점
- Integrated MAPLE-B2P LTE PHY accelerator eliminates an external DSP for baseband processing (vs BSC9132NXE7MNMB (same family, different suffix))
- Heterogeneous compute (e500 CPU + SC3850 DSP) in a single 780-FCBGA package (vs Generic QorIQ without DSP cores (e.g., P1010))
- Dual DDR3/DDR3L controllers with ECC for carrier-grade reliability (vs Single-channel DDR3 controllers in lower-tier QorIQ parts)
설계 노트
The 780-FCBGA package dissipates significant heat under simultaneous e500 + SC3850 + MAPLE-B2P load. Design a minimum 4-layer PCB with a continuous ground plane beneath the BGA and at least 1 oz copper for power layers. For NULPS components rated to 105C, derate the design to a maximum 85C junction under full-load airflow. Thermal simulations should model worst-case MAPLE-B2P turbo-decoder duty cycle, which can transiently exceed 15 W.
Follow NXP's BSC9132 hardware-design guide for FCBGA breakout. Use a 1.0 mm or 0.8 mm pitch BGA land pattern with non-solder-mask-defined (NSMD) pads and microvia-in-pad construction for inner-row signals. Match trace lengths within the SerDes lanes (typically +/- 150 um tolerance) and provide reference-plane continuity under all high-speed signals to meet PCIe Gen 2 and 1G Ethernet compliance.
The BSC9132NSN7KNKB requires multiple supply rails (core VDD, DSP VDD, MAPLE VDD, DDR3 I/O, SerDes, peripherals). Use a sequenced power architecture per NXP's power-management IC reference design. Place bulk ceramic capacitors within 5 mm of each BGA power-ball cluster to suppress transient current demand when MAPLE-B2P activates during LTE subframe boundaries.
Estimated: Boot configuration is set via reset-config pins sampled at POR - miswiring these pins is a top cause of 'no console output' debugging sessions. Always validate cfg_rcw_src and cfg_rom_loc against the NXP reference-board schematic before PCB fabrication. Also confirm the JTAG chain order when the design includes both e500 and SC3850 cores - incorrect TAP concatenation prevents CodeWarrior from attaching to either core.
규정 준수 정보
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this is an infrastructure-grade SoC, not an automotive part. Lead-free BGA balls per NXP packaging specification.
