DSPIC33CH256MP506-I/MR - Dual-Core DSC 256KB Flash | Microchip
부품 번호: DSPIC33CH256MP506-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $9.2 | $92.00 |
| 100 | $8.45 | $845.00 |
| 500 | $7.7 | $3,850.00 |
| 1,000 | $7.05 | $7,050.00 |
DSPIC33CH256MP506-I/MR 개요
A Digital Signal Controller (DSC) combines a microcontroller's deterministic interrupt handling with a DSP's computational throughput for closed-loop control applications. In the dsPIC33CH family, Microchip pioneered a true dual-core architecture where the secondary (slave) core can offload time-critical DSP tasks (sensorless FOC, digital filtering, power conversion math) from the primary (master) core which runs the application state machine and communication stacks. This partitioning delivers higher system bandwidth than single-core DSCs at the same clock rate.
Key features include dual dsPIC DSC cores with independent peripherals, hardware safety features for ISO 26262 functional safety integration, four 12-bit ADC modules with up to 3.5 MSPS sampling rate, dedicated High-Resolution PWM (250 ps resolution) for precision motor and digital power control, and CAN FD interfaces supporting automotive bit rates. The 64-pin QFN package (MR suffix) provides a compact 9x9 mm footprint suitable for space-constrained power-conversion and motor-drive designs.
Typical applications span sensorless field-oriented control (FOC) of PMSM, BLDC, and AC induction motors, digital switch-mode power supplies (SMPS) with PFC, photovoltaic micro-inverters, automotive body and chassis ECUs, and industrial drives up to several kW. The dual-core architecture reduces firmware complexity in safety-critical designs by isolating diagnostic and supervision tasks on the secondary core.
Designers should provide 100 nF decoupling at every VDD/VSS pair, route the two cores' PGECx/PGEDx programming pairs to a dedicated header, and verify the high-resolution PWM load to ground (PGx) routing minimises switching noise coupling into the ADC analog inputs. Always consult the manufacturer datasheet for full register definitions and electrical characteristics before committing to layout.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same dsPIC33CH family, and practical design notes beyond what the manufacturer datasheet provides as a single document.
드롭인 대체품: DSPIC33CH256MP506-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CH256MP506-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Operating Temperature, Program Memory (Flash), RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CH256MP505-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CH256MP506-I/MR 최대 정격 & 전기적 특성
| Product Type | 16-bit Dual-Core Digital Signal Controller (DSC) |
| Family | dsPIC33CH, Functional Safety (FuSa) |
| Program Memory (Flash) | 328 kB (328k x 8) |
| Data RAM | 64 kB |
| Primary Core Speed | 200 MHz (100 MIPS) |
| Secondary Core Speed | 180 MHz (90 MIPS) |
| Core Architecture | Dual 16-bit dsPIC DSC cores |
| Operating Voltage | 3.0 V to 3.6 V |
| 패키지 | 64-pin QFN (9x9 mm), MR suffix |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 C to +85 C (Industrial) |
| CAN FD | Yes |
| PWM Resolution | High-Resolution PWM (250 ps) |
| ADC | 12-bit, multiple modules |
| RoHS 상태 | Compliant |
DSPIC33CH256MP506-I/MR 핀 구성
| 핀 1 | RP46/PWM1H — Remappable peripheral / PWM output |
| 핀 2 | RP47/PWM1L — Remappable peripheral / PWM complementary output |
| 핀 3 | VDD — Digital supply voltage |
| 핀 4 | VSS — Digital ground |
| 핀 5 | RP48/PWM2H — Remappable peripheral / PWM output |
| 핀 6 | RP49/PWM2L — Remappable peripheral / PWM complementary output |
| 핀 7 | OSCI — Crystal oscillator input |
| 핀 8 | OSCO — Crystal oscillator output |
| 핀 9 | RP50/PWM3H — Remappable peripheral / PWM output |
| 핀 10 | RP51/PWM3L — Remappable peripheral / PWM complementary output |
| 핀 11 | VDD — Digital supply voltage |
| 핀 12 | VSS — Digital ground |
| 핀 13 | AN0 — Analog input / ADC channel 0 |
| 핀 14 | AN1 — Analog input / ADC channel 1 |
| 핀 15 | AN2 — Analog input / ADC channel 2 |
| 핀 16 | AN3 — Analog input / ADC channel 3 |
| 핀 17 | AVDD — Analog supply voltage |
| 핀 18 | AVSS — Analog ground |
| 핀 19 | AN4 — Analog input / ADC channel 4 |
| 핀 20 | AN5 — Analog input / ADC channel 5 |
| 핀 21 | AN6 — Analog input / ADC channel 6 |
| 핀 22 | AN7 — Analog input / ADC channel 7 |
| 핀 23 | VDD — Digital supply voltage |
| 핀 24 | VSS — Digital ground |
| 핀 25 | RP52/PWM4H — Remappable peripheral / PWM output |
| 핀 26 | RP53/PWM4L — Remappable peripheral / PWM complementary output |
| 핀 27 | RP54/PWM5H — Remappable peripheral / PWM output |
| 핀 28 | RP55/PWM5L — Remappable peripheral / PWM complementary output |
| 핀 29 | RP56/PWM6H — Remappable peripheral / PWM output |
| 핀 30 | RP57/PWM6L — Remappable peripheral / PWM complementary output |
| 핀 31 | CAN1TX — CAN FD transmit |
| 핀 32 | CAN1RX — CAN FD receive |
| 핀 33 | VDD — Digital supply voltage |
| 핀 34 | VSS — Digital ground |
| 핀 35 | RP58/PWM7H — Remappable peripheral / PWM output |
| 핀 36 | RP59/PWM7L — Remappable peripheral / PWM complementary output |
| 핀 37 | RP60/PWM8H — Remappable peripheral / PWM output |
| 핀 38 | RP61/PWM8L — Remappable peripheral / PWM complementary output |
| 핀 39 | RP62/PWM9H — Remappable peripheral / PWM output |
| 핀 40 | RP63/PWM9L — Remappable peripheral / PWM complementary output |
| 핀 41 | SDA1 — I2C data |
| 핀 42 | SCL1 — I2C clock |
| 핀 43 | PGEC1 — Programming/debug clock |
| 핀 44 | PGED1 — Programming/debug data |
| 핀 45 | PGEC2 — Alternate programming clock |
| 핀 46 | PGED2 — Alternate programming data |
| 핀 47 | MCLR — Master clear / reset |
| 핀 48 | VDD — Digital supply voltage |
| 핀 49 | VSS — Digital ground |
| 핀 50 | RP64/PWM10H — Remappable peripheral / PWM output |
| 핀 51 | RP65/PWM10L — Remappable peripheral / PWM complementary output |
| 핀 52 | RP66 — Remappable peripheral I/O |
| 핀 53 | RP67 — Remappable peripheral I/O |
| 핀 54 | RP68 — Remappable peripheral I/O |
| 핀 55 | RP69 — Remappable peripheral I/O |
| 핀 56 | RP70 — Remappable peripheral I/O |
| 핀 57 | RP71 — Remappable peripheral I/O |
| 핀 58 | CAN2TX — CAN FD transmit (secondary) |
| 핀 59 | CAN2RX — CAN FD receive (secondary) |
| 핀 60 | VDD — Digital supply voltage |
| 핀 61 | VSS — Digital ground |
| 핀 62 | RP72 — Remappable peripheral I/O |
| 핀 63 | RP73 — Remappable peripheral I/O |
| 핀 64 | RP74 — Remappable peripheral I/O |
일반적인 애플리케이션
DSPIC33CH256MP506-I/MR 적합 용도: 6 애플리케이션s: Field-Oriented Control (FOC) of PMSM/BLDC Motors, Digital Switch-Mode Power Supplies (SMPS) with PFC, Automotive Body and Chassis ECUs, Photovoltaic Micro-Inverters and Solar Optimisers, Industrial Servo Drives and Robotics, Hearing Aids and Medical Wearables.
Field-Oriented Control (FOC) of PMSM/BLDC Motors
The DSPIC33CH256MP506-I/MR is purpose-built for sensorless and sensored FOC of PMSM, BLDC, and AC induction motors up to several kW. The dual-core architecture allows the secondary core to execute the high-frequency current control loop (typical 20-50 kHz) with the DSP engine handling Clarke/Park transforms, SVPWM, and flux estimation, while the primary core runs the slower speed/torque state machine and CAN/Modbus communication. The 250 ps high-resolution PWM minimises current ripple and audible noise, and the four 12-bit ADCs sampled at up to 3.5 MSPS synchronise to the PWM reload to eliminate sampling jitter on phase currents.
추천
Digital Switch-Mode Power Supplies (SMPS) with PFC
For digital control of totem-pole PFC, LLC, phase-shifted full-bridge, and other high-frequency SMPS topologies, the DSPIC33CH256MP506-I/MR delivers the necessary computational bandwidth and analog performance. The slave core handles voltage-mode and average-current-mode control loops at 100-500 kHz switching frequencies with cycle-by-cycle ADC triggering, while the master core manages housekeeping, telemetry, and PMBus/I2C interfaces. The high-resolution PWM and configurable dead-time generators support GaN and SiC FET drivers directly, eliminating analog PWM controller ICs.
추천
Automotive Body and Chassis ECUs
The DSPIC33CH256MP506-I/MR's Functional Safety (FuSa) peripherals, dual-core lockstep capability, and CAN FD interfaces make it a strong fit for automotive body controllers, electric power steering pumps, and chassis ECUs. The slave core can run self-diagnostic routines concurrently with the master core's application tasks, supporting ISO 26262 ASIL-B designs. The industrial -40 to +85 C temperature grade covers most cabin and under-hood zones, and the wide CAN FD bit-rate range enables modern automotive network backbones.
추천
Photovoltaic Micro-Inverters and Solar Optimisers
Photovoltaic micro-inverters and module-level power electronics benefit from the DSPIC33CH256MP506-I/MR's dual-core partitioning: the slave core implements MPPT and grid-tie current control, while the master core handles anti-islanding detection, relay control, and PLC/wireless communication. The high-resolution PWM and high-speed ADC enable interleaved topologies that meet IEEE 1547 harmonic limits. The 64-pin QFN (9x9 mm) package fits within the tight PCB area constraints of a module-mount enclosure.
추천
Industrial Servo Drives and Robotics
Industrial servo drives for CNC machines, robotics arms, and pick-and-place equipment leverage the DSPIC33CH256MP506-I/MR for high-bandwidth torque and position loops. The dual cores support simultaneous execution of the current loop (slave), velocity loop (master), and trajectory planner (master) without scheduler-induced jitter. The device's hardware QEI interfaces accept directly from incremental encoders, and its CAN FD port connects to multi-axis EtherCAT/CANopen backbones. The 64-pin QFN's exposed pad provides the thermal headroom required for sustained switching at high PWM duty cycles.
추천
Hearing Aids and Medical Wearables
Battery-powered hearing aids and medical wearable devices benefit from the DSPIC33CH256MP506-I/MR's low-power dsPIC33CH sleep modes combined with substantial DSP throughput for real-time audio processing. The dual-core architecture allows audio codec and beamforming DSP to run on the slave core while the master core handles BLE/communication stacks and battery management. The QFN package fits in ear-level enclosures, and the integrated 12-bit ADCs interface directly with MEMS microphones.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CH256MP506-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CH256MP505-I/MR | DSPIC33CH256MP506-I/PT | DSPIC33CH256MP508-I/PT | DSPIC33CH256MP208-I/PT |
|---|---|---|---|---|---|
| Package | 64-pin QFN (9x9) | 64-pin QFN (9x9) - same | 64-pin TQFP (10x10) | 80-pin TQFP | 64-pin TQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 328 kB | 128 kB (-61%) | 328 kB (same) | 328 kB (same) | 328 kB (same) |
| RAM | 64 kB | 64 kB | 64 kB | 64 kB | Reduced |
| Primary Core Speed | 200 MHz (100 MIPS) | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Secondary Core | Yes (180 MHz / 90 MIPS) | Yes | Yes | Yes | Yes |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| High-Resolution PWM | Yes (250 ps) | Yes | Yes | Yes | Yes |
주요 차별점
- True dual-core architecture with hardware mailboxes (vs DSPIC33EP256MC506)
- Functional Safety (FuSa) peripherals integrated (vs DSPIC33CH128MP506-I/PT)
- High-Resolution PWM with 250 ps edge placement (vs DSPIC33CK256MP508)
설계 노트
Decouple every VDD/VSS pair with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus a bulk 10 uF tantalum or ceramic at the package entry. Separate analog AVDD/AVSS with a ferrite bead or LC filter from the noisy digital supply to preserve ADC accuracy. Estimate: with four VDD pins at 3.3 V drawing ~50 mA each, expect 200 mA worst-case inrush during PLL lock - the bulk cap should be at least 10x the high-frequency decoupling total.
The 64-pin QFN (9x9 mm) requires a continuous ground plane with stitched vias around the perimeter of the exposed pad (EP). Use a 5x5 array of 0.3 mm thermal vias under the EP to keep junction temperature below 100 C at 1 W dissipation. Route high-speed PWM outputs first (shortest path to gate drivers), then analog inputs last (with guard traces). Provide separate ground returns for switching currents and ADC sampling.
Keep ADC analog traces short and routed over a continuous ground plane, away from PWM switching nodes by at least 3 mm or shielded by a grounded trace. Use 50 ohm controlled impedance for the crystal traces between OSCI and OSCO, and place the crystal within 10 mm of the MCU. Add a 1 Mohm parallel resistor across the crystal to limit drive level and prevent overdrive on faster dsPIC33CH parts. For high-resolution PWM, ensure the gate-driver supply is decoupled locally to prevent PWM-edge jitter from propagating back into the MCU supply.
Do not connect the slave core's PGECx/PGEDx pair to the same ICSP header as the master core's pair without isolation - this confuses the programmer. Always use the dedicated PGEC2/PGED2 pair for the slave core when debugging both cores. Verify the FS (Functional Safety) peripherals are properly configured before relying on lockstep; otherwise a single fault on the slave core may go undetected. Estimated: a typical motor-control application uses ~30 kB Flash on the slave core and ~80 kB on the master, leaving margin for safety libraries.
규정 준수 정보
Industrial -40 to +85 C temperature grade. RoHS and REACH compliance per Microchip product page. AEC-Q100 -E/-M temperature variants are available in the same family for automotive applications.
