DSPIC33EP256MC502T-I/MM - 70 MIPS 256KB DSC | Microchip
부품 번호: DSPIC33EP256MC502T-I/MM ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.45 | $44.50 |
| 100 | $3.95 | $395.00 |
| 500 | $3.6 | $1,800.00 |
| 1,000 | $3.25 | $3,250.00 |
DSPIC33EP256MC502T-I/MM 개요
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and deterministic interrupt architecture of a microcontroller, sitting in the system hierarchy between a general-purpose MCU and a dedicated DSP. The dsPIC33EP family adds an integrated DSP engine (single-cycle MAC, 40-bit accumulator, dual operand fetch) and advanced analog peripherals for real-time control loops.
Key features include the 16-bit dsPIC33E core at up to 70 MIPS, motor-control PWM (MCPWM) with QEI quadrature encoder interface support, two integrated operational amplifiers, three comparators, and a rich connectivity set: CAN bus, I2C, SPI, UART/USART, IrDA, and LIN bus. The tape-and-reel (T) suffix and industrial (I) temperature grade make it suited for automated high-volume assembly.
Architecturally, the device pairs the DSP engine with flexible peripheral pin select (PPS) routing, allowing digital peripherals to be remapped across I/O pins, which simplifies PCB layout and multi-board reuse. On-chip op amps and comparators reduce external analog component count in current-sense and protection circuits.
Typical applications include precision motor control (BLDC/PMSM/ACIM drives with encoder feedback), digital power supplies and PFC stages, and industrial automation nodes leveraging the CAN interface.
Design consideration: supply the core from the internal regulator using the required VCAP capacitor, and verify QFN exposed-pad grounding and thermal via arrays for best signal integrity and heat dissipation.
This page synthesizes distributor availability data, same-package alternatives, and design guidance not found in the manufacturer datasheet alone.
드롭인 대체품: DSPIC33EP256MC502T-I/MM — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP256MC502T-I/MM (동일 폼 팩터 및 풋프린트) — 차이점: Core, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP256MC502T-H/MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128MC202T-E/MM
✅ 드롭인✓ 재고 있음
$3.41 / 개
데이터시트 보기 →DSPIC33EP256MC502T-I/MM 최대 정격 & 전기적 특성
| Core | 16-bit dsPIC33E DSC |
| Core Speed | 70 MHz / up to 70 MIPS |
| Program Memory (FLASH) | 256 KB (85.5K x 24) |
| RAM | 16 KB |
| 공급 전압 | 3.3 V |
| 패키지 | 28-VQFN Exposed Pad (MM) |
| 동작 온도 | -40C to +85C (I grade) |
| 실장 유형 | Surface Mount |
| Connectivity | CANbus, I2C, SPI, UART/USART, IrDA, LINbus, QEI |
| Motor Control PWM | Yes (MCPWM) |
| Quadrature Encoder Interface | Yes (QEI) |
| On-chip Op Amps | 2 |
| Comparators | 3 |
| Product Family | dsPIC33EP (dsPIC33E) |
| Packaging | Tape & Reel (T suffix) |
| Device Type | Digital Signal Controller (DSC) |
DSPIC33EP256MC502T-I/MM 28-vqfn exposed pad (mm) 핀 구성 가이드
DSPIC33EP256MC502T-I/MM(28-vqfn exposed pad (mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP256MC502T-I/MM.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP256MC502T-I/MM 적합 용도: 6 애플리케이션s: Precision Motor Control (BLDC/PMSM/ACIM), Digital Power Supplies and PFC, Industrial Automation and CAN Networking, Servo Drives and Robotics, Sensor Signal Conditioning and Smart Transducers, Automotive-adjacent Embedded Control (LIN-based).
Precision Motor Control (BLDC/PMSM/ACIM)
The DSPIC33EP256MC502T-I/MM fits precision motor control because its 70 MIPS dsPIC33E core executes field-oriented control (FOC) algorithms with single-cycle MAC operations, while the motor-control PWM (MCPWM) module generates complementary or independent PWM outputs with dead-time control. The integrated 2 op amps condition shunt-resistor current feedback, and the 3 comparators provide hardware overcurrent trip without CPU latency. The QEI interface reads quadrature encoder position feedback for servo-grade closed-loop control. In a typical BLDC/PMSM drive, current-loop execution at 16-20 kHz PWM frequency leaves ample CPU headroom for the outer speed loop and CAN communication. The 28-pin QFN exposed-pad package keeps drive electronics compact while the exposed pad provides low-impedance grounding for switching-noise immunity.
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Digital Power Supplies and PFC
Digital power converters benefit from the DSPIC33EP256MC502T-I/MM's fast deterministic core and analog integration. The MCPWM module supports high-resolution power-conversion PWM modes with phase-shifted outputs for interleaved PFC and LLC topologies, and the on-chip comparators implement cycle-by-cycle current limiting in hardware, critical for protecting MOSFETs during load transients. The 70 MIPS core sustains voltage-mode or current-mode compensation loops at switching frequencies in the hundreds of kilohertz, with ADC-triggered sampling synchronized to PWM events to minimize switching-noise coupling. Because compensation is implemented in firmware, gain scheduling across line and load conditions is straightforward. The 3.3V, -40C to +85C industrial rating suits telecom and industrial power supplies, while the compact QFN-28 footprint fits dense power-stage boards.
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Industrial Automation and CAN Networking
The integrated CAN bus peripheral makes the DSPIC33EP256MC502T-I/MM a strong fit for industrial automation nodes such as sensors, actuators, and sub-controllers on a CAN/LIN network. According to Microchip USA's product data, connectivity options include CANbus, I2C, SPI, UART/USART, IrDA, and LINbus, allowing a single controller to bridge fieldbus traffic to local sensors via SPI/I2C. The 256 KB FLASH accommodates protocol stacks plus application logic without external memory, and 16 KB RAM buffers message queues. Peripheral Pin Select lets designers route UART/SPI pins optimally for PCB routing between revisions. Operating at -40C to +85C industrial grade, the device survives factory-floor environments, and the QFN exposed pad simplives grounding on multi-layer industrial PCBs with mixed digital and power domains.
Servo Drives and Robotics
Robotics servo drives demand precise position, velocity, and torque control, which the DSPIC33EP256MC502T-I/MM addresses through its QEI quadrature encoder interface, MCPWM module, and 70 MIPS DSP engine. Cascaded control loops (position -> velocity -> current) execute at distinct rates with deterministic interrupt latency, and the 3 on-chip comparators provide fault protection against stall or overcurrent events. The two integrated op amps reduce BOM cost in the current-sense path of each drive axis. With 256 KB FLASH, motion profiles, trajectory planners, and CANopen-style communication fit on-chip. The 28-pin QFN package enables compact per-axis drive boards that stack inside robot joints, where board area and thermal path via the exposed pad both matter for reliability under sustained torque loads.
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Sensor Signal Conditioning and Smart Transducers
The DSPIC33EP256MC502T-I/MM's two integrated operational amplifiers and three comparators make it suitable for smart transducers where weak sensor signals must be amplified, thresholded, and digitized locally. Amplifying bridge or current-loop signals with the on-chip op amps eliminates external amplifier ICs, while the DSP engine applies digital filtering (IIR/FIR with single-cycle MAC) to improve measurement resolution beyond raw analog performance. UART/USART and LIN/IrDA support wired telemetry, and the 256 KB FLASH stores calibration tables per unit. Because the entire analog chain plus DSP lives in one 3.3V device, board area and quiescent power shrink, which matters for battery-assisted field sensors operating across the -40C to +85C industrial range. The QFN-28 footprint supports compact probe-form-factor designs.
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Automotive-adjacent Embedded Control (LIN-based)
Although the /I grade is not AEC-Q100 qualified, the DSPIC33EP256MC502T-I/MM serves harsh industrial-vehicle and off-road equipment control nodes using its LIN bus and CAN bus peripherals. Body-adjacent functions such as wiper control, pump control, or lighting ballasts benefit from the MCPWM module driving loads with hardware dead-time and the comparators providing overcurrent shutdown. The 70 MIPS core runs diagnostic routines and field-bus handling concurrently, and 256 KB FLASH holds multiple parameter sets for variant products on one PCB. Designers should confirm the -40C to +85C range covers the mounting location; for genuinely automotive-qualified sockets, Microchip offers AEC-Q100-qualified family variants (verify ordering options on the current product page). The QFN exposed pad aids thermal management in sealed enclosures.
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추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP256MC502T-I/MM — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP256MC502T-H/MM | DSPIC33EP128MC202T-E/MM |
|---|---|---|---|
| Package | 28-VQFN Exposed Pad (MM) | 28-VQFN Exposed Pad (MM) - same | 28-VQFN Exposed Pad (MM) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 256 KB (85.5K x 24) | 256 KB (85.5K x 24) | 128 KB |
| Core Speed | 70 MHz / 70 MIPS | 70 MHz / 70 MIPS | 70 MHz / 70 MIPS |
| On-chip Op Amps | 2 | 2 | 0 |
주요 차별점
- Integrated analog reduces external BOM (vs DSPIC33EP128MC202T-E/MM)
- Maximum memory in the 28-pin footprint (vs DSPIC33EP128MC202T-E/MM)
- Industrial temperature fit (vs DSPIC33EP128MC202T-E/MM)
설계 노트
The dsPIC33E core is fed by an internal regulator: connect the required low-ESR capacitor (typically about 10 uF, per the manufacturer datasheet) to the VCAP/VDDCORE pin and do not apply external voltage to it. Decouple each VDD pin with 0.1 uF ceramics placed within 2 mm of the pin, plus one bulk 4.7-10 uF per device. Keep the 3.3V rail clean; the MCPWM and CAN transceiver switching loads can inject ripple onto the supply, so segregate analog and digital supply routing where possible.
For the 28-VQFN exposed-pad (MM) package, the exposed pad is the primary ground connection and must be soldered to a PCB ground pad with an array of thermal vias (typically 3x3 or 4x4, 0.3 mm drill, filled or tented). An unsoldered or poorly wetted exposed pad is a common cause of intermittent ground return and elevated junction temperature. Follow Microchip's QFN layout guidelines in the datasheet for pad geometry and stencil apertures.
The /I grade is rated -40C to +85C - do not use it where ambient exceeds 85C; select the /E extended-grade variant instead. Also note the difference between family members: the MC202 variants lack the 2 on-chip op amps and 3 comparators of the MC502, so designs relying on integrated analog must not be migrated to MC202 parts without adding external circuitry. Finally, confirm Peripheral Pin Select (PPS) assignments early, since some pins (OSC1/OSC2, MCLR, VCAP) are fixed-function.
규정 준수 정보
The /I temperature grade is not an automotive AEC-Q100 qualification. RoHS/REACH status not stated in the provided web data - verify on Microchip's official product page.
