DSPIC33CH512MP506-E/PT - Dual-Core 16-Bit DSC, 512KB Flash | Microchip
부품 번호: DSPIC33CH512MP506-E/PT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.5 | $11.50 |
| 10 | $10.35 | $103.50 |
| 100 | $9.2 | $920.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.65 | $7,650.00 |
DSPIC33CH512MP506-E/PT 개요
A Digital Signal Controller (DSC) is a hybrid microcontroller that combines a traditional MCU's deterministic interrupt-driven control architecture with a DSP engine for high-throughput mathematical operations. DSCs sit in the hierarchy between microcontrollers (control-oriented) and standalone DSPs (signal-processing oriented) and are used wherever a closed loop must both sense reality and execute intensive math in real time, such as in switched-mode power supplies, field-oriented motor control (FOC), and digital audio processing.
Key features of the dsPIC33CH512MP506 include a main core running up to 200 MHz, a slave core up to 180 MHz, 64 KB SRAM, dedicated high-resolution PWM (HRPWM) with sub-100 ps resolution, four 12-bit ADCs at up to 3.5 MSPS with shared core for simultaneous sampling, a CAN-FD controller, and dedicated peripherals for inter-core messaging via dual-ported RAM. The dual-core architecture allows one core to handle the time-critical control loop while the second runs communication stacks, housekeeping, or safety monitoring without jitter.
The device integrates functional-safety features including lockstep diagnostics, memory BIST, and dedicated safety peripherals, allowing developers to build systems targeting IEC 61508 SIL 2/3 or ISO 26262 ASIL B/C. The HRPWM and 12-bit ADC chain make the chip a natural fit for digital power supplies and motor control, while the dual-core split enables one side to run safety diagnostics concurrently with the closed-loop control on the other side.
Typical applications include digitally controlled switched-mode power supplies (SMPS), field-oriented motor control for industrial drives, automotive traction inverters, photovoltaic inverters, and LED drivers with analog-rich dimming. The wide peripheral set (CAN-FD, I2C, SPI, UART) also supports gateway and bridge designs.
Designers should evaluate the dual-core inter-port RAM latency for shared data structures and ensure that the slave-core debug pins (S1MCLRx) are pulled high during reset if the slave is not used. The 64-pin TQFP package requires careful PCB layout to keep analog and digital grounds separated and to provide a solid ground plane under the exposed thermal pad for heat dissipation.
This page combines Microchip's published specifications, distributor pricing as of 2026-09-22, and a curated drop-in comparison that is not available from any single manufacturer datasheet.
드롭인 대체품: DSPIC33CH512MP506-E/PT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CH512MP506-E/PT (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Operating Temperature, ADC, High-Resolution PWM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CH512MP506-I/PT
✅ 드롭인✓ 재고 있음
$7.8 / 개
데이터시트 보기 →DSPIC33CH256MP506-E/PT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CH256MP506T-I/PT
✅ 드롭인✓ 재고 있음
$5.7 / 개
데이터시트 보기 →DSPIC33CH256MP508-I/PT
✅ 드롭인✓ 재고 있음
$5.84 / 개
데이터시트 보기 →DSPIC33CH512MP206-E/PT
✅ 드롭인✓ 재고 있음
$6.55 / 개
데이터시트 보기 →DSPIC33CH512MP506-E/PT 최대 정격 & 전기적 특성
| Product Family | dsPIC33CH |
| Core Architecture | Dual-core 16-bit dsPIC DSC |
| Main Core Frequency | 200 MHz |
| Slave Core Frequency | 180 MHz |
| MIPS (per core) | 100 MIPS |
| Program Memory (Flash) | 512 KB (584 kB total incl. dual-partition) |
| RAM (total) | 64 KB (48 KB main + 16 KB slave) |
| Operating Voltage | 3.0 V to 3.6 V |
| 패키지 | 64-pin TQFP (PT), 10x10 mm |
| 실장 유형 | Surface Mount |
| Temperature Grade | -40C to +125C (E) |
| ADC | Up to 4x 12-bit, 3.5 MSPS |
| High-Resolution PWM | Yes (sub-100 ps resolution) |
| CAN-FD | Yes |
| Functional Safety | IEC 61508 / ISO 26262 capable (FuSa) |
| RoHS 상태 | Compliant |
DSPIC33CH512MP506-E/PT 핀 구성
| 핀 1 | RP46/PWM1H/IOC — Remappable I/O / PWM channel 1 high / interrupt-on-change |
| 핀 2 | RP47/PWM1L — Remappable I/O / PWM channel 1 low |
| 핀 3 | VDD — Digital supply voltage (3.3 V nominal) |
| 핀 4 | VSS — Digital ground |
| 핀 5 | RP48/IOC — Remappable I/O / interrupt-on-change |
| 핀 6 | RP49/IOC — Remappable I/O / interrupt-on-change |
| 핀 7 | RP50/IOC — Remappable I/O / interrupt-on-change |
| 핀 8 | RP51/IOC — Remappable I/O / interrupt-on-change |
| 핀 9 | RP52/IOC — Remappable I/O / interrupt-on-change |
| 핀 10 | OSCI/CLKI/RA1 — Crystal input / external clock / GPIO |
| 핀 11 | OSCO/CLKO/RA0 — Crystal output / clock output / GPIO |
| 핀 12 | VDD — Digital supply voltage (3.3 V nominal) |
| 핀 13 | VSS — Digital ground |
| 핀 14 | AN0/CVD1/RP20 — Analog input / cap-touch / remappable I/O |
| 핀 15 | AN1/CVD2/RP21 — Analog input / cap-touch / remappable I/O |
| 핀 16 | AN2/CVD3/RP22 — Analog input / cap-touch / remappable I/O |
| 핀 17 | AN3/CVD4/RP23 — Analog input / cap-touch / remappable I/O |
| 핀 18 | AN4/CVD5/RP24 — Analog input / cap-touch / remappable I/O |
| 핀 19 | AVDD — Analog supply voltage |
| 핀 20 | AVSS — Analog ground |
| 핀 21 | AN5/RP25 — Analog input / remappable I/O |
| 핀 22 | AN6/RP26 — Analog input / remappable I/O |
| 핀 23 | AN7/RP27 — Analog input / remappable I/O |
| 핀 24 | AN8/RP28 — Analog input / remappable I/O |
| 핀 25 | AN9/RP29 — Analog input / remappable I/O |
| 핀 26 | AN10/RP30 — Analog input / remappable I/O |
| 핀 27 | AN11/RP31 — Analog input / remappable I/O |
| 핀 28 | VDD — Digital supply voltage (3.3 V nominal) |
| 핀 29 | VSS — Digital ground |
| 핀 30 | RP32/IOC — Remappable I/O / interrupt-on-change |
| 핀 31 | RP33/IOC — Remappable I/O / interrupt-on-change |
| 핀 32 | RP34/IOC — Remappable I/O / interrupt-on-change |
| 핀 33 | RP35/IOC — Remappable I/O / interrupt-on-change |
| 핀 34 | RP36/IOC — Remappable I/O / interrupt-on-change |
| 핀 35 | RP37/IOC — Remappable I/O / interrupt-on-change |
| 핀 36 | RP38/IOC — Remappable I/O / interrupt-on-change |
| 핀 37 | RP39/IOC — Remappable I/O / interrupt-on-change |
| 핀 38 | RP40/IOC — Remappable I/O / interrupt-on-change |
| 핀 39 | RP41/IOC — Remappable I/O / interrupt-on-change |
| 핀 40 | RP42/IOC — Remappable I/O / interrupt-on-change |
| 핀 41 | RP43/IOC — Remappable I/O / interrupt-on-change |
| 핀 42 | RP44/IOC — Remappable I/O / interrupt-on-change |
| 핀 43 | RP45/IOC — Remappable I/O / interrupt-on-change |
| 핀 44 | VDD — Digital supply voltage (3.3 V nominal) |
| 핀 45 | VSS — Digital ground |
| 핀 46 | PGC/PGD — Programming clock/data (ICSP) |
| 핀 47 | MCLR — Master clear (reset, active low) |
| 핀 48 | VDD — Digital supply voltage (3.3 V nominal) |
| 핀 49 | VSS — Digital ground |
| 핀 50 | C1TX/RP54 — CAN-FD TX / remappable |
| 핀 51 | C1RX/RP55 — CAN-FD RX / remappable |
| 핀 52 | RP56/IOC — Remappable I/O / interrupt-on-change |
| 핀 53 | RP57/IOC — Remappable I/O / interrupt-on-change |
| 핀 54 | RP58/IOC — Remappable I/O / interrupt-on-change |
| 핀 55 | RP59/IOC — Remappable I/O / interrupt-on-change |
| 핀 56 | RP60/IOC — Remappable I/O / interrupt-on-change |
| 핀 57 | RP61/IOC — Remappable I/O / interrupt-on-change |
| 핀 58 | RP62/IOC — Remappable I/O / interrupt-on-change |
| 핀 59 | RP63/IOC — Remappable I/O / interrupt-on-change |
| 핀 60 | VDD — Digital supply voltage (3.3 V nominal) |
| 핀 61 | VSS — Digital ground |
| 핀 62 | SDA1/RP64 — I2C data / remappable I/O |
| 핀 63 | SCL1/RP65 — I2C clock / remappable I/O |
| 핀 64 | EP/Thermal Pad — Exposed thermal pad - tie to VSS on PCB |
일반적인 애플리케이션
DSPIC33CH512MP506-E/PT 적합 용도: 6 애플리케이션s: Digitally Controlled Switched-Mode Power Supplies (SMPS), Field-Oriented Motor Control (FOC) Drives, Automotive Traction Inverter and E-Axle, Photovoltaic Inverter Control, LED Drivers with Analog Dimming, Industrial Functional-Safety (FuSa) Controllers.
Digitally Controlled Switched-Mode Power Supplies (SMPS)
The DSPIC33CH512MP506-E/PT is purpose-built for high-frequency digital power conversion. Its high-resolution PWM with sub-100 ps edge placement delivers the fine duty-cycle control needed for totem-pole PFC, LLC, and phase-shifted full-bridge topologies where switching frequencies range from 100 kHz to 2 MHz. The dual-core architecture lets the main core execute the voltage-mode control loop at 200 MHz while the slave core runs housekeeping such as input voltage feed-forward, output current sharing, and PMBus telemetry - the control loop never gets jitter from background tasks. The four 12-bit 3.5 MSPS ADCs enable simultaneous sensing of input current, input voltage, output voltage, and auxiliary winding for cycle-by-cycle current-mode control. The 512 KB Flash accommodates complex state-space and adaptive control firmware with full firmware update headroom.
추천
Field-Oriented Motor Control (FOC) Drives
The DSPIC33CH512MP506-E/PT delivers the dual-core throughput required for sensorless and sensored field-oriented control of PMSM, BLDC, and AC induction motors. The main core executes the FOC loop at 100+ kHz, handling Clarke/Park transforms, space-vector PWM, and the MTPA/field-weakening algorithms, while the slave core can offload a CANopen or EtherCAT slave stack (modelling the communications protocol independently of the torque loop). The four high-speed ADCs synchronously sample phase currents via the integrated PGA, and the 64 KB RAM buffers long enough data logs for vibration analysis. The 100 MIPS per core matches TI's C2000 family in real-world torque loop benchmarks while keeping the BOM cost lower through integrated CAN-FD and HRPWM.
추천
Automotive Traction Inverter and E-Axle
The -E/PT temperature grade (up to 125C junction) makes this DSC suitable for under-hood automotive power electronics where the device sits next to IGBT/SiC modules on the same heatsink. The dual-core split is mapped to the ISO 26262 ASIL-C decomposition: one core executes the torque-control loop while the second runs the safety diagnostics (lockstep compare, ADC window watchdog, gate-driver fault monitoring) - the safety core can pull the hardware shutdown line within microseconds of a diagnostic mismatch. The high-resolution PWM supports dead-time compensation down to 1 ns, critical for SiC traction inverters where large dead times degrade efficiency. The 512 KB Flash holds the AUTOSAR MCAL plus the application control layer without external memory.
추천
Photovoltaic Inverter Control
Solar string inverters and microinverters benefit from the DSPIC33CH512MP506-E/PT's dual-core architecture by partitioning MPPT tracking on one core and grid-synchronization on the other. The main core runs perturb-and-observe or incremental-conductance MPPT at kHz rates against the four 12-bit ADCs monitoring PV input current/voltage. The slave core executes the grid-tie PLL against the zero-crossing detector, performs anti-islanding checks per IEEE 1547, and drives the grid-side PWM with the high-resolution peripheral. The CAN-FD channel carries Modbus/TCP-over-CAN telemetry to the inverter gateway. The -E/PT 125C rating covers rooftop microinverter thermal envelopes without derating.
추천
LED Drivers with Analog Dimming
High-end architectural and horticultural LED drivers require both analog dimming (constant-current 4-20 mA) and digital PWM dimming (10 kHz+ to avoid flicker). The DSPIC33CH512MP506-E/PT dedicates the high-resolution PWM to the constant-current loop with sub-100 ps duty-cycle resolution, achieving dimming ratios below 0.1% - critical for cinema and stage-lighting fixtures. The slave core runs the DMX512/RDM or DALI-2 protocol stack, and the four ADCs monitor both LED junction temperature (via thermistor) and output current. The 512 KB Flash allows on-board LED color-mixing profiles and smooth fade curves without external memory, and the 125C rating covers enclosed driver housings.
추천
Industrial Functional-Safety (FuSa) Controllers
The DSPIC33CH512MP506-E/PT integrates the diagnostics required to build IEC 61508 SIL 2/3 and ISO 26262 ASIL B/C controllers without external safety co-processors. Built-in features include dual-core lockstep compare, Flash/RAM BIST, ADC window watchdog, clock-loss detection, and dedicated safety peripherals (windowed watchdog, ECC). The main core runs the application logic while the slave core executes the safety function library (SFLib) in parallel, comparing critical outputs and asserting the hardware fault line on mismatch. Industrial applications include safety PLCs, robotic E-stops, and redundant motor-control systems where SIL certification is mandatory.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CH512MP506-E/PT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CH512MP506-I/PT | DSPIC33CH256MP506-E/PT | DSPIC33CH256MP506T-I/PT | DSPIC33CH256MP508-I/PT | DSPIC33CH512MP206-E/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-64 (PT) 10x10 mm | TQFP-64 (PT) 10x10 mm - same | TQFP-64 (PT) 10x10 mm - same | TQFP-64 (PT) 10x10 mm - same | TQFP-64 (PT) 10x10 mm - same | TQFP-64 (PT) 10x10 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 512 KB | 512 KB | 256 KB (-50%) | 256 KB (-50%) | 256 KB (-50%) | 512 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Main Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | No (CAN only) |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) |
| Functional Safety (FuSa) | Yes (IEC 61508 / ISO 26262 capable) | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Higher 512 KB Flash capacity for dual-partition OTA updates (vs DSPIC33CH256MP506-E/PT)
- E-grade 125 C temperature for under-hood automotive (vs DSPIC33CH512MP506-I/PT)
- Includes CAN-FD peripheral for high-bandwidth automotive comms (vs DSPIC33CH512MP206-E/PT)
설계 노트
The DSPIC33CH512MP506-E/PT requires a tightly regulated 3.3 V supply with ripple below 50 mVpp. Use a dedicated LDO (e.g. Microchip MCP1700) for VDD with separate decoupling for AVDD - both rails need 100 nF + 10 uF ceramic capacitors placed within 5 mm of the supply pins. The PLL is sensitive to power-rail noise; route VDD away from PWM outputs and use a star-ground topology.
Estimated: with VDD at 3.3 V and 200 MHz clock on both cores at full load, the typical IDD is ~110 mA (~360 mW). The TQFP-64 10x10 package has theta_JA of approximately 50 C/W (per Microchip package thermal data), so the junction-to-ambient rise is ~18 C, leaving comfortable margin to the 125 C junction limit. For high ambient enclosures (>85 C) add a thermal via array under the exposed pad to a bottom-side copper pour.
Place a 4-layer PCB stack with a continuous ground plane under the device. Route analog signals (AN0-AN11) over a dedicated analog ground island, joined to the digital ground at a single point under the device. Exposed thermal pad must be soldered to a via-array pad; per IPC-2221 the thermal via pattern should be 0.3 mm pitch with 0.2 mm holes.
The slave core debug pins (S1MCLRx) must be pulled high during reset for normal operation, otherwise the slave core may enter debug mode unintentionally. When the slave core is unused, configure it via the FSEC register and disable its clock to save ~25 mA. Do not exceed the absolute maximum VDD of 3.6 V or the analog input range of -0.3 V to AVDD+0.3 V.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. AEC-Q100 not qualified on the -E/PT suffix; Microchip uses the -VAO suffix for automotive-grade AEC-Q100 parts. The -E/PT is functional-safety-capable per IEC 61508 / ISO 26262 but is not formally AEC-Q100 qualified.
