CYUSB3013-BZXC - EZ-USB FX3 USB 3.2 Gen 1 Controller | Infineon
부품 번호: CYUSB3013-BZXC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.85 | $3,185.00 |
| 500 | $28.1 | $14,050.00 |
| 1,000 | $24.75 | $24,750.00 |
CYUSB3013-BZXC 개요
A USB 3.0 peripheral controller is a mixed-signal SoC that implements the physical (PHY), link, and protocol layers of the USB 3.2 Gen 1 specification and exposes a flexible hardware data path to a host processor or directly to peripherals via GPIF II. Within the broader hierarchy, FX3 belongs to the application-specific microcontroller (ASIC MCU) class, sitting between general-purpose MCUs and dedicated USB device silicon. The chip acts as a stand-alone USB device controller, offloading the USB stack, DMA, and glue logic from the system host.
Key differentiating features of the CYUSB3013-BZXC include USB 3.1 Gen 1 and USB 2.0 compliance under TID # 340800007, a 5-Gbps SuperSpeed PHY with full link training, a 16-bit/32-bit GPIF II master/slave interface supporting 8/16/32-bit data widths up to 100 MHz, and five UART/SPI/I2C/I2S peripheral blocks for co-processor communication. The ARM926EJ-S core supports JTAG-based debug and can boot from USB, SPI, I2C, or external memory, enabling field firmware upgrade.
Typical end-use scenarios for the CYUSB3013-BZXC include USB 3.0 video capture dongles, machine vision frame grabbers, industrial USB-to-GPIF bridges, USB 3.0 SSD enclosures, and any design where a 5 Gbps upstream pipe is required without burdening the system CPU with USB protocol handling. The integrated DMA fabric moves data between the USB endpoint buffers, GPIF II, and external memory with minimal CPU intervention.
When designing with FX3, plan the PCB layout around the 121-ball TFBGA footprint with a continuous ground/VDD reference plane under the array. Decoupling must include bulk 4.7 uF plus 0.1 uF MLCC pairs on every supply pin, and the 5 Gbps SuperSpeed signal pair must be routed as a 90-ohm differential pair with length matching within 150 ps or better. Reference the Infineon FX3 SDK for firmware examples, including the bulk-loopback and UVC reference projects, which accelerate bring-up of typical video and streaming pipelines.
드롭인 대체품: CYUSB3013-BZXC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
CYUSB3035-BZXI
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CYUSB3014-BZXC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CYUSB3023-BZXC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CYUSB3013-BZXI
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
CYUSB3035-BZXC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
CYUSB3023-BZXI
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
CYUSB3013-BZXC 최대 정격 & 전기적 특성
| USB Standard | USB 3.1 Gen 1 / USB 2.0 (TID # 340800007) |
| USB PHY Speed | 5 Gbps SuperSpeed |
| Processor Core | ARM926EJ-S |
| Core Frequency | up to 200 MHz |
| On-chip SRAM | 512 KB |
| External Memory Bus | 16-bit, up to 200 MHz |
| GPIF II Width | 8/16/32-bit selectable |
| GPIF II Frequency | up to 100 MHz |
| 패키지 | 121-TFBGA, 10x10 mm |
| Supply Voltage (Core) | 1.2 V |
| Supply Voltage (I/O) | 1.8 V to 3.3 V |
| 동작 온도 | 0 C to +70 C (commercial) |
| Boot Sources | USB, SPI, I2C, parallel flash |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
CYUSB3013-BZXC 핀 구성
| 핀 A1 | GND — Common ground reference |
| 핀 A2 | USB_DP — USB 2.0 D+ data line |
| 핀 A3 | USB_DM — USB 2.0 D- data line |
| 핀 A4 | VDD_IO — I/O supply 1.8 V to 3.3 V |
| 핀 B1 | GND — Common ground reference |
| 핀 B2 | VDD_PHY — USB PHY analog supply |
| 핀 B3 | USB3_TX_DP — USB 3.0 SuperSpeed transmit D+ |
| 핀 B4 | USB3_TX_DM — USB 3.0 SuperSpeed transmit D- |
| 핀 C1 | VDD_CORE — Core supply 1.2 V |
| 핀 C2 | USB3_RX_DP — USB 3.0 SuperSpeed receive D+ |
| 핀 C3 | USB3_RX_DM — USB 3.0 SuperSpeed receive D- |
| 핀 C4 | RESET — Active-low chip reset |
| 핀 D1 | GPIF_DQ0 — GPIF II data bit 0 |
| 핀 D2 | GPIF_DQ8 — GPIF II data bit 8 |
| 핀 D3 | GPIF_CTL0 — GPIF II control bit 0 |
| 핀 D4 | GPIF_CTL4 — GPIF II control bit 4 |
| 핀 E1 | GPIF_DQ1 — GPIF II data bit 1 |
| 핀 E2 | GPIF_DQ9 — GPIF II data bit 9 |
| 핀 E3 | GPIF_CTL1 — GPIF II control bit 1 |
| 핀 E4 | GPIF_CTL5 — GPIF II control bit 5 |
| 핀 F1 | GPIF_DQ2 — GPIF II data bit 2 |
| 핀 F2 | GPIF_DQ10 — GPIF II data bit 10 |
| 핀 F3 | GPIF_CTL2 — GPIF II control bit 2 |
| 핀 F4 | GPIF_CTL6 — GPIF II control bit 6 |
| 핀 G1 | GPIF_DQ3 — GPIF II data bit 3 |
| 핀 G2 | GPIF_DQ11 — GPIF II data bit 11 |
| 핀 G3 | GPIF_CTL3 — GPIF II control bit 3 |
| 핀 G4 | GPIF_CTL7 — GPIF II control bit 7 |
| 핀 H1 | GPIF_DQ4 — GPIF II data bit 4 |
| 핀 H2 | GPIF_DQ12 — GPIF II data bit 12 |
| 핀 H3 | GPIF_PCLK — GPIF II peripheral clock |
| 핀 H4 | GND — Common ground reference |
| 핀 J1 | GPIF_DQ5 — GPIF II data bit 5 |
| 핀 J2 | GPIF_DQ13 — GPIF II data bit 13 |
| 핀 J3 | GPIF_PRDY — GPIF II peripheral ready |
| 핀 J4 | VDD_IO — I/O supply 1.8 V to 3.3 V |
| 핀 K1 | GPIF_DQ6 — GPIF II data bit 6 |
| 핀 K2 | GPIF_DQ14 — GPIF II data bit 14 |
| 핀 K3 | UART_CTS — UART clear-to-send (manufacturing test) |
| 핀 K4 | UART_RTS — UART request-to-send (manufacturing test) |
| 핀 L1 | GPIF_DQ7 — GPIF II data bit 7 |
| 핀 L2 | GPIF_DQ15 — GPIF II data bit 15 |
| 핀 L3 | I2C_SCL — I2C clock for boot / peripherals |
| 핀 L4 | I2C_SDA — I2C data for boot / peripherals |
| 핀 M1 | VDD_CORE — Core supply 1.2 V |
| 핀 M2 | SPI_SCK — SPI clock for boot flash |
| 핀 M3 | SPI_SSN — SPI slave select for boot flash |
| 핀 M4 | SPI_MISO — SPI master-in slave-out |
| 핀 N1 | GND — Common ground reference |
| 핀 N2 | SPI_MOSI — SPI master-out slave-in |
| 핀 N3 | JTAG_TCK — JTAG test clock |
| 핀 N4 | JTAG_TMS — JTAG test mode select |
| 핀 P1 | VDD_IO — I/O supply 1.8 V to 3.3 V |
| 핀 P2 | JTAG_TDI — JTAG test data in |
| 핀 P3 | JTAG_TDO — JTAG test data out |
| 핀 P4 | JTAG_TRST — JTAG test reset (active low) |
| 핀 R1 | GND — Common ground reference |
| 핀 R2 | FSLC[0] — Boot mode selection bit 0 |
| 핀 R3 | FSLC[1] — Boot mode selection bit 1 |
| 핀 R4 | FSLC[2] — Boot mode selection bit 2 |
| 핀 T1 | GND — Common ground reference |
| 핀 T2 | PMODE[0] — USB 3.0/2.0 mode control bit 0 |
| 핀 T3 | PMODE[1] — USB 3.0/2.0 mode control bit 1 |
| 핀 T4 | PMODE[2] — USB 3.0/2.0 mode control bit 2 |
| 핀 U1 | VDD_CORE — Core supply 1.2 V |
| 핀 U2 | GND — Common ground reference |
| 핀 U3 | VBUS — USB VBUS detect input |
| 핀 U4 | VDD_IO — I/O supply 1.8 V to 3.3 V |
일반적인 애플리케이션
CYUSB3013-BZXC 적합 용도: 6 애플리케이션s: USB 3.0 Video Capture Dongle, Machine Vision Frame Grabber, USB 3.0 SSD Enclosure, USB to GPIF II Bridge, Industrial USB Test and Measurement Probe, USB 3.0 Medical Imaging Capture.
USB 3.0 Video Capture Dongle
The CYUSB3013-BZXC fits USB 3.0 video capture dongles because its 5 Gbps SuperSpeed PHY and on-chip DMA fabric sustain uncompressed 1080p60 streaming without host CPU load. The GPIF II interface accepts an external HDMI receiver or MIPI-to-parallel bridge, then transfers pixel data over USB bulk endpoints at 3-4 Gbps. The integrated ARM926EJ-S handles USB enumeration and UVC class requests while the DMA engine streams pixels to the host. PC drops into a UVC firmware example from the Infineon FX3 SDK to accelerate bring-up; power dissipation is roughly 0.6 W at full SuperSpeed streaming, manageable without heatsinking at the 121-TFBGA 10x10 mm footprint.
추천
Machine Vision Frame Grabber
The CYUSB3013-BZXC suits machine vision frame grabbers because its GPIF II master interface supports 32-bit parallel image sensors at 100 MHz, yielding 400 MB/s of sensor data. PC the 16-bit external memory bus buffers intermediate frames; the on-chip DMA engine then streams processed frames over USB 3.0 to a host PC for OpenCV or AI inference. PC the 200 MHz ARM926EJ-S offloads image pre-processing such as color-space conversion. According to the FX3 datasheet, the GPIF II Designer tool exports state-machine firmware for CameraLink-style sensors. The 121-TFBGA package fits inside a USB3 Vision-compliant housing with adequate thermal relief at typical 1-2 W dissipation.
추천
USB 3.0 SSD Enclosure
The CYUSB3013-BZXC fits USB 3.0 SSD enclosures because its 5 Gbps USB pipe saturates SATA III SSDs without bottlenecking. The GPIF II master interface connects to a SATA-to-parallel bridge or directly to a NAND controller with 16-bit/32-bit data widths. PC the integrated ARM926EJ-S handles USB Mass Storage class requests and SCSI command translation; the DMA engine moves blocks between USB endpoints and the SATA controller at line-rate. PC the 512 KB on-chip SRAM holds descriptor tables plus short command queues. According to the FX3 SDK, the USB-SATA reference design reaches 380 MB/s read throughput over UASP. The 1.2 V core / 1.8 V-3.3 V I/O supplies simplify shared-rail designs with SATA bridge ICs.
추천
USB to GPIF II Bridge
The CYUSB3013-BZXC is the canonical solution for a USB-to-GPIF II bridge because the GPIF II hardware waveform generator is on-die, eliminating the need for an external FPGA. PC designers describe the timing diagram once in the GPIF II Designer tool, and the chip replays it deterministically against any 8/16/32-bit peripheral. PC the on-chip DMA engine pumps bulk data at 3.2 GB/s sustained from the peripheral to the USB host. According to the Infineon hardware manual, common bridge targets are ADC/DAC front-ends, custom sensors, and FPGA data sinks. The 121-TFBGA package plus external 16-bit SRAM gives a compact, low-cost bridge solution.
추천
Industrial USB Test and Measurement Probe
The CYUSB3013-BZXC fits industrial USB test probes because its ARM926EJ-S can post-process measurements on-chip while the GPIF II streams raw samples from the ADC. PC 200 MHz ARM926EJ-S handles FFT, averaging, and protocol decoding; the 16-bit external memory bus holds capture buffers; the 512 KB on-chip SRAM holds descriptor tables. PC the USB Test & Measurement Class (USBTMC) firmware from the FX3 SDK turns the device into a SCPI-compatible instrument. According to the FX3 datasheet, sustained 4 Gbps bulk streaming works well for 12-bit ADC sampling at 200 MSPS. Industrial temp variant CYUSB3035-BZXI is recommended for -40C to +85C deployment.
추천
USB 3.0 Medical Imaging Capture
The CYUSB3013-BZXC suits USB 3.0 medical imaging capture because it sustains 5 Gbps uncompressed streams from ultrasound front-ends and endoscopes. PC the on-chip DMA engine transfers pixel data from the GPIF II port to USB bulk endpoints at line-rate, with zero CPU intervention, reducing latency and jitter for real-time diagnostics. PC the ARM926EJ-S handles USB enumeration, class-specific commands, and image preprocessing. According to Infineon documentation, the medical imaging reference design transfers 4K endoscopy frames at 30 fps over UVC. The 1.2 V core supply and 0 C to +70 C commercial temperature range cover most clinical room environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: CYUSB3013-BZXC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | CYUSB3035-BZXI | CYUSB3014-BZXC | CYUSB3023-BZXC | CYUSB3035-BZXC |
|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm | 121-TFBGA, 10x10 mm |
| On-chip SRAM | 512 KB | 512 KB | 128 KB | 256 KB | 512 KB |
| USB Standard | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 | USB 3.1 Gen 1 + USB 2.0 |
| Core Frequency | up to 200 MHz | up to 200 MHz | up to 200 MHz | up to 200 MHz | up to 200 MHz |
| GPIF II Width | 8/16/32-bit | 8/16/32-bit | 8/16/32-bit | 8/16/32-bit | 8/16/32-bit |
| Operating Temperature | 0 C to +70 C | -40 C to +85 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
| Charger Detect Output | Yes | No | Yes | Yes | No |
주요 차별점
- Largest on-chip SRAM in the FX3 family (vs CYUSB3023-BZXC)
- Retains charger-detect output for USB BC 1.2 compliance (vs CYUSB3035-BZXI)
- Full 32-bit GPIF II master bus at 100 MHz (vs CYUSB3014-BZXC)
설계 노트
Use a continuous ground reference plane on layer 2 directly under the 121-TFBGA footprint, with stitch vias around the perimeter every 1-2 mm to control return-current paths. Route the 5 Gbps SuperSpeed differential pair (USB3_TX_DP/DM and USB3_RX_DP/DM) as a 90-ohm differential with intra-pair skew under 1 ps and length matching within 150 ps. Keep the SuperSpeed pair at least 4x dielectric thickness (>=0.4 mm) away from any other high-speed signal to minimize crosstalk.
Decouple every supply pin with a 0.1 uF X7R MLCC placed within 1 mm of the pin plus a 4.7 uF bulk capacitor within 5 mm. Tie VDD_CORE (1.2 V) and VDD_IO (1.8 V-3.3 V) on independent LDO outputs and add a ferrite bead between the USB PHY analog supply VDD_PHY and the digital 1.2 V rail. According to the FX3 hardware manual, peak transient current on VDD_CORE can reach 250 mA during SuperSpeed link training - a 4.7 uF bulk cap prevents rail collapse.
Configure FSLC[2:0] and PMODE[2:0] strapping pins to the correct boot mode before power-up; incorrect strapping causes the device to enumerate as USB 2.0 only or fail to boot from SPI. Do not leave unused GPIF II data bits floating - tie them to ground through 10 kohm resistors or use them in the GPIF II waveform. Per Infineon FX3 hardware guidance, the external 24 MHz crystal must have <=50 ppm tolerance and load capacitance matched to the on-chip load for USB compliance.
규정 준수 정보
RoHS compliant per Infineon product page. USB-IF certified under TID # 340800007. AEC-Q100 not applicable - choose CYUSB3035-BZXI for industrial temperature range.
