DSPIC33CK512MP306-E/MR - 100MHz 512KB DSC | Microchip
부품 번호: DSPIC33CK512MP306-E/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.16 | $516.00 |
| 500 | $4.64 | $2,320.00 |
| 1,000 | $4.17 | $4,170.00 |
DSPIC33CK512MP306-E/MR 개요
A digital signal controller combines the computational capability of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, DSCs sit between general-purpose MCUs and full DSPs, making them the preferred choice for closed-loop, math-intensive control loops such as field-oriented control (FOC) of motors. The dsPIC33CK family from Microchip Technology is the latest generation of 16-bit DSCs, superseding the dsPIC33EP series with faster cores and smarter peripherals.
Key features include the 100 MHz dsPIC DSC core with integrated DSP instructions, dual-panel flash supporting live firmware updates, on-chip operational amplifiers, 12-bit ADCs, high-resolution PWM peripherals, and CAN Flexible Data-Rate (CAN FD) communication as stated in the family datasheet.
Technically, the MP-series devices offer the largest memory and most comprehensive peripheral sets in the dsPIC33CK family. The dual-partition flash can be used as a single unpartitioned block (0x000000-0x058000) or split into two independently bootable partitions, enabling fail-safe over-the-air firmware updates. The integrated op-amps offload external analog front-end components in current-sense paths, and the high-resolution PWM module provides sub-nanosecond duty-cycle resolution for precision power conversion.
Typical applications include precision brushless DC and PMSM motor control (FOC), digital power supplies and PFC stages, automotive and industrial control systems, and CAN FD networked nodes where -40C to +125C operation is required.
When designing with this device, pay attention to the 3V to 3.6V supply requirement and decouple the multiple VDD/VSS pin pairs on the 64-QFN package with low-ESR ceramics placed close to each pin pair.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: DSPIC33CK512MP306-E/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CK512MP306-E/MR (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Core, Core Architecture, Data SRAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CK512MP306-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK512MP306-H/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK128MP506-E/MR
✅ 드롭인✓ 재고 있음
$4.42 / 개
데이터시트 보기 →DSPIC33CK32MP506-E/MR
✅ 드롭인✓ 재고 있음
$3.55 / 개
데이터시트 보기 →DSPIC33CH512MP506-I/MR
✅ 드롭인✓ 재고 있음
$5.45 / 개
데이터시트 보기 →DSPIC33CK512MP306-E/MR 최대 정격 & 전기적 특성
| Core | dsPIC33CK 16-bit DSC core |
| Core Speed | 100 MHz (100 MIPS) |
| Program Memory Size | 512 KB (512K x 8) FLASH |
| Program Memory Type | Dual-panel / dual-partition FLASH |
| RAM Size | 64 KB |
| Supply Voltage Range | 3 V to 3.6 V |
| 동작 온도 | -40C to +125C (E grade) |
| 패키지 | 64-QFN (MR, 9x9 mm) |
| Number of Terminals | 64 |
| 실장 유형 | Surface Mount |
| Communication Interfaces | CAN FD, UART, SPI, I2C |
| Analog Peripherals | On-chip OpAmps, 12-bit ADCs |
| PWM | High-resolution PWM |
| Screening Level | AEC-Q100 |
| Packaging | Tray |
DSPIC33CK512MP306-E/MR 64-qfn (mr, 9x9 mm) 핀 구성 가이드
DSPIC33CK512MP306-E/MR(64-qfn (mr, 9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33CK512MP306-E/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33CK512MP306-E/MR 적합 용도: 6 애플리케이션s: Precision BLDC/PMSM Motor Control, Digital Power Supplies and PFC, Automotive Body and Control Nodes, Industrial Automation and Robotics, Battery Management and Charging Systems, IoT Edge and Sensor Conditioning Nodes.
Precision BLDC/PMSM Motor Control
The DSPIC33CK512MP306-E/MR is purpose-built for field-oriented control (FOC) of brushless DC and permanent-magnet synchronous motors. Its 100 MHz core executes the current, speed, and position control loops with ample MIPS margin, while the integrated on-chip operational amplifiers condition low-level shunt-resistor current signals without external amplifiers. The 12-bit ADCs sample phase currents synchronously with the high-resolution PWM, minimizing control-loop latency. The MR 64-pin package exposes enough PWM and analog channels for three-phase inverters with additional auxiliary functions. In a typical FOC drive, the DSC reads DC-bus voltage and phase currents, computes Clarke/Park transforms at 20-100 kHz loop rates, and outputs space-vector-modulated PWM with sub-nanosecond duty resolution, achieving low torque ripple and efficient operation across the -40C to +125C automotive/industrial range.
추천
Digital Power Supplies and PFC
In digital power conversion, the DSPIC33CK512MP306-E/MR provides the processing speed and peripheral precision required for LLC resonant converters, totem-pole PFC, and synchronous buck stages. The high-resolution PWM module delivers fine duty-cycle and phase-delay resolution essential for frequency and phase control in resonant topologies, while fast 12-bit ADC triggers aligned to PWM events capture current and voltage feedback at the optimal instant, away from switching-edge noise. The 100 MIPS core runs proportional-integral compensators plus protection routines (overcurrent, overvoltage) within single switching cycles at 100-500 kHz. The dual-partition flash enables field firmware updates for efficiency-tuning or grid-standard changes without a service visit. The extended -40C to +125C temperature rating permits placement near hot power stages inside enclosed industrial power supplies.
추천
Automotive Body and Control Nodes
With AEC-Q100 screening and -40C to +125C operation, the DSPIC33CK512MP306-E/MR fits automotive control nodes such as pump controllers, HVAC blowers, throttle actuators, and DC-DC auxiliary converters. The integrated CAN FD peripheral connects the node to in-vehicle networks with 64-byte payloads and higher bit rates than classical CAN, offloading the main core from communication handling. The 512 KB flash accommodates rich application firmware, OTA update bootloaders, and diagnostic stacks (e.g., UDS-style reprogramming via the dual-partition bootloader). On-chip op-amps and 12-bit ADCs handle position and current feedback from sensors in harsh electrical environments, while the 100 MHz core supports functional monitoring routines. Board designers benefit from the QFN-64 footprint shared across the dsPIC33CK/CH MP506 family, enabling one PCB across multiple memory-tier BOM options.
추천
Industrial Automation and Robotics
The DSPIC33CK512MP306-E/MR serves as a real-time motion and process controller in factory automation, CNC tooling, and robotic joint drivers. The 100 MIPS core handles multi-axis interpolation, encoder feedback processing, and communication concurrently. High-resolution PWM drives servo amplifiers while quadrature-encoder interfaces and fast ADCs close position and current loops. Multiple UART, SPI, and I2C ports interface with drives, sensors, HMIs, and gateways, and the CAN FD interface links the node to industrial fieldbus bridges. The 512 KB dual-panel flash supports complex kinematics firmware plus field-updatable control profiles, and 64 KB RAM holds look-up tables and trajectory buffers. Operating to +125C, the controller survives hot cabinets and motor-adjacent mounting, reducing wiring length between controller and power stage in compact machine designs.
추천
Battery Management and Charging Systems
In battery chargers and battery-backed energy systems, the DSPIC33CK512MP306-E/MR runs charging state machines, coulomb counting, and safety monitoring on its 100 MHz core. The high-resolution PWM controls synchronous buck/boost charging power stages with the fine phase and duty resolution needed for high-efficiency CC/CV transitions. Fast 12-bit ADCs continuously sample cell voltages, pack current, and temperature; integrated comparators provide cycle-by-cycle overcurrent protection independent of the CPU. The CAN FD interface reports state-of-charge and fault data to system hosts in e-mobility, UPS, and solar-storage applications. The extended temperature grade allows mounting inside sealed enclosures where ambient temperatures reach +105C or higher. Dual-partition flash enables field updates of charging profiles as battery chemistries or grid codes evolve over the product lifetime.
추천
IoT Edge and Sensor Conditioning Nodes
For smart industrial IoT nodes that must process signals locally, the DSPIC33CK512MP306-E/MR combines DSP-class signal processing with microcontroller-class connectivity. The core executes FFT-based vibration analysis, RMS metering, or digital filtering on sensor streams captured by the 12-bit ADCs, while integrated op-amps amplify small signals from accelerometers, current transformers, or pressure bridges. Firmware resident in 512 KB flash can implement protocol stacks and local decision logic, sending only processed results over UART, SPI, I2C, or CAN FD. The 64 KB RAM buffers acquisition windows for burst analysis. The QFN-64 package with multiple GPIO banks drives relays, LEDs, and front-end muxes directly. Extended -40C to +125C operation permits deployment in outdoor cabinets, pump skids, and rooftop equipment where consumer-grade processors cannot survive.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CK512MP306-E/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CK512MP306-I/MR | DSPIC33CK128MP506-E/MR | DSPIC33CK32MP506-E/MR | DSPIC33CH512MP506-I/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (MR, 9x9 mm) | 64-QFN (MR, 9x9 mm) - same | 64-QFN (MR, 9x9 mm) - same | 64-QFN (MR, 9x9 mm) - same | 64-QFN (MR, 9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB dual-panel | 512 KB | 128 KB | 32 KB | 512 KB (dual-core) |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) |
| Core Architecture | Single-core dsPIC33CK | Single-core dsPIC33CK | Single-core dsPIC33CK | Single-core dsPIC33CK | Dual-core dsPIC33CH (master + slave) |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 / Automotive | AEC-Q100 screened, E grade | No (industrial grade) | Yes (E grade) | Yes (E grade) | No (industrial grade) |
주요 차별점
- Extended -40C to +125C operation with AEC-Q100 screening (vs DSPIC33CK512MP306-I/MR)
- Maximum 512 KB dual-panel flash in the 64-pin family (vs DSPIC33CK128MP506-E/MR)
- Single fast core with integrated op-amps for lowest control latency (vs DSPIC33CH512MP506-I/MR)
설계 노트
The dsPIC33CK512MP306-E/MR requires a tightly regulated 3.0V-3.6V supply (nominal 3.3V). Distribute decoupling: a 0.1 uF ceramic at every VDD/VSS pair plus bulk 10 uF near the package. The 64-QFN 9x9 mm package exposes VDD pins on multiple sides - route a low-impedance 3.3V plane rather than long traces. Ensure the regulator can supply peak core current at 100 MIPS plus simultaneous PWM and ADC operation; consult the datasheet electrical characteristics for IDD figures.
QFN packages require the exposed thermal/ground pad to be soldered to the PCB for reliable ground return and heat dissipation. Use a solder-mask-defined pad pattern with approximately 50-70% via coverage (e.g., 4x4 via array) tied to the ground plane for paste stabilization. Inspect for voiding under the pad with X-ray on first articles; voids degrade both thermal performance and analog noise floor of the on-chip op-amps and ADCs.
Do not assume all 512 KB flash is one block: the device defaults may require configuration for unpartitioned (0x000000-0x058000) versus dual-partition boot, per the family programming documentation. Mixed temperature grades (I vs E suffix) are NOT interchangeable in -40C to +125C designs - verify the full suffix on incoming reels. Finally, when reusing layouts from the smaller DSPIC33CK32MP506, verify the config-word settings, since memory sizes and partition options differ across the family.
규정 준수 정보
AEC-Q100 screening level per Vyrian component data for DSPIC33CK512MP306-E/MR. RoHS/REACH status not present in provided web data - verify on the official Microchip product page.
