EP1AGX50DF1152I6N - Arria GX FPGA, 50K LE, 1152-BGA | Intel
부품 번호: EP1AGX50DF1152I6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165.5 | $1,655.00 |
| 100 | $142 | $14,200.00 |
| 500 | $120.75 | $60,375.00 |
| 1,000 | $105 | $105,000.00 |
EP1AGX50DF1152I6N 개요
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks (LABs/CLBs), programmable interconnect, and configurable I/O cells that engineers can reconfigure after manufacture. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit under logic ICs and are used for digital logic prototyping, ASIC replacement, and high-speed signal processing. Arria GX is positioned in Intel's (formerly Altera's) mid-range FPGA portfolio, between the lower-cost Cyclone series and the high-end Stratix series, targeting applications needing integrated transceivers without the power and cost of the top-tier families.
Key features include 2,508 LABs/CLBs, 514 user I/O pins, embedded 18x18 multipliers for DSP, and integrated high-speed transceivers capable of supporting PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and other serial protocols up to 3.125 Gbps. The device also includes dedicated phase-locked loops (PLLs), configuration logic supporting multiple boot modes (AS, PS, JTAG), and on-chip termination for LVDS signaling.
The architecture is built on a SRAM-based lookup table (LUT) fabric with embedded memory blocks (M4K and M512) and DSP blocks for arithmetic-intensive functions. The hard transceiver Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) blocks deliver deterministic serial performance, freeing soft logic for protocol stack and application processing. The 1152-ball BGA package offers a high pin count for the required I/O bandwidth while providing a thermal pad for heat dissipation.
Typical applications include telecom line cards, serial protocol bridges, video broadcast equipment, military/aerospace signal processing, and industrial imaging systems. The integrated transceivers reduce BOM cost for designs that would otherwise require external PHY chips.
When designing with this device, ensure the PCB layout provides adequate power decoupling (multiple low-ESR capacitors near each power pin), a properly designed thermal pad with thermal vias to inner copper planes, and length-matched differential traces for the high-speed serial links. Configuration memory must be loaded at every power-up since SRAM-based FPGAs are volatile.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB design notes not found in the manufacturer datasheet alone, supporting engineers evaluating long-term supply for a part that is approaching end-of-life on Octopart.
드롭인 대체품: EP1AGX50DF1152I6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX50DF1152I6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Configuration Method, Logic Elements (LE).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX50DF1152I5N
✅ 드롭인✓ 재고 있음
$178 / 개
데이터시트 보기 →EP1AGX50DF1152I4N
✅ 드롭인✓ 재고 있음
$185.25 / 개
데이터시트 보기 →EP1AGX50DF1152C6N
✅ 드롭인✓ 재고 있음
$270 / 개
데이터시트 보기 →EP1AGX50DF1152C5N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1AGX50DF1152C4N
✅ 드롭인✓ 재고 있음
$156.8 / 개
데이터시트 보기 →EP1AGX50DF1152
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1AGX50DF1152I6N 최대 정격 & 전기적 특성
| Series | Arria GX |
| Family | Arria GX FPGA |
| Logic Elements (LE) | 50,160 |
| Total Memory Bits | 2,475,072 |
| Number of LABs/CLBs | 2,508 |
| User I/O Count | 514 |
| 패키지 | 1152-BBGA (FineLine BGA) |
| 동작 온도 | -40C to +100C (Industrial, I6 speed grade) |
| Speed Grade | I6 |
| Process Technology | 90 nm |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Configuration Method | SRAM-based, volatile (AS/PS/JTAG) |
| 실장 유형 | Surface Mount |
EP1AGX50DF1152I6N 1152-bbga (fineline bga) 핀 구성 가이드
EP1AGX50DF1152I6N(1152-bbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX50DF1152I6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX50DF1152I6N 적합 용도: 7 애플리케이션s: Telecom Line Card Interface Bridging, Serial RapidIO Switch Fabric, HD-SDI Video Router and Embedder, Military/Aerospace Signal Processor, Industrial Imaging and Machine Vision, PCI Express Gen1 Endpoint Card, Wireless Baseband Modem.
Telecom Line Card Interface Bridging
The EP1AGX50DF1152I6N's integrated 3.125 Gbps transceivers and 514 user I/Os make it ideal for telecom line cards needing protocol bridging between backplane serial links and parallel framer/mapper ASICs. The 50,160 LEs and 2.475 Mbits of embedded memory handle HDLC framing, Ethernet MAC, and packet buffer functions in a single chip, replacing legacy ASIC+FPGA solutions. Place the device between the backplane SERDES lines and the network processor, using dedicated PCS/PMA blocks for each serial channel. Designers benefit from a single-chip BOM but should verify the I6 speed grade meets the timing budget for the chosen protocol.
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Serial RapidIO Switch Fabric
The EP1AGX50DF1152I6N supports Serial RapidIO (SRIO) at 1.25, 2.5, and 3.125 Gbps through its built-in transceivers, making it a flexible RapidIO endpoint or small switch fabric. With 50K LEs the device can implement a 4-port SRIO switch with local packet buffer memory in the 2.475 Mbit block RAMs. The industrial temperature grade (I6, -40C to +100C) supports outdoor or industrial cabinet installations. Use the soft RapidIO IP from Altera to handle logical-layer transactions and traffic management.
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HD-SDI Video Router and Embedder
The Arria GX family is widely used in broadcast video routers for embedding/de-embedding audio in HD-SDI serial streams at 1.485 Gbps, with the EP1AGX50DF1152I6N providing enough logic for 8-12 channel embedder cards. Its 514 I/Os handle SMPTE 259M/292M/424M video I/O alongside AES/EBU audio and GPI control. The dedicated transceiver CDR recovers the embedded clock, while soft logic implements audio shuffling, Dolby E, and metadata insertion. Larger routers use multiple EP1AGX50 parts with cross-point switching in the FPGA fabric.
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Military/Aerospace Signal Processor
The industrial temperature grade and high logic density of the EP1AGX50DF1152I6N suit defense electronics applications such as radar front-end processing, electronic warfare subsystems, and secure communications. With 50K LEs and embedded 18x18 multipliers, the device implements FFT pipelines, channelizers, and digital downconverters in a single chip. Designers targeting military temperature (-55C to +125C) should look at the EP1AGX50Q-prefix SMD part numbers. The 1152-BGA package meets the rugged packaging requirements of MIL-PRF-38535 qualified builds.
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Industrial Imaging and Machine Vision
The EP1AGX50DF1152I6N's combination of 514 user I/Os and built-in transceivers suits high-speed Camera Link, CoaXPress, or GigE Vision frame grabbers used in machine vision systems. The 50K LEs implement image preprocessing pipelines (filtering, thresholding, Bayer conversion) while the transceivers move pixel data at line-rate speeds to the host PC. Industrial temperature operation enables deployment in factory automation cells and outdoor machine vision installations. The volatile SRAM configuration loads at power-up from a parallel flash or EPCS serial configuration device.
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PCI Express Gen1 Endpoint Card
The EP1AGX50DF1152I6N supports PCI Express Gen1 x1, x4, and x8 endpoints through its built-in transceivers and hard PCIe IP block, with 50K LEs available for the application logic. A typical PCIe endpoint card uses the FPGA for DMA engines, protocol processing, and I/O expansion while the integrated PCIe block handles the link layer. This combination removes the need for an external PCIe PHY and PHY-to-FPGA bridge chip. Designers should verify the I6 timing grade meets PCIe Gen1 jitter and latency requirements for their use case.
추천
Wireless Baseband Modem
The EP1AGX50DF1152I6N's 18x18 hardware multipliers and 2.475 Mbit of embedded memory implement PHY-layer baseband processing for small-cell wireless base stations, including turbo decoders, FFT/IFFT blocks, and channel estimation. The 3.125 Gbps transceivers connect to RF front-end ADCs/DACs via CPRI or OBSAI digital interfaces. With 50K LEs, a single FPGA can serve a 2x2 MIMO LTE femtocell PHY. Industrial temperature operation suits outdoor small-cell deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1AGX50DF1152I6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX50DF1152I5N | EP1AGX50DF1152I4N | EP1AGX50DF1152C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA (FineLine BGA) | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same |
| Logic Elements | 50,160 LE | 50,160 LE (identical) | 50,160 LE (identical) | 50,160 LE (identical) |
| Speed Grade | I6 (industrial) | I5 (industrial, faster) | I4 (industrial, fastest) | C6 (commercial, 0C to +85C) |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | 0C to +85C |
| User I/O | 514 | 514 (identical) | 514 (identical) | 514 (identical) |
| Transceiver Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Mid-range Arria GX with 50K LE and built-in 3.125 Gbps transceivers (vs EP1SGX40DF1020C6)
- Industrial temperature grade with 1152-ball BGA (vs EP1AGX50CF484I6N)
- I6 speed grade offers lowest cost among industrial Arria GX 1152-BGA options (vs EP1AGX50DF1152I5N)
설계 노트
Estimated: The 1152-FineLine BGA package dissipates up to ~8W typical for a 50K-LE Arria GX at full utilization. Provide a thermal pad land pattern with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to a continuous copper inner plane. Without thermal vias, junction temperature may exceed 100C ambient ratings. Use the Altera PowerPlay early power estimator in Quartus II before final layout to size the heatsink or forced-air cooling.
Route all high-speed transceiver differential pairs with 100 ohm differential impedance, length matching within 150 mils, and continuous reference plane on layer 2. Use 8 mil trace width with 6 mil spacing on a 4-layer 1 oz board to hit 100 ohm differential. Minimize the number of vias on each RX/TX pair - no more than 2 vias total. Place AC coupling capacitors (0.1 uF) close to the transmitter output pins.
Estimated: EP1AGX50DF1152I6N requires VCCINT (1.2V core for Arria GX 90 nm), VCCPD (3.3V pre-driver), VCCIO (1.5V/1.8V/2.5V/3.3V per bank), and VCCA_PLL (1.2V analog). Place at least 4 decoupling capacitors per supply pin (0.1 uF + 0.01 uF + 10 uF bulk + 220 uF bulk). Use a Ferrite bead on the PLL analog supply to isolate from digital switching noise. Power sequencing requires VCCINT before VCCIO with monotonic rise.
The EP1AGX50DF1152I6N is SRAM-based and volatile - it must reload configuration at every power-up. Use a serial EPCS16 or EPCS64 configuration flash with AS (active serial) mode for low-pin-count boot. For fastest boot use parallel x16 flash with PS (passive serial) or FPP (fast passive parallel). The CONF_DONE pin must be pulled high via 10K resistor to VCCPD, and nSTATUS pulled to 1K pull-up. JTAG header (10-pin or 20-pin Altera format) required for in-system programming.
Obsolescence risk: this part is obsolete as of 2026-09-06 with no authorized franchised stock. Before committing a new design, verify last-time-buy availability from independent distributors and authenticate each shipment (X-ray decapsulation, lot-trace, country-of-origin review). For new designs, evaluate migration paths to Arria 10 (10AX115N3F40I2SG) or Cyclone 10 GX, which require a complete PCB redesign and firmware port to Quartus Prime Pro.
규정 준수 정보
RoHS and lead-free status not explicitly confirmed in verified distributor data as of 2026-09-06. Request compliance documentation from distributor before volume orders. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-qualified part.
