DSPIC33CK64MC102-I/M6 - 100MHz 64KB DSC | Microchip
부품 번호: DSPIC33CK64MC102-I/M6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0.51 | $0.51 |
| 10 | $0.49 | $4.90 |
| 100 | $0.46 | $46.00 |
| 500 | $0.44 | $220.00 |
| 1,000 | $0.42 | $420.00 |
DSPIC33CK64MC102-I/M6 개요
A Digital Signal Controller combines the computational throughput of a digital signal processor with the peripheral integration and deterministic interrupt behavior of a microcontroller. Within the power-management hierarchy of an embedded system, a DSC such as the dsPIC33CK sits at the control layer, executing Field-Oriented Control (FOC) loops, sensor processing, and power-conversion algorithms that general-purpose MCUs often cannot close fast enough.
Key features include up to 100 MIPS deterministic single-cycle DSP performance, integrated operational amplifiers, 12-bit ADCs, high-resolution PWM for motor control, and 4 DMA channels. The program flash includes ECC and fault-injection test support, and the SRAM includes Memory Built-In Self-Test (MBIST), aligning with functional-safety (FuSa) development flows for automotive and industrial applications.
The dsPIC33CK DSC core uses a modified Harvard architecture with a 16-bit fixed-point DSP engine, hardware multiply-accumulate, and single-cycle MAC operations. Operating voltage is 3.0 V to 3.6 V, with the -40C to +125C industrial temperature rating at full 100 MIPS speed (DC to 70 MIPS is supported up to +150C per the datasheet operating conditions). The device provides 21 I/O pins, 3 timers, and 3 serial I/O interfaces in the 28-pin footprint.
Typical applications include brushless DC and PMSM motor control using sensorless FOC, digital power supplies (LLC, totem-pole PFC), advanced sensing, and touch-sensing interfaces. The integrated op amps and high-speed 12-bit ADC allow current-sense amplification and sampling without external signal-chain components.
Design consideration: budget the 3.3 V rail with adequate decoupling and account for core current at 100 MIPS; the exposed pad of the UQFN package must be soldered to a ground pour for both thermal and signal-integrity performance.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33CK64MC102-I/M6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CK64MC102-I/M6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, PWM, ADC Resolution, Data SRAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CK32MC102-I/M6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.18 / 개
데이터시트 보기 →DSPIC33CK64MC103-I/M6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK64MC105-I/M6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK32MC105-E/M4
✅ 드롭인✓ 재고 있음
$3.2 / 개
데이터시트 보기 →DSPIC33CK64MC102-I/M6 최대 정격 & 전기적 특성
| Core | dsPIC33CK 16-bit DSC core |
| Core Speed | 100 MHz (100 MIPS) |
| Program Memory (Flash) | 64 KB (64K x 8) with ECC and fault injection |
| Data SRAM | 8 KB (8K x 8) with MBIST |
| 공급 전압 | 3.0 V to 3.6 V |
| 동작 온도 | -40C to +125C (DC to 100 MIPS); up to +150C (DC to 70 MIPS) |
| I/O Pins | 21 |
| ADC | 12-bit |
| PWM | High-resolution PWM |
| Analog Op Amps | Integrated |
| DMA Channels | 4 |
| Timers | 3 |
| Serial Interfaces | 3 |
| 패키지 | 28-UQFN (4x4 mm), exposed pad |
| 실장 유형 | Surface Mount |
| Qualification | Automotive (AEC-Q100 referenced), Functional Safety (FuSa) |
DSPIC33CK64MC102-I/M6 28-uqfn (4x4 mm), exposed pad 핀 구성 가이드
DSPIC33CK64MC102-I/M6(28-uqfn (4x4 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33CK64MC102-I/M6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33CK64MC102-I/M6 적합 용도: 6 애플리케이션s: BLDC/PMSM Motor Control (FOC), Digital Power Conversion, Advanced Sensing and Touch Interfaces, Automotive Body and Comfort Control, Industrial Automation and Robotics, Consumer Appliances and HVAC.
BLDC/PMSM Motor Control (FOC)
The DSPIC33CK64MC102-I/M6 fits motor control because its 100 MHz/100 MIPS dsPIC33CK core closes sensorless Field-Oriented Control loops deterministically, while the integrated high-resolution PWM generates precise complementary drive waveforms with dead-time control. The on-chip op amps amplify shunt current measurements directly into the 12-bit ADC, eliminating external signal-chain ICs and reducing BOM cost. In a typical FOC implementation the device executes current-loop bandwidths in the kHz range with single-cycle MAC operations, and the ECC-protected flash plus FuSa features support safety-relevant drives. Trade-off: 64 KB flash bounds algorithm complexity, so position observers and protocol stacks must be sized accordingly.
추천
Digital Power Conversion
For digital power supplies such as LLC converters and totem-pole PFC, the DSPIC33CK64MC102-I/M6 provides the deterministic 100 MIPS core and high-resolution PWM needed for sub-microsecond control-loop updates. The 12-bit ADC with flexible trigger architecture samples voltage and current feedback synchronized to the PWM period, enabling peak-current-mode and average-current-mode control in firmware. According to Microchip, the dsPIC33CK family is explicitly positioned for advanced sensing and control, and the ECC flash with fault-injection supports functional-safety oriented power systems. The 3.0-3.6 V operating range suits a standard 3.3 V bias rail derived from an auxiliary flyback or LDO.
추천
Advanced Sensing and Touch Interfaces
The DSPIC33CK64MC102-I/M6 serves advanced sensing because its fast 12-bit ADC, integrated op amps, and 100 MHz core enable high-rate sampling and on-chip DSP filtering (FIR/IIR) of sensor data without host assistance. Microchip identifies the dsPIC33CK MC10X family as enabling touch and advanced sensing designs: the CTMU-class peripherals and analog front-end allow capacitive touch channel scanning alongside control tasks. With 21 I/O and 3 serial interfaces (UART/SPI/I2C-class), results stream to system hosts over standard buses. The -40C to +125C industrial range and MBIST-backed SRAM support deployment in harsh environments where sensor nodes must self-verify memory integrity.
추천
Automotive Body and Comfort Control
With its automotive dsPIC classification, AEC-Q100-referenced qualification, functional-safety (FuSa) feature set, and -40C to +125C rating, the DSPIC33CK64MC102-I/M6 targets automotive body electronics such as pump control, valve actuation, and blower motor drives. The ECC flash with fault-injection testing and SRAM MBIST give system integrators hardware self-test hooks required by safety analyses, while the high-resolution PWM and fast ADC handle brushed or brushless motor commutation locally. Operating at 3.0-3.6 V from the vehicle's regulated 3.3 V domain, the DSC communicates on LIN/CAN-adjacent serial links via its 3 serial interfaces. Confirm the exact qualification grade with Microchip documentation for your safety goal.
추천
Industrial Automation and Robotics
In industrial automation, the DSPIC33CK64MC102-I/M6 acts as a dedicated motion or power sub-controller executing deterministic servo loops at 100 MIPS while a host PLC concentrates on coordination. The 4 DMA channels offload ADC results and UART/SPI transactions from the CPU, keeping interrupt latency low for position and torque loops. Integrated op amps condition resolver or shunt-feedback signals into the 12-bit ADC directly. The industrial temperature range to +125C (and 70 MIPS up to +150C) suits drive electronics mounted near heat sources. ECC-protected flash guards against bit corruption in noisy electromagnetic environments typical of factory floors with variable-frequency drives.
추천
Consumer Appliances and HVAC
The DSPIC33CK64MC102-I/M6 suits appliance applications - fans, compressors, pumps - because the reported ~$0.51 entry price makes 100 MIPS DSP control affordable in cost-driven consumer products (CNX Software, May 2026). The 28-UQFN 4x4 mm footprint saves PCB area in compact appliance boards, and the integrated op amps plus 12-bit ADC implement sensorless motor commutation without external amplifiers. High-resolution PWM reduces audible switching noise through spread or high-frequency modulation, improving end-product acoustics. The 64 KB flash holds FOC firmware plus housekeeping code for user interfaces over serial links, while the industrial temperature grade adds robustness margins for enclosed, warm environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CK64MC102-I/M6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CK32MC102-I/M6 | DSPIC33CK64MC103-I/M6 | DSPIC33CK64MC105-I/M6 | DSPIC33CK32MC105-E/M4 |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | UQFN (M4) - same family footprint class |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Program Flash | 64 KB (ECC) | 32 KB (ECC) | 64 KB (ECC) | 128 KB (ECC) | 32 KB (ECC) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C (E-grade extended class) |
주요 차별점
- Full 64 KB ECC-protected flash at value-line pricing (vs DSPIC33CK32MC102-I/M6)
- Integrated op amps reduce external BOM (vs General-purpose 16-bit MCUs)
- Functional-safety hardware features (vs DSPIC33CK64MC103-I/M6)
설계 노트
The M6 UQFN package has an exposed pad on the bottom that must be soldered to a ground pour. Design the land pattern per the Microchip datasheet with an array of thermal vias (0.3 mm drill, filled or tented) connecting the pad to internal ground planes. This exposed pad is the primary thermal and ground return path - leaving it unsoldered, a common reflow defect with UQFN parts, causes intermittent ground faults and elevated junction temperatures. Use X-ray or AOI inspection on first articles.
Estimated: at 100 MIPS the core current is on the order of tens of mA; with a 3.0-3.6 V rail, budget the 3.3 V LDO or buck for peak worst-case current (all peripherals active plus I/O loads) per the datasheet electrical characteristics tables rather than typical figures. Place 100 nF ceramics at each VDD/VSS pin pair plus a bulk 4.7-10 uF capacitor. Flash ECC and MBIST features consume power only during their operations, but brown-out during flash writes must be prevented with a supervisory circuit or the internal BOR.
Do not exceed the 3.6 V absolute operating limit - the dsPIC33CK is a 3.3 V-only family, unlike 5 V-tolerant legacy dsPIC30/33F parts. Pin-multiplexed peripherals on the 28-pin package mean your required peripheral set (op amps, PWM channels, ADC channels, serial ports) must be confirmed against the pinout tables in the datasheet before layout; several pins are shared. When migrating within the family (e.g., from MC105 to MC102), verify the configuration-word and PPS (peripheral pin select) mapping, as defaults differ between family members.
규정 준수 정보
Classified as dsPIC Automotive with AEC-Q100 reference and Functional Safety (FuSa) per datasheets.com/GlobalSpec listings; verify RoHS/REACH certificates on Microchip's official product page.
