DSPIC33EP256GP504T-I/TL - 16-bit 70MIPS DSC 256KB Flash | Microchip
부품 번호: DSPIC33EP256GP504T-I/TL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.45 | $1.45 |
| 10 | $1.38 | $13.80 |
| 100 | $1.31 | $131.00 |
| 500 | $1.24 | $620.00 |
| 1,000 | $1.17 | $1,170.00 |
DSPIC33EP256GP504T-I/TL 개요
A digital signal controller combines the computational architecture of a microcontroller with the math acceleration of a DSP. In the power-management hierarchy, a DSC sits above basic MCUs: it integrates a high-throughput core with motor-control peripherals, making the dsPIC33E family a common choice for embedded control systems that require fast multiply-accumulate operations and deterministic interrupt handling.
Key features of this part include an enhanced CAN 2.0B module, up to 35 programmable I/O pins, integrated operational amplifiers and comparators that offload external analog components, a Peripheral Trigger Generator (PTG) for autonomous task sequencing, and a Charge Time Measurement Unit (CTMU) for capacitive touch and precision timing. Direct Memory Access (DMA) channels move data without CPU intervention, while hardware PWM and watchdog timer peripherals support real-time control loops.
Architecturally, the dsPIC33EP core is a pipelined 16-bit engine optimized for C and assembly code density. The Flash is self-programmable, supporting in-field firmware updates, and the ADC subsystem provides superior sampling performance versus earlier 16-bit families, per Microchip product documentation.
Typical applications include digital power supplies, brushless DC and PMSM motor control, sensor signal conditioning where the on-chip op amps replace external amplifiers, and industrial communication nodes using the CAN bus.
A key design consideration: the T suffix denotes tape-and-reel packing, and the I suffix denotes the industrial -40C to +85C temperature range; verify supply decoupling and the 3.0V-3.6V operating window in your power tree.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: DSPIC33EP256GP504T-I/TL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP256GP504T-I/TL (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, RAM, Core, Flash Program Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP256GP504-I/TL
✅ 드롭인✓ 재고 있음
$4.25 / 개
데이터시트 보기 →DSPIC33EP128GP504T-I/TL
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GP504T-I/TL
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1.95 / 개
데이터시트 보기 →DSPIC33EP256MC504T-I/TL
✅ 드롭인✓ 재고 있음
$3.32 / 개
데이터시트 보기 →DSPIC33EP256GP504T-E/TL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP256GP504T-I/TL 최대 정격 & 전기적 특성
| Core | dsPIC33E 16-bit DSC core |
| Maximum CPU Speed | 70 MIPS |
| Core Frequency | 60 MHz (per distributor listing) |
| Flash Program Memory | 256KB (85.5K x 24) |
| RAM | 32KB |
| 패키지 | 44-VTLA (6x6 mm), HVQCCN |
| 핀 수 | 44 |
| 동작 온도 | -40C to +85C (I suffix) |
| CAN Module | Enhanced CAN 2.0B |
| Integrated Peripherals | OpAmps, Comparators, PTG, CTMU, DMA, PWM, WDT |
| Analog-to-Digital Converter | On-chip ADC (dsPIC33EP family) |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS 상태 | Compliant (per distributor listings) |
| Product Family | dsPIC33EPXXXGP50X general purpose family |
DSPIC33EP256GP504T-I/TL 44-vtla (6x6 mm), hvqccn 핀 구성 가이드
DSPIC33EP256GP504T-I/TL(44-vtla (6x6 mm), hvqccn 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP256GP504T-I/TL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP256GP504T-I/TL 적합 용도: 6 애플리케이션s: Digital Power Supplies, Brushless DC and PMSM Motor Control, Industrial CAN Networking Nodes, Sensor Signal Conditioning, Capacitive Touch Interfaces, Portable and Embedded Instrumentation.
Digital Power Supplies
The DSPIC33EP256GP504T-I/TL fits digital power applications because its 70 MIPS 16-bit core executes proportional-integral control loops at the tens-of-kHz switching frequencies typical of LLC, buck, and PFC stages, while hardware PWM peripherals generate complementary outputs with dead-time insertion. The integrated op amps and comparators condition current-shunt and voltage feedback signals on-chip, replacing external amplifier ICs and reducing BOM cost. The Peripheral Trigger Generator (PTG) sequences ADC sampling to PWM edges autonomously, so loop latency stays deterministic even with CAN or UART traffic running concurrently via DMA. Place the controller between the feedback dividers and gate drivers with 0.1uF decoupling per VDD pin; the 32KB RAM comfortably hosts compensation state, telemetry, and a communication stack simultaneously.
추천
Brushless DC and PMSM Motor Control
Sensorless and sensored BLDC/PMSM drives benefit from the DSPIC33EP256GP504T-I/TL because field-oriented control demands fast multiply-accumulate throughput, which the 70 MIPS DSP-class core provides, plus the enhanced CAN module for industrial drive networking. On-chip comparators support over-current trip in hardware with microsecond-class response, independent of firmware, protecting power stages during faults. The PWM module produces center-aligned outputs for symmetric current sampling, and DMA moves ADC results to RAM without CPU cycles. The 44-pin 6x6 mm VTLA footprint fits compact drive boards where a 10x10 TQFP would not. Flash self-programming allows field firmware updates for tuned motor profiles; the -40C to +85C industrial rating covers typical drive environments.
추천
Industrial CAN Networking Nodes
The enhanced CAN 2.0B module makes this DSC a strong fit for industrial fieldbus nodes, sensor hubs, and machinery controllers that must exchange standardized frames on a shared bus. The 256KB Flash accommodates protocol stacks (for example CANopen-style layers) with room to spare, and 32KB RAM buffers message queues during bus bursts. DMA services the ECAN FIFO, freeing the 70 MIPS core for application logic and diagnostics. Its -40C to +85C rating and 3.3V operation match typical industrial cabinet conditions. Design-wise, add an external CAN transceiver on the CANTX/CANRX pins with proper common-mode termination; the on-chip controller handles arbitration and error frames in hardware, so worst-case bus latencies remain predictable without heavy interrupt load.
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Sensor Signal Conditioning
For systems measuring bridge, thermistor, or current-shunt sensors, the DSPIC33EP256GP504T-i/TL's integrated operational amplifiers amplify millivolt-level signals on-chip, and its comparators provide threshold detection without external analog chips - directly reducing component count on dense boards. The dsPIC33EP ADC samples these conditioned signals at rates adequate for most industrial sensing, and the CTMU supports precise time-domain measurements useful for capacitive or resistive sensing techniques. With 70 MIPS of headroom, the same device applies digital filtering (IIR/FIR), calibration, and linearization on the raw data before transmission over CAN or UART. Use short, guarded PCB traces to the op-amp inputs and keep the analog ground return separate until a single-point star connection near the supply decoupling.
추천
Capacitive Touch Interfaces
The Charge Time Measurement Unit (CTMU) on the DSPIC33EP256GP504T-I/TL enables capacitive touch button, slider, and proximity implementations without a dedicated touch controller. The CTMU charges sense pads with a precision constant current and measures charge time, which the 70 MIPS core and 32KB RAM convert into stable touch detections with debouncing and drift compensation in firmware. The 44-pin package exposes sufficient I/O for multi-key panels alongside LEDs and a communication interface on the same device, consolidating what would otherwise require two or three ICs. Microchip supplies touch sensing libraries for the dsPIC33EP family within MPLAB, shortening time to market. Layout discipline matters: route sense traces away from switching nodes and PWM lines to preserve signal-to-noise on the charge-time measurement.
추천
Portable and Embedded Instrumentation
Bench instruments, handheld meters, and embedded data loggers exploit the DSPIC33EP256GP504T-I/TL's combination of a fast DSP core, on-chip analog (op amps, comparators, ADC), and rich serial connectivity in one 6x6 mm package, minimizing board area. The 256KB Flash stores acquisition firmware, calibration tables, and a UI layer; 32KB RAM buffers waveform capture sessions moved by DMA. Self-programmable Flash permits field firmware upgrades via CAN or UART bootloaders - a key serviceability feature for deployed instruments. The industrial temperature rating and low external-component count suit both bench and field environments. Design tip: budget the core supply carefully and follow the datasheet VCAP capacitor requirement, and reserve the ICSP header on every instrument PCB for in-cabinet firmware updates without disassembly.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP256GP504T-I/TL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP256GP504-I/TL | DSPIC33EP128GP504T-I/TL | DSPIC33EP256MC504T-I/TL | DSPIC33EP256GP504T-I/PT |
|---|---|---|---|---|---|
| Package | 44-VTLA (6x6 mm) | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-TQFP (10x10) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 256KB (85.5K x 24) | 256KB | 128KB | 256KB | 256KB |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C |
| Peripheral Set | OpAmps, Comparators, PTG, CAN | OpAmps, Comparators, PTG, CAN | OpAmps, Comparators, PTG, CAN | Motor-control PWM set (MC variant); GP analog differs | Identical to GP504 standard variant |
| Drop-in Compatibility | Reference | Pin-to-pin, 100% | Pin-to-pin, memory smaller | Pin-to-pin, peripheral set differs | Not drop-in (different package) |
주요 차별점
- Maximum 256KB Flash in the GP504 family tier (vs DSPIC33EP128GP504T-I/TL)
- General-purpose analog set with integrated op amps (vs DSPIC33EP256MC504T-I/TL)
- Compact 6x6 mm VTLA footprint (vs DSPIC33EP256GP504T-I/PT)
설계 노트
The 44-VTLA (6x6 mm) HVQCCN package has a center thermal pad (per Abacus package code HVQCCN). Connect the exposed pad to a grounded copper pour under the device with an array of thermal vias; this improves both heat dissipation at 70 MIPS operation and signal-return integrity. Place 0.1uF decoupling capacitors at every VDD pin within 2 mm of the pad, and follow the family datasheet (DS70000657J) exactly for the VCAP/VDDCORE external capacitor - value and ESR are mandatory, not optional.
Confusing /TL and /PT order codes is the most frequent sourcing error: /TL is the 44-VTLA (6x6 mm) VQFN-style package and /PT is the 44-TQFP (10x10 mm). They are not footprint interchangeable. Also distinguish the T suffix (tape and reel) from the E suffix (extended -40C to +125C temperature); substituting an E part for an I part is safe, but the reverse is not for designs qualified above +85C.
Route the analog inputs feeding the on-chip op amps and ADC away from PWM, CAN, and clock traces. When using the CTMU for touch sensing, keep sense traces short and add guard rings connected to ground. Use the Peripheral Trigger Generator to synchronize ADC sampling away from PWM switching edges, reducing switching-noise coupling into measurements - a technique Microchip demonstrates in its dsPIC33EP digital power reference designs.
Estimated: dsPIC33EP devices at 70 MIPS consume on the order of tens of mA core current (exact value: see family datasheet DS70000657J electrical characteristics). Size the 3.3V regulator for the worst case of full-speed core plus I/O source/sink current plus CAN transceiver supply, and add bulk capacitance near the regulator for CAN bus transient loads. Verify the supply stays within the datasheet operating window across temperature for the I-suffix -40C to +85C range.
규정 준수 정보
RoHS/lead-free status inferred from standard Microchip /I production parts per distributor listings; formal REACH and conflict-minerals declarations not present in the provided data.
