DSPIC33EP256GM310-I/BG - 16-bit 70 MIPS DSC 256KB Flash | Microchip
부품 번호: DSPIC33EP256GM310-I/BG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP256GM310-I/BG 개요
A digital signal controller combines the compute architecture of a digital signal processor (DSP) with the peripheral set and deterministic interrupt handling of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, DSCs sit between general-purpose MCUs and dedicated DSPs, offering single-cycle MAC instructions plus motor-control peripherals, making them the standard choice for closed-loop digital power and motion control where a plain MCU lacks DSP throughput.
Key features include the 70 MIPS dsPIC33E core with DSP engine (single-cycle multiply-accumulate, dual operand fetch), 256KB of self-programmable Flash with ECC, rich 12-channel motor-control PWM module with dead-time insertion, four QEI inputs for multi-axis servo feedback, and dual integrated op-amps that offload external analog signal conditioning. These reduce BOM count and PCB area in inverter designs.
The dsPIC33E architecture pairs a modified Harvard pipeline with enhanced peripherals: the high-speed PWM supports complementary outputs, fault protection, and ADC-triggered control-loop sampling; the ADC and op-amp front end enable current-sense amplification on-chip. The TFBGA 10x10 footprint provides high I/O density in a compact land pattern suitable for multilayer motor-drive boards.
Typical applications include precision brushless DC and PMSM motor drives, digital power supplies (totem-pole PFC, LLC), solar inverters, and industrial automation controllers requiring field-oriented control at 70 MIPS headroom.
Design consideration: the TFBGA (BG) package demands controlled-impedance, ball-via breakout layout and X-ray inspection for assembly; if your process is not BGA-capable, select the same die in a TQFP (PT) package variant instead.
This page synthesizes distributor inventory data, same-family drop-in alternatives, and BGA-specific design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: DSPIC33EP256GM310-I/BG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP256GM310-I/BG (동일 폼 팩터 및 풋프린트) — 차이점: Core, Operating Temperature Range, Product Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP256GM310T-I/BG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP256GM310-E/BG
✅ 드롭인✓ 재고 있음
$6.05 / 개
데이터시트 보기 →DSPIC33EP256GM310T-E/BG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP256GM310-I/BG 최대 정격 & 전기적 특성
| Core | dsPIC33E 16-bit DSC core |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 256KB (85.5K x 24) Flash |
| RAM Size | 16KB |
| 공급 전압 | 3.3 V |
| 패키지 | 121-TFBGA (10x10 mm) |
| Motor Control PWM Channels | 12 |
| Input Capture Channels | 8 |
| Output Compare Channels | 8 |
| QEI Inputs | 4 |
| On-chip Op Amps | 2 |
| 동작 온도 범위 | -40C to +85C (I grade) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| Product Family | dsPIC33EP 16-bit Digital Signal Controllers |
| RoHS 상태 | Compliant |
DSPIC33EP256GM310-I/BG 121-tfbga (10x10 mm) 핀 구성 가이드
DSPIC33EP256GM310-I/BG(121-tfbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP256GM310-I/BG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP256GM310-I/BG 적합 용도: 6 애플리케이션s: BLDC/PMSM Motor Drives, Digital Power Supplies and PFC, Solar Inverters, Industrial Automation and Robotics, Electric Vehicle and E-mobility Subsystems, Sensor Signal Conditioning and Embedded Control.
BLDC/PMSM Motor Drives
The DSPIC33EP256GM310-I/BG fits brushless DC and permanent-magnet synchronous motor drives because it combines a 70 MIPS DSP core with 12 motor-control PWM channels supporting complementary outputs and dead-time insertion for three-phase inverters. Field-oriented control (FOC) loops execute deterministically with single-cycle MAC instructions, while four QEI inputs accept quadrature encoder feedback from multiple axes. The 2 on-chip op-amps amplify current-shunt signals ahead of the ADC, trimming BOM cost and PCB area versus external amplifier stages. Placed as the central controller with gate drivers between the PWM outputs and the power bridge, it delivers the closed-loop bandwidth needed for servo-grade torque control at 3.3V logic.
추천
Digital Power Supplies and PFC
For totem-pole PFC, LLC converters, and other digitally controlled power stages, the DSPIC33EP256GM310-I/BG provides the 70 MIPS core headroom and 12 PWM channels with fine dead-time and phase control needed for high-frequency switching topologies. The integrated op-amps and high-speed capture/compare peripherals support fast current-mode loops, while 256KB Flash stores compensation tables, protection routines, and communication stacks concurrently. In a typical topology the DSC closes voltage and current loops sampled by its ADC (triggered by the PWM module for cycle-aligned sampling), replacing analog control ICs and gaining programmable fault handling, soft-start, and adaptive dead-time that raise efficiency and reliability.
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Solar Inverters
Grid-tied solar inverters require simultaneous MPPT computation, grid-synchronization (PLL), and three-phase PWM generation - workloads the DSPIC33EP256GM310-I/BG handles comfortably at 70 MIPS with its DSP MAC engine. The 12 PWM channels drive the DC/DC boost and DC/AC bridge stages, 8 output-compare channels support auxiliary timing, and the op-amp front end conditions DC-link current measurements. With 256KB Flash there is room for grid-code compliance firmware, anti-islanding logic, and field-updatable parameters. Implementations typically pair this DSC with gate drivers and an isolated communication interface, using the QEI-less capture peripherals for zero-cross grid timing; the industrial -40C to +85C rating suits outdoor enclosure environments.
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Industrial Automation and Robotics
Multi-axis robotic joints and factory automation nodes benefit from the DSPIC33EP256GM310-I/BG's four independent QEI inputs, which simultaneously decode quadrature encoders from up to four axes without external counter ICs. The 70 MIPS core runs coordinated motion profiles and fieldbus protocol stacks from 256KB Flash, while the 12 PWM channels drive several motor bridges from one controller. Integrated op-amps reduce analog conditioning circuitry at each current-sense point. In distributed architectures the DSC acts as an axis controller receiving setpoints over its serial interfaces, executing servo loops at deterministic kHz rates; the industrial temperature grade and surface-mount TFBGA package suit fanless, DIN-rail, and joint-mounted electronics.
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Electric Vehicle and E-mobility Subsystems
E-mobility subsystems such as traction auxiliaries, pumps, HVAC blowers, and e-bike controllers use the DSPIC33EP256GM310-I/BG where a 70 MIPS FOC engine and rich PWM resource set are needed at automotive-adjacent reliability. The 12 motor-control PWM channels with fault inputs implement safe shutdown on over-current events, four QEI inputs support position feedback from throttle or motor encoders, and the on-chip op-amps condition phase-current shunts. The extended-temperature -E/BG drop-in variant (same 121-TFBGA footprint) covers under-hood ambient conditions up to +125C. Firmware for torque control, regenerative braking, and diagnostics fits within 256KB Flash, and the 3.3V supply interfaces directly with standard automotive logic rails.
추천
Sensor Signal Conditioning and Embedded Control
General embedded control systems that combine analog sensing with moderate DSP processing choose the DSPIC33EP256GM310-I/BG for its two on-chip operational amplifiers, which front-end strain-gauge, thermocouple, or current-sensor signals before the internal ADC - eliminating external instrumentation amplifiers in cost-sensitive designs. The 70 MIPS DSP core applies digital filtering (IIR/FIR), FFT analysis, or calibration routines that a conventional MCU would perform too slowly. With 256KB Flash and 16KB RAM there is headroom for protocol stacks (UART/SPI/I2C per the datasheet configuration), data logging, and OTA-style firmware updates. The high I/O density of the 121-ball TFBGA integrates display, keypad, and actuator interfaces on a single compact board.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP256GM310-I/BG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP256GM310T-I/BG | DSPIC33EP256GM310-E/BG | DSPIC33EP256GM310T-E/BG |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash / RAM | 256KB / 16KB | 256KB / 16KB | 256KB / 16KB | 256KB / 16KB |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| PWM Channels | 12 motor-control | 12 motor-control | 12 motor-control | 12 motor-control |
| On-chip Op Amps | 2 | 2 | 2 | 2 |
| Packaging Format | Tray | Tape & Reel | Tray | Tape & Reel |
주요 차별점
- Four QEI inputs in a single high-density package (vs DSPIC33EP256GM306 (TQFP family member))
- Extended-temperature drop-in variant available (vs DSPIC33EP256GM310-E/BG)
- Integrated op-amps reduce external analog BOM (vs Generic 16-bit MCUs without on-chip op-amps)
설계 노트
The 121-TFBGA (10x10 mm, BG suffix) package requires controlled BGA breakout routing: escape 0.8 mm-pitch balls with via-in-pad or dog-bone fanout on the outer layers, and reserve inner layers for VDD/VSS planes. Include X-ray or AOI inspection capability in your assembly flow - BGA solder-joint defects are invisible to visual inspection. If your CM lacks BGA capability, the same die exists in TQFP family variants at the firmware level, but those are NOT pin-compatible drop-ins. Verify land-pattern geometry against the manufacturer datasheet before finalizing the PCB footprint.
The DSPIC33EP256GM310-I/BG runs from a 3.3V rail. Place 100 nF ceramic decoupling capacitors on each VDD ball pair as close to the balls as fanout allows, plus bulk 4.7-10 uF near the package. Motor-drive designs should keep PWM-switched gate-driver return currents off the DSC ground plane - use a star or split ground referenced at a single point. Estimated: current consumption scales with the 70 MIPS operating frequency; confirm exact IDD figures from the electrical characteristics table in the manufacturer datasheet rather than from secondary distributor summaries.
Common mistakes with this part: (1) ordering the /BG package without confirming BGA assembly capability - choose a TQFP variant of the same die instead for new designs; (2) assuming 5V-tolerant I/O - this is a 3.3V device, check absolute maximum ratings in the manufacturer datasheet before interfacing 5V logic; (3) ignoring the QEI input assignment when remapping peripheral pins - the 4 QEI channels need RPx pin selection consistent with the PPS (peripheral pin select) map; (4) using the standard -I grade in environments above +85C ambient where the -E grade (-40C to +125C, pin-compatible) is required.
규정 준수 정보
RoHS compliance consistent with current Microchip standard product sold via DigiKey/Mouser. Formal REACH, lead-free, halogen-free, and conflict-minerals declarations should be obtained from the official Microchip product page compliance certificates.
