DSPIC33EP256GM706-H/MR - 70 MIPS 16-bit DSC 256KB | Microchip
부품 번호: DSPIC33EP256GM706-H/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.81 | $9.81 |
| 10 | $8.95 | $89.50 |
| 100 | $7.95 | $795.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.45 | $6,450.00 |
DSPIC33EP256GM706-H/MR 개요
A digital signal controller combines the compute architecture of a microcontroller with the multiply-accumulate (MAC) DSP engine of a digital signal processor. In the power-management hierarchy of embedded systems, the DSC sits above general-purpose MCUs where fast, deterministic control loops are needed, making the dsPIC33E family a de facto standard for digital power conversion and precision motor control.
Key features include the 70 MIPS dsPIC DSC core with integrated DSP instruction set, 12 channels of motor-control PWM (MCPWM), 8 input capture and 8 output compare channels, 2 quadrature encoder interfaces (QEI), CAN 2.0B for automotive networking, and multiple I2C/SPI/UART serial ports. The high-speed PWM module with dead-time control directly drives half-bridge and three-phase power stages without external sequencing logic.
On the analog side, the GM706 variant integrates high-speed 10/12-bit ADCs with multiple sample-and-hold circuits that can sample several channels simultaneously - critical for three-phase current sensing - and the GM-series additionally embeds on-chip operational amplifiers for current-shunt conditioning, reducing external component count.
Typical applications include brushless DC and PMSM field-oriented-control motor drives, solar inverters, digital power supplies (LLC, totem-pole PFC), automotive body and powertrain subsystems, and industrial automation sensors.
Design consideration: the -H suffix denotes a higher operating temperature variant; verify your thermal budget, because the exposed-pad VQFN-64 requires a solid ground-plane thermal vias pattern to keep junction temperature within limits at 70 MIPS operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-24.
드롭인 대체품: DSPIC33EP256GM706-H/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP256GM706-H/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core, Program Memory (Flash), Quadrature Encoder Interfaces, Input Capture / Output Compare.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP256GM706-I/MR
✅ 드롭인✓ 재고 있음
$4.35 / 개
데이터시트 보기 →DSPIC33EP256GM706-E/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP256GM606-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP512GM706-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.85 / 개
데이터시트 보기 →DSPIC33EP256GM706-I/PT
✅ 드롭인✓ 재고 있음
$3.26 / 개
데이터시트 보기 →DSPIC33EP256GM706-H/MR 최대 정격 & 전기적 특성
| Core | dsPIC33E 16-bit DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 256KB (85.5K x 24) |
| RAM | 16KB |
| 패키지 | 64-VQFN (MR), 9x9 mm, exposed pad |
| Motor Control PWM Channels | 12 (MCPWM) |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 |
| CAN | CAN 2.0B |
| Qualification | AEC-Q100 (Automotive) |
| On-chip Op Amps | Yes (GM-series) |
| ADC Resolution | 10/12-bit |
| 실장 유형 | Surface Mount |
| Series | dsPIC33EP256GM706 |
DSPIC33EP256GM706-H/MR 64-vqfn (mr), 9x9 mm, exposed pad 핀 구성 가이드
DSPIC33EP256GM706-H/MR(64-vqfn (mr), 9x9 mm, exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP256GM706-H/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP256GM706-H/MR 적합 용도: 6 애플리케이션s: BLDC/PMSM Field-Oriented Motor Control, Digital Power Conversion (LLC, Totem-Pole PFC), Automotive Body and Powertrain Nodes, Solar Inverters and Renewable Energy Converters, Industrial Automation and Servo Drives, Battery Management and e-Mobility Systems.
BLDC/PMSM Field-Oriented Motor Control
The DSPIC33EP256GM706-H/MR was explicitly designed for precision motor control: its 70 MIPS DSP core executes field-oriented control (FOC) loops fast enough for 20 kHz+ PWM update rates, while the 12-channel motor-control PWM module provides complementary outputs with hardware dead-time insertion for three-phase inverters. The on-chip op amps condition low-side shunt currents directly, and the 10/12-bit ADC with multiple sample-and-holds samples phase currents simultaneously, eliminating skew errors that corrupt FOC transforms. Two QEI modules accept encoder feedback for servo-grade positioning. In a typical drive, the PWM runs at 16-20 kHz, the current loop closes at that rate, and the speed loop at 1 kHz, all within the DSP headroom. The exposed-pad VQFN-64 dissipates the controller's modest power through the ground plane.
추천
Digital Power Conversion (LLC, Totem-Pole PFC)
High-frequency switched-mode power converters need deterministic, sub-microsecond control interrupts, which the 70 MIPS dsPIC33EP256GM706-H/MR delivers with its zero-overhead DSP MAC operations and fast interrupt latency. The 12-channel MCPWM module generates phase-shifted or complementary PWM with nanosecond-resolution dead time, essential for LLC half-bridge and totem-pole PFC topologies where shoot-through protection is safety-critical. The high-speed 10/12-bit ADC synchronizes sampling to PWM events for accurate average-current-mode control. CAN 2.0B on-chip enables digital-power racks to report telemetry on automotive and telecom buses without an external CAN controller. Because voltage-mode loops close at 100-500 kHz switching frequencies, engineers often place the controller at the heart of server PSU and solar micro-inverter platforms.
추천
Automotive Body and Powertrain Nodes
With AEC-Q100 qualification and the -H temperature grade, the DSPIC33EP256GM706-H/MR targets automotive electronic control units such as pump controllers, throttle actuators, fan drives, and HVAC blower modules. On-chip CAN 2.0B provides the primary in-vehicle network interface without extra transceiver-adjacent logic, and the rich PWM/capture resources drive brushed and brushless actuators directly. Multiple UART/SPI/I2C ports connect to LIN bridges, position sensors, and diagnostics. The automotive qualification covers the temperature and reliability screening that OEMs demand; firmware developed on industrial -I parts ports directly because the die is identical. Designers should implement the CAN transceiver externally and follow Microchip's automotive reference designs for ESD and load-dump protection on the supply front end.
추천
Solar Inverters and Renewable Energy Converters
Grid-tied solar micro-inverters and string optimizers require simultaneous MPPT computation, grid-current shaping, and protection supervision - workloads the dsPIC33EP256GM706-H/MR balances with its 70 MIPS core and DSP engine. Two independent ADC sample-and-hold pairs digitize PV-panel voltage/current and grid voltage/current in the same instant, enabling accurate power calculations for maximum-power-point tracking. The complementary PWM outputs with dead time drive the DC-DC boost and DC-AC inverter stages, while capture channels measure grid zero crossings for phase locking. CAN or UART links report performance data to monitoring gateways. The AEC-Q100 -H grade also suits outdoor-mounted power optimizers exposed to wide temperature swings, where industrial-grade parts would be marginal.
추천
Industrial Automation and Servo Drives
Factory automation nodes - servo amplifiers, conveyors, robotics joints, and CNC axes - benefit from the DSC's combination of two quadrature encoder interfaces, 8 input captures, and DSP-speed control loops. The GM706 reads two encoder axes concurrently (e.g., X and Y motion), closes current/velocity/position cascades at kilohertz rates, and communicates over CAN or UART to PLCs. On-chip op amps reduce bill-of-material cost in current-sense front ends, and the 256KB Flash accommodates motion-profile tables plus fieldbus stacks with headroom. The 64-VQFN's exposed pad simplifies thermal design inside sealed drive cabinets. Because Microchip's dsPIC33EP motor-control PIMs (MA330036) cover this family, prototyping a servo axis can start on standard evaluation hardware before custom PCB spins.
추천
Battery Management and e-Mobility Systems
Battery packs for e-bikes, forklifts, and light electric vehicles need a controller that measures cell voltages and currents, computes state of charge, drives contactors and pre-charge circuits, and talks CAN to vehicle controllers - a profile matching the DSPIC33EP256GM706-H/MR exactly. Its synchronized ADC channels sample pack current and cell-group voltages within the same window, improving coulomb-counting accuracy, while PWM outputs drive active balancing FETs and the pre-charge relay sequence. On-chip CAN 2.0B implements standard BMS messaging (e.g., for chargers and dashboards) without additional controllers. The AEC-Q100 -H qualification satisfies automotive quality gates, and 256KB Flash leaves room for ISO-style diagnostic firmware and OTA-style bootloader code alongside the core BMS algorithm.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP256GM706-H/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP256GM706-I/MR | DSPIC33EP256GM706-E/MR | DSPIC33EP256GM606-I/MR | DSPIC33EP256GM706-I/PT |
|---|---|---|---|---|---|
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-TQFP - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 256KB | 256KB | 256KB | 128KB | 256KB |
| MCPWM / QEI Channels | 12 MCPWM / 2 QEI | 12 / 2 | 12 / 2 | 12 / 2 | 12 / 2 |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes |
| On-chip Op Amps | Yes (GM-series) | Yes | Yes | Yes | Yes |
주요 차별점
- AEC-Q100 automotive qualification in VQFN-64 (vs DSPIC33EP256GM706-I/MR)
- Full motor-control peripheral set (12 MCPWM, 2 QEI, 8/8 capture/compare) (vs DSPIC33EP256GM606-I/MR)
- On-chip op amps eliminate external current-sense amplifiers (vs DSPIC33EP256GM706-H/PT)
설계 노트
Connect every VDD/VSS pair on the 64-VQFN; the dsPIC33EP requires all supply pins tied (per Microchip ICSP/programming support notes, 'All VSS and VDD pins' must be connected). Decouple each VDD pin with 100 nF ceramic placed within 2 mm of the pin, plus one bulk 10 uF per supply domain. Estimated: at 70 MIPS from a 3.3 V rail, core current draw is in the tens-of-mA range, so IR drop is small, but transient di/dt from PWM peripheral switching makes local decoupling mandatory to keep the internal regulator stable.
Solder the VQFN exposed pad to a grounded thermal pad with an array of thermal vias (typical 0.3 mm drills on ~1 mm pitch) to the internal ground plane. This pad is both the primary heat removal path and the main RF/EMI ground reference for the PWM edges. For ICSP programming, route one PGECx/PGEDx pair (e.g., PGEC2/PGED2) to a 5-pin header - you may use any pair but must keep ICSPCLK and ICSPDAT from the same pair, per Microchip NSDSP programming guidance.
Do not confuse order codes: -H/MR (this part, 64-VQFN), -I/MR (industrial QFN), and -H/PT (64-TQFP) share a die but not a footprint - the /PT cannot be substituted onto a QFN land pattern. Also verify the -H grade temperature rating on the datasheet ordering table before locking your thermal budget. When using on-chip op amps for shunt sensing, keep the shunt traces Kelvin-connected to the amplifier input pins to preserve the 12-bit ADC's effective resolution.
The 12-channel MCPWM switching high-side FETs creates strong common-mode emissions. Estimated: at 20 kHz PWM with 30 ns edges, harmonics extend well past 30 MHz; keep the motor phase traces short, place gate drivers close to the QFN PWM pins, and use the exposed-pad ground as a quiet reference. Route CAN diff pair with 100 nF-to-ground-stitched return path and add a common-mode choke if the bus exceeds 1 m.
규정 준수 정보
AEC-Q100 automotive qualification and dsPIC33EP Series listing per Hotenda and DigiKey distributor data. RoHS/REACH/lead-free certificates not present in retrieved data - verify on the Microchip product page.
