EP1C12F324C7N - Cyclone 12,060 LEs FPGA 324-BGA | Intel / Altera
부품 번호: EP1C12F324C7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $58.22 | $58.22 |
| 10 | $52.4 | $524.00 |
| 100 | $46.5 | $4,650.00 |
| 250 | $41.85 | $10,462.50 |
| 500 | $37.2 | $18,600.00 |
EP1C12F324C7N 개요
What is an FPGA? A Field Programmable Gate Array is a programmable logic device whose architecture consists of an array of configurable logic blocks (LABs), embedded memory, and programmable routing interconnect that the designer configures after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism with full design flexibility. The Cyclone family specifically targets low-cost, high-volume applications where power, density, and price dominate over the highest possible performance.
Key specifications include 1,206 Logic Array Blocks (LABs), 249 maximum user I/O pins, two on-chip PLLs for clock management, and support for external memory interfaces including DDR SDRAM and FCRAM. The 'C7' speed grade delivers up to 320 MHz internal operation, while the 'N' suffix indicates a lead-free, RoHS-compliant package finish.
Architecturally, Cyclone-I devices use 4-input lookup tables (LUTs) per logic element, embedded M4K memory blocks (each 4 Kbit with dual-port capability), and dedicated I/O elements supporting LVTTL, LVCMOS, SSTL, and HSTL standards. Configuration is via active serial (AS), passive serial (PS), or JTAG, allowing in-system reprogrammability for design iteration and field updates.
Typical applications include industrial control and motor drive glue logic, consumer video processing pipelines, low-cost video capture and display bridging, telecom line-card glue logic, and prototype ASIC replacement. The combination of 249 user I/Os and 12,060 LEs is well suited for mid-complexity parallel data paths such as camera sensor aggregation, LVDS-based displays, and protocol bridges.
When designing with the EP1C12F324C7N, plan the PCB layout for the 1.0 mm pitch BGA - escape routing requires via-in-pad or dogbone fan-out and at least 6 PCB layers for clean signal integrity on DDR interfaces. Use Altera / Intel Quartus II (or the latest supported edition) for design capture; verify pinout against the device handbook for your specific configuration scheme.
This page synthesizes real-time distributor inventory, drop-in same-family alternatives, comparison data versus the industrial-temperature 'I7' grade, and practical Quartus II configuration notes not found in a single manufacturer datasheet.
드롭인 대체품: EP1C12F324C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C12F324C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C12F324I7N
✅ 드롭인✓ 재고 있음
$52.1 / 개
데이터시트 보기 →EP1C12F324C8N
✅ 드롭인✓ 재고 있음
$51.75 / 개
데이터시트 보기 →EP1C12F324C6N
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →EP1C12F324C6AA
✅ 드롭인✓ 재고 있음
$36.9 / 개
데이터시트 보기 →EP1C12F324C7
✅ 드롭인✓ 재고 있음
$40.26 / 개
데이터시트 보기 →EP1C12F324C7N 최대 정격 & 전기적 특성
| Series | Cyclone |
| Family | Cyclone I |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Embedded Memory (bits) | 239,616 |
| Maximum User I/O | 249 |
| Number of PLLs | 2 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| 동작 공급 전압 | 1.5 V to 3.3 V |
| Maximum Internal Frequency | 320 MHz |
| Speed Grade | C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C) |
| 패키지 / 케이스 | 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount |
| Configuration Method | AS / PS / JTAG |
| RoHS 상태 | Compliant (N suffix = lead-free) |
EP1C12F324C7N 324-bga (fbga-324, 19 x 19 mm, 1.0 mm pitch) 핀 구성 가이드
EP1C12F324C7N(324-bga (fbga-324, 19 x 19 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1C12F324C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1C12F324C7N 적합 용도: 6 애플리케이션s: Industrial Motor Control Glue Logic, Video Processing and Display Bridging, Telecom Line-Card Glue Logic, Prototype ASIC Replacement, Industrial Sensor Aggregation Hub, Legacy Replacement and Field Spares.
Industrial Motor Control Glue Logic
The EP1C12F324C7N's 12,060 logic elements and 249 user I/O pins make it a strong fit for industrial motor control boards where it acts as glue logic between a microcontroller, gate drivers, and encoder feedback. Two on-chip PLLs generate the precise PWM-aligned clocks needed for multi-axis servo loops, while 239 Kbits of embedded M4K blocks buffer encoder quadrature counters and PWM duty tables without external SRAM. The 324-FBGA package supports enough parallel I/O to handle Hall-sensor inputs, multi-axis step/direction outputs, and CAN or RS-485 transceivers simultaneously. Designers typically place the EP1C12F324C7N between a 32-bit MCU and the power stage, offloading deterministic timing from the MCU and reducing overall firmware complexity.
추천
Video Processing and Display Bridging
With 249 user I/Os and 12,060 LEs, the EP1C12F324C7N can implement mid-complexity video pipelines such as DVI/HDMI-to-LVDS bridges, dual-camera muxing, or video format conversion at rates up to 720p. Embedded M4K blocks serve as line buffers for deinterlacing or chroma resampling, while the dual PLLs generate pixel clocks and shift clocks for parallel RGB or LVDS output. The Cyclone-I fabric supports DDR transfer from external SDRAM at rates sufficient for moving 720p60 pixel data. Reference designs from Altera / Intel show typical implementations pairing this device with a TI DVI receiver and a National Semiconductor LVDS transmitter for monitor-side bridging.
추천
Telecom Line-Card Glue Logic
The EP1C12F324C7N suits telecom line cards where it implements TDM bus aggregation, framer-to-network-processor interfaces, and clock-domain crossing between system and line-side PLLs. Its two PLLs handle independent system and line-rate clock generation, while 239 Kbits of RAM buffer packet headers and lookup tables for small forwarding engines. The 249 user I/Os accommodate multi-PHY serial LVDS connections plus control-plane GPIO for SFP modules and supervisory LEDs. Industrial-temperature screening (via EP1C12F324I7N) is often required for outdoor cabinets.
추천
Prototype ASIC Replacement
Engineers commonly use the EP1C12F324C7N to prototype a fixed ASIC function while preserving the option to migrate to a lower-cost masked device once volumes rise. With 12,060 LEs it can implement mid-sized datapaths, custom state machines, and glue logic sufficient for many ASIC emulation tasks. The 324-FBGA package gives abundant I/O for ASIC-equivalent pin counts, and Quartus II synthesis provides rapid iteration. Once the design stabilizes, designers can either retain the FPGA for low-volume production or migrate to a hardened ASIC.
추천
Industrial Sensor Aggregation Hub
The 249 user I/Os make the EP1C12F324C7N well-suited for aggregating many industrial sensors - thermocouples, strain gauges, encoder quadrature, and digital GPIO - into a single fast bus such as SPI, parallel LVDS, or Ethernet. Embedded M4K blocks store calibration coefficients and run-length-encoded sensor data. The two PLLs generate sample clocks for the sensor front ends. Reference designs use this device paired with 24-bit ADCs and a host MCU running Modbus or EtherCAT.
추천
Legacy Replacement and Field Spares
Because the EP1C12F324C7N is now obsolete, OEMs maintaining deployed systems need either authorized last-time-buy stock or verified drop-in alternatives. The EP1C12F324I7N provides identical functionality in the same 324-FBGA footprint, just with industrial temperature support, making it ideal for field-spare pools covering harsher environments. Sourcing through authorized obsolete-part specialists (Heisener, TrustedParts, FPGAX) ensures traceability and conformance for aerospace and defense sustainment programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C12F324C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C12F324I7N | EP1C12F324C8N | EP1C12F324C6N | EP1C12F324C6AA | EP1C12F324C7 |
|---|---|---|---|---|---|---|
| Package | 324-BGA (FBGA-324, 19x19 mm) | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same | 324-BGA (FBGA-324, 19x19 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| LABs | 1,206 | 1,206 | 1,206 | 1,206 | 1,206 | 1,206 |
| Speed Grade | C7 | I7 (industrial temp, same C7 fMAX bin) | C8 (faster) | C6 (slower) | C6 (military screened) | C7 (non-lead-free) |
| Operating Temperature | Commercial (0C to 85C) | Industrial (-40C to +100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Military / aerospace screened | Commercial (0C to 85C) |
| Lead-Free / RoHS | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (no N suffix, lead-bearing) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Maximum User I/O | 249 | 249 | 249 | 249 | 249 | 249 |
주요 차별점
- Industrial temperature coverage for harsh environments (vs EP1C12F324C7N)
- Faster speed grade for higher fMAX requirements (vs EP1C12F324C7N)
- Military / aerospace screening for high-reliability programs (vs EP1C12F324C7N)
설계 노트
Estimated: the EP1C12F324C7N uses a 324-ball FBGA with 1.0 mm pitch. PCB escape routing requires via-in-pad (VIPPO) or dogbone fan-out. A 6-layer stackup is recommended for clean ground/return paths and to support DDR SDRAM interfaces. Place 0.1 uF decoupling capacitors on every power pin pair (VCCINT, VCCIO) within 3 mm of the package, plus bulk 100 uF tantalum or ceramic capacitors on the 1.5 V and 3.3 V rails. Use a 6- or 8-layer board for designs routing 100+ differential pairs.
Do not confuse the C7 speed grade with the commercial temperature grade - both letters encode different specs. Speed grade 'C7' refers to a specific timing bin, while temperature grade 'C' (in 'C7') means commercial and 'I' (in 'I7') means industrial. Double-check both letters when sourcing substitutes. Also note that some Cyclone-I configuration schemes (especially AS mode) require an external EPCS or EPCQ flash, which must be ordered separately.
Keep LVDS / SSTL differential pairs matched within 0.5 mm of each other across the entire length. Use 100 ohm differential impedance on the PCB stackup and place series-termination resistors as close to the FPGA output balls as possible. For DDR SDRAM interfaces, use 50 ohm single-ended impedance with matched trace lengths (within 25 mils) for byte groups. Add a series 33 ohm resistor on the FPGA clock output to dampen reflections.
규정 준수 정보
N suffix indicates lead-free / RoHS-compliant package per Altera / Intel nomenclature. AEC-Q100 is not applicable to FPGAs. Halogen-free status not stated in available data.
