EP1AGX50DF1152I4N - Arria GX FPGA, 50K LE, 1152-BGA | Altera
부품 번호: EP1AGX50DF1152I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205.2 | $102,600.00 |
| 1,000 | $185.25 | $185,250.00 |
EP1AGX50DF1152I4N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O cells are user-configurable after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors: they provide hardware parallelism and deterministic latency for data-path intensive workloads while still allowing in-system reprogramming for bug fixes, feature upgrades, and protocol adaptation. Modern high-end FPGAs like the Arria GX additionally embed hard IP blocks - transceivers, memory controllers, PLLs, and DSP multipliers - that deliver ASIC-class performance while preserving FPGA programmability.
Key features of the EP1AGX50DF1152I4N include eight 3.125 Gbps multi-gigabit transceivers, dedicated DSP blocks for high-throughput arithmetic, distributed and embedded memory for buffer and lookup-table use, and a programmable phase-locked loop (PLL) network for clock synthesis. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, enabling direct connection to DDR/DDR2 memories and a wide range of parallel peripherals. The I4N speed grade and industrial temperature range (-40C to +100C ambient) ensure reliable operation in harsh environments.
Architecturally, the Arria GX device combines a logic fabric built from adaptive logic modules (ALMs), TriMatrix embedded memory blocks (M512, M4K, M-RAM), and dedicated DSP blocks. The integrated transceivers operate over multiple channels at data rates from 600 Mbps to 3.125 Gbps, supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 1152-ball BGA package provides ample routing density for high-speed serial and parallel interfaces on multi-layer PCBs.
Typical applications include high-speed serial protocol bridges, telecom line cards, broadcast video processing, industrial imaging pipelines, and ASIC prototyping. The combination of 3.125 Gbps transceivers, 50K LEs, and a generous I/O budget makes this device well-suited for designs where both parallel processing bandwidth and multiple high-speed serial links are required.
When designing with the EP1AGX50DF1152I4N, allocate sufficient PCB layers to route the 1152-ball BGA fan-out, follow Altera's power distribution network guidelines with multiple decoupling capacitors at each supply pin, and use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. PCB layout should respect 90-ohm differential impedance for the transceiver channels and maintain matched-length traces across all high-speed serial lanes.
This page synthesizes distributor pricing, drop-in Arria GX family alternatives, and practical design notes not found in the Altera datasheet, giving engineers a single source for sourcing and replacement decisions.
드롭인 대체품: EP1AGX50DF1152I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX50DF1152I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Configuration Method, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX50DF1152I6N
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP1AGX50DF1152C5N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1AGX50DF1152C4N
✅ 드롭인✓ 재고 있음
$156.8 / 개
데이터시트 보기 →EP1AGX50DF1152C6N
✅ 드롭인✓ 재고 있음
$270 / 개
데이터시트 보기 →EP1AGX50DF1152
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1AGX50DF1152I4N 최대 정격 & 전기적 특성
| Family | Arria GX |
| Logic Elements (LE) | 50160 |
| User I/O Pins | 514 |
| Embedded Memory | 2475072 bits |
| Transceivers | Up to 3.125 Gbps multi-gigabit transceivers |
| 패키지 | 1152-ball FineLine BGA |
| Speed Grade | I4 |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS Compliant) |
| Configuration Method | Passive serial / Fast passive parallel / JTAG |
EP1AGX50DF1152I4N 1152-ball fineline bga 핀 구성 가이드
EP1AGX50DF1152I4N(1152-ball fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX50DF1152I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX50DF1152I4N 적합 용도: 6 애플리케이션s: High-Speed Serial Protocol Bridge, Telecom Line Card Processing, Broadcast Video Processing, Industrial Imaging Pipeline, ASIC Prototyping Platform, Test and Measurement Instrumentation.
High-Speed Serial Protocol Bridge
The EP1AGX50DF1152I4N is well-suited as a multi-protocol serial bridge between PCI Express, Gigabit Ethernet, and Serial RapidIO. Its eight 3.125 Gbps multi-gigabit transceivers provide one x4 PCIe Gen1 link plus four additional serial channels, while the 50K logic elements and embedded DSP blocks handle protocol conversion and packet processing. According to the Altera Arria GX datasheet, integrating both transceivers and parallel logic on a single device eliminates the need for a companion bridge ASIC, reducing board area and BOM cost. The 1152-ball FineLine BGA package provides sufficient routing density to maintain 90-ohm differential impedance across all serial channels.
추천
Telecom Line Card Processing
In telecom line card applications the EP1AGX50DF1152I4N provides the parallel processing bandwidth required for packet classification, traffic shaping, and backplane interfacing. The 50160 logic elements are sufficient for 10 Gbps line-rate header processing, and the 2.4 Mbit embedded memory supports deep packet buffers and lookup tables. The 514 user I/O pins interface directly to network processors, search engines, and SGMII/SerDes PHYs without external glue logic. The industrial temperature range (I4 grade) and 1152-ball BGA footprint suit both ATCA and proprietary backplane form factors.
추천
Broadcast Video Processing
The EP1AGX50DF1152I4N's 50160 logic elements and embedded DSP blocks make it a strong fit for broadcast video format conversion, scaling, and overlay processing. The 2.4 Mbit embedded memory buffers video frames for pipelined processing, while the 514 user I/O pins drive multiple parallel video buses at HD-SDI and 3G-SDI rates. According to the Arria GX datasheet, dedicated DDR2 controllers interface directly to external frame buffers, eliminating the need for a separate memory controller ASIC. The 3.125 Gbps transceivers also support SDI over fibre for studio camera links.
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Industrial Imaging Pipeline
Industrial machine vision systems use the EP1AGX50DF1152I4N for high-throughput image preprocessing, color space conversion, and feature extraction. The 50K logic elements implement real-time Bayer demosaicing and edge detection, while the embedded DSP blocks accelerate convolution and FFT operations. The 514 user I/O pins connect to multiple Camera Link or CoaXPress cameras, and the integrated transceivers drive gigabit Ethernet to factory networks. Industrial temperature grade (I4) and RoHS compliance suit factory floor deployment.
추천
ASIC Prototyping Platform
The EP1AGX50DF1152I4N serves as a high-density prototyping platform for ASIC designs targeting 100K-200K gate equivalent ASICs. The 50160 logic elements and abundant embedded memory map directly from ASIC RTL through standard synthesis flows, while the 514 user I/O pins expose ASIC I/O for functional testing. According to Altera application notes, the Quartus II design suite supports ASIC prototyping methodologies including design partitioning and time-domain multiplexing. Multiple EP1AGX50 devices can be combined on a prototyping board to validate multi-million-gate ASICs.
추천
Test and Measurement Instrumentation
The EP1AGX50DF1152I4N is used in high-end oscilloscopes, protocol analyzers, and arbitrary waveform generators where its combination of fast transceivers, DSP blocks, and large I/O count enables real-time signal processing. The 50K logic elements implement trigger logic and protocol decoders, the embedded DSP blocks run FFT-based spectrum analysis, and the 514 user I/O drive high-speed ADCs and DACs. The 1152-ball BGA provides the routing density required for analog signal integrity on mixed-signal PCBs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1AGX50DF1152I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX50DF1152I6N | EP1AGX50DF1152C5N | EP1AGX50DF1152C4N | EP1AGX50DF1152C6N | EP1AGX50DF1152 |
|---|---|---|---|---|---|---|
| Package | 1152-ball FineLine BGA | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same | 1152-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | I4 | I6 (faster) | C5 (commercial) | C4 (commercial, slowest) | C6 (commercial, fastest) | Generic - unspecified |
| Logic Elements | 50160 | 50160 | 50160 | 50160 | 50160 | 50160 |
| Embedded Memory | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits |
| User I/O Pins | 514 | 514 | 514 | 514 | 514 | 514 |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | Per speed grade specified at order |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Higher speed grade for tighter timing margins (vs EP1AGX50DF1152I6N)
- Lowest cost in the 1152-ball BGA family (vs EP1AGX50DF1152C4N)
- Industrial temperature range for harsh environments (vs EP1AGX50DF1152C5N)
설계 노트
The 1152-ball FineLine BGA requires a minimum of 10 PCB layers (12 recommended) for clean breakout and routing. Use a 1.0 mm or 1.27 mm ball pitch PCB footprint with microvia-in-pad technology for the inner rows. Maintain 90-ohm differential impedance for all 8 multi-gigabit transceiver channels; per Altera's AN 532 (Arria GX transceiver layout guidelines), trace length matching tolerance should be within 150 mil across a single channel pair. Decoupling capacitor placement: at least one 0.1uF MLCC per VCC pin, plus bulk decoupling (47uF to 220uF) on each power rail within 1 inch of the package.
Estimated: at typical operating conditions (room temperature, moderate toggle rate, 50% I/O usage) the EP1AGX50DF1152I4N consumes approximately 8-12 W from a 1.2 V core supply. Use a synchronous buck regulator with at least 15 A capacity and place it within 2 inches of the FPGA core supply pins. Multiple VCCINT and VCCIO power islands should be powered up in the sequence specified by Altera (typically 3.3 V -> 2.5 V -> 1.8 V -> 1.2 V with 1 ms to 100 ms delay between stages). Failure to follow the power sequencing can cause latch-up and permanent device damage.
Common pitfalls with Arria GX designs include: (1) omitting the external configuration memory or selecting the wrong mode (the EP1AGX50 requires a separate EPCS or enhanced configuration device for AS mode), (2) forgetting to instantiate the altgx megafunction in the Quartus II design before place-and-route will warn of unbound transceiver pins, (3) using LVDS channels without enabling the on-chip termination in the I/O assignment, and (4) not connecting the nCONFIG, nSTATUS, and CONF_DONE pins to the system reset circuit. According to Altera's Arria GX device handbook, all configuration status pins must be pulled up to 3.3 V with 10 kohm resistors to ensure reliable configuration.
규정 준수 정보
RoHS compliant and lead-free (N suffix). Industrial temperature grade (I4). NRND status. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC).
