EP1K50FI484-2N - 50K-Gate ACEX 1K FPGA, 484-FBGA | Intel (Altera)
부품 번호: EP1K50FI484-2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45.5 | $45.50 |
| 10 | $41.2 | $412.00 |
| 100 | $36.8 | $3,680.00 |
| 500 | $32.5 | $16,250.00 |
| 1,000 | $28.9 | $28,900.00 |
EP1K50FI484-2N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect. The ACEX 1K family sits within the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and SPLDs; FPGAs differ from CPLDs in offering higher logic density, distributed RAM, and richer I/O capabilities, making them the natural choice for glue-logic, datapath, and small-to-mid volume ASIC-replacement designs.
Key features of the EP1K50FI484-2N include 49,760 typical gates, 2,880 logic cells, 40,960 bits of embedded RAM (EAB), up to 333 user I/O pins, and MultiVolt I/O support allowing I/O banks to interface at 2.5 V or 3.3 V. The device also offers JTAG-based IEEE 1149.1 boundary-scan, in-system programmability via the Altera ByteBlaster or BitBlaster, and a typical standby current under 10 mA. Industrial-grade temperature range is -40 °C to +85 °C, and the silicon is fabricated on a 0.22 µm four-layer metal CMOS process.
Architecturally, the ACEX 1K family combines a continuous row-based LAB (Logic Array Block) structure with embedded array blocks (EABs) that can be configured as RAM, ROM, or product-term logic. Each LAB contains 10 logic elements, and the interconnect is a fast continuous routing matrix. The 2.5 V core, 0.22 µm process, and 200 MHz toggle rate position this part between early 5 V FPGAs and later Cyclone-class devices.
Typical applications include industrial control and factory automation interfaces, glue logic and bus bridging (PCI, ISA, VME), digital signal processing pre-processing, custom peripheral controllers in embedded designs, and low-volume ASIC replacement in telecom and instrumentation equipment.
When designing with this device, plan I/O bank voltage rails carefully - the ACEX 1K MultiVolt interface requires 2.5 V VCCINT and per-bank VCCIO rails at 2.5 V or 3.3 V. The 484-FBGA package requires careful PCB layout with controlled-impedance traces and a 4-6 layer stack-up to maintain signal integrity on high-speed outputs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes not aggregated on any single manufacturer or distributor page.
드롭인 대체품: EP1K50FI484-2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1K50FI484-2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Operating Temperature, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1K50FI484-2
✅ 드롭인✓ 재고 있음
$23.95 / 개
데이터시트 보기 →EP1K50FC484-2N
✅ 드롭인✓ 재고 있음
$26.4 / 개
데이터시트 보기 →EP1K50FC484-3N
✅ 드롭인✓ 재고 있음
$19.5 / 개
데이터시트 보기 →EP1K100FI484-2N
✅ 드롭인✓ 재고 있음
$65 / 개
데이터시트 보기 →EP1K100FC484-2N
✅ 드롭인✓ 재고 있음
$58.4 / 개
데이터시트 보기 →EP1K50FI484-2N 최대 정격 & 전기적 특성
| Family | ACEX 1K |
| Typical Gates | 50,000 |
| Logic Elements | 2,880 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V (MultiVolt) |
| Embedded Memory (EAB) | 40,960 bits |
| User I/O Pins (max) | 333 |
| 패키지 | 484-pin FBGA (FineLine BGA) |
| 동작 온도 | -40 °C to +85 °C (industrial) |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster |
| 실장 유형 | Surface Mount |
| Speed Grade | -2 |
| Total Logic Elements (LE) | 2,880 |
EP1K50FI484-2N 484-pin fbga (fineline bga) 핀 구성 가이드
EP1K50FI484-2N(484-pin fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1K50FI484-2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1K50FI484-2N 적합 용도: 6 애플리케이션s: Industrial Control and Factory Automation, PCI/ISA/VME Bus Bridging, Custom Peripheral Controllers in Embedded Designs, Digital Signal Processing Pre-Processing, Low-Volume ASIC Replacement in Telecom and Instrumentation, Glue Logic and System Integration.
Industrial Control and Factory Automation
The EP1K50FI484-2N suits industrial-control and factory-automation systems where it serves as a flexible glue-logic hub interfacing sensors, motor drivers, and human-machine interfaces to a central PLC or industrial PC. The 50K-gate capacity absorbs typical protocol-bridging (RS-232/RS-485 to parallel), quadrature-decoder logic, PWM-generation, and timing-critical state machines. Industrial-temperature qualification (-40 °C to +85 °C) is essential for factory-floor operation, and the 484-FBGA's thermal performance supports continuous duty. The ACEX 1K MultiVolt I/O allows direct interface to 5 V-tolerant peripherals via 3.3 V VCCIO banks, simplifying mixed-voltage panel designs.
추천
PCI/ISA/VME Bus Bridging
Legacy PCI, ISA, and VME bus systems often require custom bridging logic that the EP1K50FI484-2N provides cost-effectively. With 333 user I/Os, the part can implement a 32-bit PCI target with DMA engine, address decoding, and interrupt steering within its 2,880 logic elements. The 200 MHz internal rate and 40 kbit embedded RAM (EAB) handle buffering for short bursts. MultiVolt I/O banks allow direct 3.3 V PCI signalling and 5 V-tolerant legacy ISA/VME interfacing on the same die. Industrial temperature qualification suits factory-automation backplane applications.
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Custom Peripheral Controllers in Embedded Designs
In embedded designs the EP1K50FI484-2N functions as a custom peripheral controller, offloading timing-sensitive tasks such as LCD refresh, key-scanning, motor-control PWM, and sensor preprocessing from the main processor. Its 200 MHz capability supports real-time DSP pre-processing like FIR filters or motor-control algorithms. The 40 kbit EAB RAM enables small FIFO buffers between the FPGA and CPU without external SRAM, while 333 I/Os comfortably drive multi-port parallel interfaces. Industrial temperature makes it suitable for harsh-environment embedded systems such as outdoor signage controllers and vehicle telematics.
추천
Digital Signal Processing Pre-Processing
The EP1K50FI484-2N is well-suited to DSP pre-processing tasks such as data acquisition front-ends, digital decimation, FFT pre-conditioning, and baseband signal conditioning prior to a dedicated DSP. With 200 MHz toggle rate and 40 kbit embedded RAM, it can implement small FIR/IIR filters, gain stages, and channel-selection logic. The 484-FBGA package provides the I/O bandwidth required for parallel ADC/DAC interfaces (e.g., 12-14 bit, 50-100 MSPS), while industrial temperature qualification suits test-and-measurement instrumentation. Quartus II design tools support VHDL/Verilog DSP IP cores.
추천
Low-Volume ASIC Replacement in Telecom and Instrumentation
For low-to-mid volume ASIC replacements in telecom and test-and-measurement equipment, the EP1K50FI484-2N offers NRE-free programmability with 50K-gate capacity and industrial temperature qualification. The 484-FBGA package supports the high pin-count required for telecom backplane interfaces and instrument front-panel I/O. The ACEX 1K family supports in-system programmability via JTAG, enabling field updates and reconfiguration. For designs where 50K gates suffices but Cyclone II/III lifecycle support is preferred, migration to EP2C5 with PCB rework is recommended.
추천
Glue Logic and System Integration
The EP1K50FI484-2N is a workhorse for board-level glue logic: address decoding, chip-select generation, bus multiplexing, interrupt prioritization, and reset sequencing for complex multi-processor boards. The 2,880 logic elements and 333 user I/Os comfortably absorb typical north-bridge/south-bridge glue in industrial single-board computers and telecom line cards. The MultiVolt I/O interface allows direct connection to 2.5 V processors and 3.3 V peripherals without external level shifters, while the 484-FBGA package's high pin count suits backplane-edge designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1K50FI484-2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1K50FI484-2 | EP1K50FC484-2N | EP1K50FC484-3N | EP1K100FI484-2N | EP1K100FC484-2N |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 100,000 | 100,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 4,992 | 4,992 |
| Max Frequency | 200 MHz | 200 MHz | 200 MHz | 250 MHz (faster speed grade) | 200 MHz | 200 MHz |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Speed Grade | -2 | -2 | -2 | -3 (faster) | -2 | -2 |
| Embedded RAM (EAB) | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 81,920 bits | 81,920 bits |
주요 차별점
- Industrial temperature qualification (vs EP1K50FC484-2N)
- Speed grade -2 for power-friendliness (vs EP1K50FC484-3N)
- 50K-gate density tier (vs EP1K100FI484-2N)
설계 노트
Estimated: at 200 MHz with 50% toggle activity, VCCINT current draw is approximately 200–400 mA per the ACEX 1K datasheet family curves. With 2.5 V VCCINT, core power dissipation is roughly 0.5–1.0 W. Decoupling requires at least four 0.1 µF ceramic capacitors placed within 5 mm of each VCCINT ball cluster, plus a single bulk 47–100 µF tantalum or polymer capacitor on the supply rail. VCCIO bank rails (2.5 V or 3.3 V per bank) need their own local decoupling.
The 484-FBGA, 1.0 mm pitch package requires a 4–6 layer PCB stack-up with a continuous ground plane beneath the BGA. Use microvia-in-pad or dog-bone fan-out if via-in-pad is unavailable. Maintain 50 Ω controlled impedance on high-speed outputs (≥100 MHz) by using 4–5 mil trace widths on a standard FR-4 stack-up. Place JTAG and configuration signals on inner signal layers to keep top/bottom layers free for high-speed routing.
Estimated: at 1 W core dissipation, the 484-FBGA thermal resistance θJA is approximately 18–22 °C/W (with a standard JEDEC test board, no airflow), giving a 18–22 °C junction temperature rise. Industrial designs at 85 °C ambient need at least some airflow or thermal via array beneath the package exposed pad (if present in the specific BGA variant) to maintain a safe junction temperature. Use the Quartus II PowerPlay estimator for design-specific thermal analysis.
ACEX 1K MultiVolt I/O outputs have edge rates in the 1–3 ns range. For 3.3 V PCI or other 33–66 MHz synchronous interfaces, series-terminate outputs with 22–33 Ω resistors to dampen reflections on traces longer than 50 mm. Keep clock traces length-matched within ±2 mm across the bus. Use the IBIS model (available from Altera legacy support) for board-level simulation.
Critical pitfalls: (1) Do not apply 5 V to VCCINT - only 2.5 V is supported and over-voltage destroys the part. (2) Do not exceed the maximum JTAG TCK frequency (10 MHz typical, 16 MHz max). (3) Do not use ACEX 1K BSDL files for Cyclone II/III/IV parts - the BSDL is silicon-specific. (4) When migrating to EP2C5 (Cyclone II), confirm pin-out compatibility - the 484-FBGA ball map differs between ACEX 1K and Cyclone II.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free status not confirmed in available data. The ACEX 1K family was introduced before RoHS took effect and many -2N variants ship with lead-bearing BGA finishes. Request a compliance certificate from the franchised distributor (e.g., Rochester Electronics) before shipping into RoHS-restricted markets. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part.