DSPIC33EP256GM706-H/MR - 70 MIPS 16-bit DSC 256KB | Microchip
MPN: DSPIC33EP256GM706-H/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.81 | $9.81 |
| 10 | $8.95 | $89.50 |
| 100 | $7.95 | $795.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.45 | $6,450.00 |
DSPIC33EP256GM706-H/MR Overview
A digital signal controller combines the compute architecture of a microcontroller with the multiply-accumulate (MAC) DSP engine of a digital signal processor. In the power-management hierarchy of embedded systems, the DSC sits above general-purpose MCUs where fast, deterministic control loops are needed, making the dsPIC33E family a de facto standard for digital power conversion and precision motor control.
Key features include the 70 MIPS dsPIC DSC core with integrated DSP instruction set, 12 channels of motor-control PWM (MCPWM), 8 input capture and 8 output compare channels, 2 quadrature encoder interfaces (QEI), CAN 2.0B for automotive networking, and multiple I2C/SPI/UART serial ports. The high-speed PWM module with dead-time control directly drives half-bridge and three-phase power stages without external sequencing logic.
On the analog side, the GM706 variant integrates high-speed 10/12-bit ADCs with multiple sample-and-hold circuits that can sample several channels simultaneously - critical for three-phase current sensing - and the GM-series additionally embeds on-chip operational amplifiers for current-shunt conditioning, reducing external component count.
Typical applications include brushless DC and PMSM field-oriented-control motor drives, solar inverters, digital power supplies (LLC, totem-pole PFC), automotive body and powertrain subsystems, and industrial automation sensors.
Design consideration: the -H suffix denotes a higher operating temperature variant; verify your thermal budget, because the exposed-pad VQFN-64 requires a solid ground-plane thermal vias pattern to keep junction temperature within limits at 70 MIPS operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-24.
Drop-in alternatives for DSPIC33EP256GM706-H/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM706-H/MR (same form factor and footprint) — differing in Package, Core, Program Memory (Flash), Quadrature Encoder Interfaces, Input Capture / Output Compare.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM706-I/MR
✅ Drop-In✓ In Stock
$4.35 / Unit
View Datasheet →DSPIC33EP256GM706-E/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GM606-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512GM706-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.85 / Unit
View Datasheet →DSPIC33EP256GM706-I/PT
✅ Drop-In✓ In Stock
$3.26 / Unit
View Datasheet →DSPIC33EP256GM706-H/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 256KB (85.5K x 24) |
| RAM | 16KB |
| Package | 64-VQFN (MR), 9x9 mm, exposed pad |
| Motor Control PWM Channels | 12 (MCPWM) |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 |
| CAN | CAN 2.0B |
| Qualification | AEC-Q100 (Automotive) |
| On-chip Op Amps | Yes (GM-series) |
| ADC Resolution | 10/12-bit |
| Mounting Type | Surface Mount |
| Series | dsPIC33EP256GM706 |
DSPIC33EP256GM706-H/MR 64-vqfn (mr), 9x9 mm, exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP256GM706-H/MR (64-vqfn (mr), 9x9 mm, exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM706-H/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM706-H/MR is suitable for 6 applications: BLDC/PMSM Field-Oriented Motor Control, Digital Power Conversion (LLC, Totem-Pole PFC), Automotive Body and Powertrain Nodes, Solar Inverters and Renewable Energy Converters, Industrial Automation and Servo Drives, Battery Management and e-Mobility Systems.
BLDC/PMSM Field-Oriented Motor Control
The DSPIC33EP256GM706-H/MR was explicitly designed for precision motor control: its 70 MIPS DSP core executes field-oriented control (FOC) loops fast enough for 20 kHz+ PWM update rates, while the 12-channel motor-control PWM module provides complementary outputs with hardware dead-time insertion for three-phase inverters. The on-chip op amps condition low-side shunt currents directly, and the 10/12-bit ADC with multiple sample-and-holds samples phase currents simultaneously, eliminating skew errors that corrupt FOC transforms. Two QEI modules accept encoder feedback for servo-grade positioning. In a typical drive, the PWM runs at 16-20 kHz, the current loop closes at that rate, and the speed loop at 1 kHz, all within the DSP headroom. The exposed-pad VQFN-64 dissipates the controller's modest power through the ground plane.
Recommended
Digital Power Conversion (LLC, Totem-Pole PFC)
High-frequency switched-mode power converters need deterministic, sub-microsecond control interrupts, which the 70 MIPS dsPIC33EP256GM706-H/MR delivers with its zero-overhead DSP MAC operations and fast interrupt latency. The 12-channel MCPWM module generates phase-shifted or complementary PWM with nanosecond-resolution dead time, essential for LLC half-bridge and totem-pole PFC topologies where shoot-through protection is safety-critical. The high-speed 10/12-bit ADC synchronizes sampling to PWM events for accurate average-current-mode control. CAN 2.0B on-chip enables digital-power racks to report telemetry on automotive and telecom buses without an external CAN controller. Because voltage-mode loops close at 100-500 kHz switching frequencies, engineers often place the controller at the heart of server PSU and solar micro-inverter platforms.
Recommended
Automotive Body and Powertrain Nodes
With AEC-Q100 qualification and the -H temperature grade, the DSPIC33EP256GM706-H/MR targets automotive electronic control units such as pump controllers, throttle actuators, fan drives, and HVAC blower modules. On-chip CAN 2.0B provides the primary in-vehicle network interface without extra transceiver-adjacent logic, and the rich PWM/capture resources drive brushed and brushless actuators directly. Multiple UART/SPI/I2C ports connect to LIN bridges, position sensors, and diagnostics. The automotive qualification covers the temperature and reliability screening that OEMs demand; firmware developed on industrial -I parts ports directly because the die is identical. Designers should implement the CAN transceiver externally and follow Microchip's automotive reference designs for ESD and load-dump protection on the supply front end.
Recommended
Solar Inverters and Renewable Energy Converters
Grid-tied solar micro-inverters and string optimizers require simultaneous MPPT computation, grid-current shaping, and protection supervision - workloads the dsPIC33EP256GM706-H/MR balances with its 70 MIPS core and DSP engine. Two independent ADC sample-and-hold pairs digitize PV-panel voltage/current and grid voltage/current in the same instant, enabling accurate power calculations for maximum-power-point tracking. The complementary PWM outputs with dead time drive the DC-DC boost and DC-AC inverter stages, while capture channels measure grid zero crossings for phase locking. CAN or UART links report performance data to monitoring gateways. The AEC-Q100 -H grade also suits outdoor-mounted power optimizers exposed to wide temperature swings, where industrial-grade parts would be marginal.
Recommended
Industrial Automation and Servo Drives
Factory automation nodes - servo amplifiers, conveyors, robotics joints, and CNC axes - benefit from the DSC's combination of two quadrature encoder interfaces, 8 input captures, and DSP-speed control loops. The GM706 reads two encoder axes concurrently (e.g., X and Y motion), closes current/velocity/position cascades at kilohertz rates, and communicates over CAN or UART to PLCs. On-chip op amps reduce bill-of-material cost in current-sense front ends, and the 256KB Flash accommodates motion-profile tables plus fieldbus stacks with headroom. The 64-VQFN's exposed pad simplifies thermal design inside sealed drive cabinets. Because Microchip's dsPIC33EP motor-control PIMs (MA330036) cover this family, prototyping a servo axis can start on standard evaluation hardware before custom PCB spins.
Recommended
Battery Management and e-Mobility Systems
Battery packs for e-bikes, forklifts, and light electric vehicles need a controller that measures cell voltages and currents, computes state of charge, drives contactors and pre-charge circuits, and talks CAN to vehicle controllers - a profile matching the DSPIC33EP256GM706-H/MR exactly. Its synchronized ADC channels sample pack current and cell-group voltages within the same window, improving coulomb-counting accuracy, while PWM outputs drive active balancing FETs and the pre-charge relay sequence. On-chip CAN 2.0B implements standard BMS messaging (e.g., for chargers and dashboards) without additional controllers. The AEC-Q100 -H qualification satisfies automotive quality gates, and 256KB Flash leaves room for ISO-style diagnostic firmware and OTA-style bootloader code alongside the core BMS algorithm.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM706-H/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM706-I/MR | DSPIC33EP256GM706-E/MR | DSPIC33EP256GM606-I/MR | DSPIC33EP256GM706-I/PT |
|---|---|---|---|---|---|
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-TQFP - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 256KB | 256KB | 256KB | 128KB | 256KB |
| MCPWM / QEI Channels | 12 MCPWM / 2 QEI | 12 / 2 | 12 / 2 | 12 / 2 | 12 / 2 |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes |
| On-chip Op Amps | Yes (GM-series) | Yes | Yes | Yes | Yes |
Key Differentiators
- AEC-Q100 automotive qualification in VQFN-64 (vs DSPIC33EP256GM706-I/MR)
- Full motor-control peripheral set (12 MCPWM, 2 QEI, 8/8 capture/compare) (vs DSPIC33EP256GM606-I/MR)
- On-chip op amps eliminate external current-sense amplifiers (vs DSPIC33EP256GM706-H/PT)
Design Notes
Connect every VDD/VSS pair on the 64-VQFN; the dsPIC33EP requires all supply pins tied (per Microchip ICSP/programming support notes, 'All VSS and VDD pins' must be connected). Decouple each VDD pin with 100 nF ceramic placed within 2 mm of the pin, plus one bulk 10 uF per supply domain. Estimated: at 70 MIPS from a 3.3 V rail, core current draw is in the tens-of-mA range, so IR drop is small, but transient di/dt from PWM peripheral switching makes local decoupling mandatory to keep the internal regulator stable.
Solder the VQFN exposed pad to a grounded thermal pad with an array of thermal vias (typical 0.3 mm drills on ~1 mm pitch) to the internal ground plane. This pad is both the primary heat removal path and the main RF/EMI ground reference for the PWM edges. For ICSP programming, route one PGECx/PGEDx pair (e.g., PGEC2/PGED2) to a 5-pin header - you may use any pair but must keep ICSPCLK and ICSPDAT from the same pair, per Microchip NSDSP programming guidance.
Do not confuse order codes: -H/MR (this part, 64-VQFN), -I/MR (industrial QFN), and -H/PT (64-TQFP) share a die but not a footprint - the /PT cannot be substituted onto a QFN land pattern. Also verify the -H grade temperature rating on the datasheet ordering table before locking your thermal budget. When using on-chip op amps for shunt sensing, keep the shunt traces Kelvin-connected to the amplifier input pins to preserve the 12-bit ADC's effective resolution.
The 12-channel MCPWM switching high-side FETs creates strong common-mode emissions. Estimated: at 20 kHz PWM with 30 ns edges, harmonics extend well past 30 MHz; keep the motor phase traces short, place gate drivers close to the QFN PWM pins, and use the exposed-pad ground as a quiet reference. Route CAN diff pair with 100 nF-to-ground-stitched return path and add a common-mode choke if the bus exceeds 1 m.
Compliance Information
AEC-Q100 automotive qualification and dsPIC33EP Series listing per Hotenda and DigiKey distributor data. RoHS/REACH/lead-free certificates not present in retrieved data - verify on the Microchip product page.
