EP1AGX20CF484C3 - Arria GX FPGA 20K LE FBGA-484 | Altera
부품 번호: EP1AGX20CF484C3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $195 | $195,000.00 |
EP1AGX20CF484C3 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM. FPGAs occupy a middle position in the programmable-logic hierarchy: above fixed-function ASICs in flexibility, below microprocessors in software convenience, and complementary to CPLDs for high-density parallel processing. The Arria GX family specifically targets transceivers, DSP, and memory-rich applications.
Key features of the EP1AGX20CF484C3 include up to 4 embedded transceivers operating at up to 3.125 Gbps, dedicated DSP blocks for high-throughput signal processing, embedded RAM organized into M9K/M144K blocks, and an LVDS-compatible I/O count designed to interface directly with external DDR/DDR2 memories. The device supports the Cyclone/Arria configuration scheme and is built on a mature TSMC 90nm process.
The architecture combines a low-power programmable logic fabric with hardened multi-gigabit transceivers, reducing BOM cost versus building discrete SERDES. Configuration is loaded via JTAG, Active Serial, or Passive Parallel modes, with built-in support for in-system reconfigurability. The 484-pin FBGA package supports high-density signal routing and is suitable for advanced PCB designs with controlled-impedance differential pairs.
Typical applications include telecommunications backplane interfaces, video broadcasting, serial protocol bridging, industrial control and test equipment, and military/aerospace signal processing. The combination of high-speed serial I/O and DSP resources makes it well-suited for protocol conversion, image processing, and high-bandwidth data acquisition. The FPGA has been widely adopted in legacy designs requiring deterministic low-latency processing.
When designing with this part, allocate sufficient power-decoupling capacitance near each power pin and follow the FBGA PCB layout guidelines for fine-pitch BGA assembly. The C3 speed grade represents the lower-speed of the family; the I6N variant is industrial temperature. Engineers should consult the Altera Arria GX Device Handbook for detailed I/O timing, transceiver configuration, and Quartus II software toolchain support.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a single source for engineers evaluating the EP1AGX20CF484C3.
드롭인 대체품: EP1AGX20CF484C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX20CF484C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Family, Transceivers, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX20CF484C6N
✅ 드롭인✓ 재고 있음
$110 / 개
데이터시트 보기 →EP1AGX20CF484I6N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1AGX35CF484C6N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP1AGX50CF484C6N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2AGX45EF29C5N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1AGX20CF484C3 최대 정격 & 전기적 특성
| Family | Arria GX |
| Logic Elements | 21580 |
| Total RAM Bits | 1229184 |
| Number of I/O Pins | 230 |
| 패키지 | 484-pin FBGA (FineLine BGA) |
| Speed Grade | C3 |
| 동작 온도 | 0C to +85C (Commercial) |
| Transceivers | 4 channels |
| Max Transceiver Data Rate | 3.125 Gbps |
| Configuration Method | JTAG, Active Serial, Passive Parallel |
| Process Technology | 90 nm TSMC |
| 실장 유형 | Surface Mount |
EP1AGX20CF484C3 484-pin fbga (fineline bga) 핀 구성 가이드
EP1AGX20CF484C3(484-pin fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX20CF484C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX20CF484C3 적합 용도: 6 애플리케이션s: Telecommunications Backplane Interface, Video Broadcasting and Image Processing, Industrial Control and Test Equipment, High-Speed Data Acquisition Systems, Military and Aerospace Signal Processing, Protocol Bridging and Interface Conversion.
Telecommunications Backplane Interface
The EP1AGX20CF484C3 is well-suited for telecom backplane applications requiring SERDES links up to 3.125 Gbps. Its 4 embedded transceivers support protocols such as PCIe Gen1, Gigabit Ethernet, and Serial RapidIO, allowing multi-channel bridging across a backplane. The 21580 logic elements provide sufficient capacity for protocol conversion logic, framer/ deframer blocks, and link-layer state machines. Compared to building discrete SERDES, the integrated transceivers reduce BOM and board area while maintaining deterministic latency. The 1.23 Mbit embedded RAM is enough for packet buffers and routing tables. Use the Arria GX device handbook reference designs as a starting point for PCS implementation, and verify signal-integrity on the backplane connector.
추천
Video Broadcasting and Image Processing
The EP1AGX20CF484C3 serves video broadcast applications with its combination of DSP blocks, embedded RAM, and high-speed LVDS-capable I/O. The 1229184 bits of embedded memory accommodate line buffers for HD/SD video processing, while the dedicated DSP blocks enable real-time filtering, scaling, and color-space conversion. The 230 user I/Os support parallel video busses (BT.656, BT.1120) as well as serialized formats via the transceivers. The C3 speed grade is adequate for SDI and HDMI bridging tasks at 720p/1080i resolutions. Compared to a discrete DSP + FPGA architecture, the integrated DSP fabric reduces part count and power. Reference designs in the Altera Video and Image Processing Suite provide IP for common broadcast functions.
추천
Industrial Control and Test Equipment
The EP1AGX20CF484C3 fits industrial control applications where deterministic low-latency processing is required alongside multi-channel serial I/O. The 4 transceivers support EtherCAT, PROFINET, or proprietary industrial fieldbus at rates up to 3.125 Gbps, while the DSP blocks accelerate PID controllers and signal-conditioning filters. Embedded RAM holds calibration tables and process data. Although the standard part is commercial-temperature (0C to +85C), engineers can substitute the pin-compatible EP1AGX20CF484I6N for industrial environments. Compared to microcontroller-based solutions, the FPGA provides deterministic timing closure and parallel DSP throughput. Reference designs for motor control and data acquisition are available in the Altera Industrial Reference Design Library.
추천
High-Speed Data Acquisition Systems
The EP1AGX20CF484C3's 4 transceivers and DSP blocks make it appropriate for high-bandwidth data acquisition systems. Multi-channel ADCs feed digitized data into the FPGA via LVDS pairs, where DSP blocks perform FIR filtering, decimation, and FFT analysis. The 1.23 Mbit embedded RAM buffers multi-channel sample streams before DMA to external memory, while the 230 I/Os handle parallel LVDS ADC interfaces. Compared to using a DSP chip alone, the FPGA combines acquisition interfaces and processing in a single device. The C3 speed grade is suitable for ADC sampling rates up to 250 MSPS; for higher rates use the C6N variant. Reference designs in the Altera DSP Builder provide signal-processing IP.
추천
Military and Aerospace Signal Processing
The EP1AGX20CF484C3 is used in legacy military and aerospace signal-processing applications, where its deterministic logic and configurable I/O suit radar, electronic warfare, and secure-communications subsystems. The C3 commercial temperature grade is acceptable for indoor/benign environments; for harsher missions the industrial variant EP1AGX20CF484I6N is required. The 21580 logic elements implement custom signal-processing pipelines while the DSP blocks accelerate FFTs, pulse compression, and beamforming. Conformal coating and BGA underfill are commonly required for vibration tolerance. Per Altera military-grade documentation, the Arria GX family has been deployed in avionics and naval systems. New designs should evaluate Arria II GX with broader military support.
추천
Protocol Bridging and Interface Conversion
The EP1AGX20CF484C3 is a strong choice for protocol bridging applications where multiple serial standards must be converted in a single device. Common use cases include PCIe-to-Ethernet bridging, Serial RapidIO fabric expansion, and SATA-to-Fibre Channel conversion. The 4 transceivers handle multiple protocol streams simultaneously, while the embedded RAM and logic elements implement protocol state machines and buffer management. Compared to using an ASSP bridge chip, the FPGA offers flexibility to support evolving protocols and customer-specific extensions. Reference designs for PCIe Gen1 and Gigabit Ethernet MACs are available in Altera's MegaWizard Plug-In Manager.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1AGX20CF484C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX20CF484C6N | EP1AGX20CF484I6N | EP1AGX35CF484C6N | EP1AGX50CF484C6N | EP2AGX45EF29C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same (verify pinout) |
| Logic Elements | 21,580 | 21,580 | 21,580 | 35,000 | 50,000 | 45,000 |
| Max Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 6.375 Gbps |
| Speed Grade | C3 | C6N (faster) | I6N (faster, industrial) | C6N | C6N | C5 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 40 nm |
주요 차별점
- Lowest-speed grade in Arria GX family (vs EP1AGX20CF484C6N)
- Commercial temperature range vs industrial grade (vs EP1AGX20CF484I6N)
- 20K logic element density vs larger family members (vs EP1AGX35CF484C6N)
- Older 90nm Arria GX generation (vs EP2AGX45EF29C5N (Arria II GX))
설계 노트
Estimated: At maximum activity with all 4 transceivers active and logic utilization near 100%, the EP1AGX20CF484C3 may dissipate 3-5W. The FBGA-484 package has no exposed thermal pad, so thermal dissipation relies entirely on PCB copper thermal vias under the BGA. Recommended: at least 4 thermal vias (0.3 mm drill, 0.5 mm pad) per inner power/ground ball pair, with a 4-layer PCB and a top-side copper flood under the BGA. Without thermal vias, the junction temperature may exceed 100C at ambient above 60C. Estimate: T_j = T_a + P_diss * theta_JA; with theta_JA around 20 C/W on a 4-layer JEDEC board, T_j = 25C + 5W * 20 = 125C - borderline for commercial grade.
FBGA-484 requires a 4-layer PCB minimum, with controlled impedance (50 ohm single-ended, 100 ohm differential) for transceiver and LVDS signals. Use 1.0 mm ball pitch escape routing: 0.1 mm trace width with 0.1 mm spacing on the fanout layer. Place decoupling capacitors (0.1 uF, 0.01 uF, and bulk 10 uF) within 5 mm of each power pin group. The transceiver reference clock routing must be length-matched within 25 mils between differential pairs. Use the Altera Arria GX board design guidelines (AN-510) as reference.
The 4 multi-gigabit transceivers at 3.125 Gbps require strict signal-integrity practices. Use AC-coupling capacitors (0.01 uF) on each transmit differential pair, located within 50 mm of the FPGA pin. Receive pairs do not require AC-coupling per the Altera reference schematic. Maintain 100 ohm differential impedance with 85 ohm traces if using MicroStrip, or stripline with appropriate via design. Per Altera AN-558, the reference clock jitter must be < 1 ps RMS for proper 3.125 Gbps operation. Recommend using a dedicated low-jitter clock generator such as CDCM61001 or equivalent.
Common pitfalls when designing with EP1AGX20CF484C3: (1) Confusing the C3 speed grade with C6N - C3 is the slowest in the family and may not meet timing for high-frequency DSP designs. (2) Forgetting that the device is NRND - new designs should consider Arria II GX or Cyclone V SoC. (3) Using commercial temperature parts in industrial environments - substitute EP1AGX20CF484I6N for industrial. (4) Forgetting configuration mode pin strapping (MSEL pins must be tied high/low for AS or JTAG mode). (5) Underestimating inrush current at power-up - the device can draw > 2 A surge; use sequenced power rails.
FBGA-484 layout requires careful via-in-pad or dog-bone fanout patterns. For via-in-pad, fill and plate the vias to ensure reliable solder joint formation. Use NSMD (non-solder mask defined) pads with a 0.4 mm diameter for 1.0 mm pitch BGA balls. Recommend at least 4 ground reference layers; the transceiver power (VCCH) and core power (VCCINT) must be isolated to avoid coupling noise. Reference the Altera Arria GX Hardware Reference Manual, Volume 1, for detailed stackup recommendations.
규정 준수 정보
RoHS/REACH compliance status not explicitly stated in the verified web data; some Altera Arria GX family parts were produced before RoHS was widely adopted. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade ASIC.