EP1AGX20CF484C3 - Arria GX FPGA 20K LE FBGA-484 | Altera
MPN: EP1AGX20CF484C3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1AGX20CF484C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX20CF484C6N
✅ Drop-In✓ In Stock
$110 / Unit
View Datasheet →EP1AGX20CF484I6N
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EP1AGX35CF484C6N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1AGX50CF484C6N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2AGX45EF29C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1AGX20CF484C3 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 21580 |
| Total RAM Bits | 1229184 |
| Number of I/O Pins | 230 |
| Package | 484-pin FBGA (FineLine BGA) |
| Speed Grade | C3 |
| Operating Temperature | 0C to +85C (Commercial) |
| Transceivers | 4 channels |
| Max Transceiver Data Rate | 3.125 Gbps |
| Configuration Method | JTAG, Active Serial, Passive Parallel |
| Process Technology | 90 nm TSMC |
| Mounting Type | Surface Mount |
EP1AGX20CF484C3 484-pin fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1AGX20CF484C3 (484-pin fbga (fineline bga) package) with 230 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX20CF484C3.
Refer to the datasheet for full pin configuration.
Estimated pin count: 230 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX20CF484C3 is suitable for 6 applications: Telecommunications Backplane Interface, Video Broadcasting and Image Processing, Industrial Control and Test Equipment, High-Speed Data Acquisition Systems, Military and Aerospace Signal Processing, Protocol Bridging and Interface Conversion.
Telecommunications Backplane Interface
The EP1AGX20CF484C3 is well-suited for telecom backplane applications requiring SERDES links up to 3.125 Gbps. Its 4 embedded transceivers support protocols such as PCIe Gen1, Gigabit Ethernet, and Serial RapidIO, allowing multi-channel bridging across a backplane. The 21580 logic elements provide sufficient capacity for protocol conversion logic, framer/ deframer blocks, and link-layer state machines. Compared to building discrete SERDES, the integrated transceivers reduce BOM and board area while maintaining deterministic latency. The 1.23 Mbit embedded RAM is enough for packet buffers and routing tables. Use the Arria GX device handbook reference designs as a starting point for PCS implementation, and verify signal-integrity on the backplane connector.
Recommended
Video Broadcasting and Image Processing
The EP1AGX20CF484C3 serves video broadcast applications with its combination of DSP blocks, embedded RAM, and high-speed LVDS-capable I/O. The 1229184 bits of embedded memory accommodate line buffers for HD/SD video processing, while the dedicated DSP blocks enable real-time filtering, scaling, and color-space conversion. The 230 user I/Os support parallel video busses (BT.656, BT.1120) as well as serialized formats via the transceivers. The C3 speed grade is adequate for SDI and HDMI bridging tasks at 720p/1080i resolutions. Compared to a discrete DSP + FPGA architecture, the integrated DSP fabric reduces part count and power. Reference designs in the Altera Video and Image Processing Suite provide IP for common broadcast functions.
Recommended
Industrial Control and Test Equipment
The EP1AGX20CF484C3 fits industrial control applications where deterministic low-latency processing is required alongside multi-channel serial I/O. The 4 transceivers support EtherCAT, PROFINET, or proprietary industrial fieldbus at rates up to 3.125 Gbps, while the DSP blocks accelerate PID controllers and signal-conditioning filters. Embedded RAM holds calibration tables and process data. Although the standard part is commercial-temperature (0C to +85C), engineers can substitute the pin-compatible EP1AGX20CF484I6N for industrial environments. Compared to microcontroller-based solutions, the FPGA provides deterministic timing closure and parallel DSP throughput. Reference designs for motor control and data acquisition are available in the Altera Industrial Reference Design Library.
Recommended
High-Speed Data Acquisition Systems
The EP1AGX20CF484C3's 4 transceivers and DSP blocks make it appropriate for high-bandwidth data acquisition systems. Multi-channel ADCs feed digitized data into the FPGA via LVDS pairs, where DSP blocks perform FIR filtering, decimation, and FFT analysis. The 1.23 Mbit embedded RAM buffers multi-channel sample streams before DMA to external memory, while the 230 I/Os handle parallel LVDS ADC interfaces. Compared to using a DSP chip alone, the FPGA combines acquisition interfaces and processing in a single device. The C3 speed grade is suitable for ADC sampling rates up to 250 MSPS; for higher rates use the C6N variant. Reference designs in the Altera DSP Builder provide signal-processing IP.
Recommended
Military and Aerospace Signal Processing
The EP1AGX20CF484C3 is used in legacy military and aerospace signal-processing applications, where its deterministic logic and configurable I/O suit radar, electronic warfare, and secure-communications subsystems. The C3 commercial temperature grade is acceptable for indoor/benign environments; for harsher missions the industrial variant EP1AGX20CF484I6N is required. The 21580 logic elements implement custom signal-processing pipelines while the DSP blocks accelerate FFTs, pulse compression, and beamforming. Conformal coating and BGA underfill are commonly required for vibration tolerance. Per Altera military-grade documentation, the Arria GX family has been deployed in avionics and naval systems. New designs should evaluate Arria II GX with broader military support.
Recommended
Protocol Bridging and Interface Conversion
The EP1AGX20CF484C3 is a strong choice for protocol bridging applications where multiple serial standards must be converted in a single device. Common use cases include PCIe-to-Ethernet bridging, Serial RapidIO fabric expansion, and SATA-to-Fibre Channel conversion. The 4 transceivers handle multiple protocol streams simultaneously, while the embedded RAM and logic elements implement protocol state machines and buffer management. Compared to using an ASSP bridge chip, the FPGA offers flexibility to support evolving protocols and customer-specific extensions. Reference designs for PCIe Gen1 and Gigabit Ethernet MACs are available in Altera's MegaWizard Plug-In Manager.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX20CF484C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX20CF484C6N | EP1AGX20CF484I6N | EP1AGX35CF484C6N | EP1AGX50CF484C6N | EP2AGX45EF29C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same (verify pinout) |
| Logic Elements | 21,580 | 21,580 | 21,580 | 35,000 | 50,000 | 45,000 |
| Embedded Memory (bits) | 1,229,184 | 1,229,184 | 1,229,184 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O Count | 230 | 230 | 230 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Transceiver Count | 4 | 4 | 4 | [DATA_NEEDED] | [DATA_NEEDED] | 8 |
| Max Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 6.375 Gbps |
| Speed Grade | C3 | C6N (faster) | I6N (faster, industrial) | C6N | C6N | C5 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 40 nm |
Key Differentiators
- Lowest-speed grade in Arria GX family (vs EP1AGX20CF484C6N)
- Commercial temperature range vs industrial grade (vs EP1AGX20CF484I6N)
- 20K logic element density vs larger family members (vs EP1AGX35CF484C6N)
- Older 90nm Arria GX generation (vs EP2AGX45EF29C5N (Arria II GX))
Design Notes
Estimated: At maximum activity with all 4 transceivers active and logic utilization near 100%, the EP1AGX20CF484C3 may dissipate 3-5W. The FBGA-484 package has no exposed thermal pad, so thermal dissipation relies entirely on PCB copper thermal vias under the BGA. Recommended: at least 4 thermal vias (0.3 mm drill, 0.5 mm pad) per inner power/ground ball pair, with a 4-layer PCB and a top-side copper flood under the BGA. Without thermal vias, the junction temperature may exceed 100C at ambient above 60C. Estimate: T_j = T_a + P_diss * theta_JA; with theta_JA around 20 C/W on a 4-layer JEDEC board, T_j = 25C + 5W * 20 = 125C - borderline for commercial grade.
FBGA-484 requires a 4-layer PCB minimum, with controlled impedance (50 ohm single-ended, 100 ohm differential) for transceiver and LVDS signals. Use 1.0 mm ball pitch escape routing: 0.1 mm trace width with 0.1 mm spacing on the fanout layer. Place decoupling capacitors (0.1 uF, 0.01 uF, and bulk 10 uF) within 5 mm of each power pin group. The transceiver reference clock routing must be length-matched within 25 mils between differential pairs. Use the Altera Arria GX board design guidelines (AN-510) as reference.
The 4 multi-gigabit transceivers at 3.125 Gbps require strict signal-integrity practices. Use AC-coupling capacitors (0.01 uF) on each transmit differential pair, located within 50 mm of the FPGA pin. Receive pairs do not require AC-coupling per the Altera reference schematic. Maintain 100 ohm differential impedance with 85 ohm traces if using MicroStrip, or stripline with appropriate via design. Per Altera AN-558, the reference clock jitter must be < 1 ps RMS for proper 3.125 Gbps operation. Recommend using a dedicated low-jitter clock generator such as CDCM61001 or equivalent.
Common pitfalls when designing with EP1AGX20CF484C3: (1) Confusing the C3 speed grade with C6N - C3 is the slowest in the family and may not meet timing for high-frequency DSP designs. (2) Forgetting that the device is NRND - new designs should consider Arria II GX or Cyclone V SoC. (3) Using commercial temperature parts in industrial environments - substitute EP1AGX20CF484I6N for industrial. (4) Forgetting configuration mode pin strapping (MSEL pins must be tied high/low for AS or JTAG mode). (5) Underestimating inrush current at power-up - the device can draw > 2 A surge; use sequenced power rails.
FBGA-484 layout requires careful via-in-pad or dog-bone fanout patterns. For via-in-pad, fill and plate the vias to ensure reliable solder joint formation. Use NSMD (non-solder mask defined) pads with a 0.4 mm diameter for 1.0 mm pitch BGA balls. Recommend at least 4 ground reference layers; the transceiver power (VCCH) and core power (VCCINT) must be isolated to avoid coupling noise. Reference the Altera Arria GX Hardware Reference Manual, Volume 1, for detailed stackup recommendations.
Compliance Information
RoHS/REACH compliance status not explicitly stated in the verified web data; some Altera Arria GX family parts were produced before RoHS was widely adopted. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade ASIC.
