EP4CE10F17C8N - Cyclone IV E FPGA, 10K LEs, 256-FBGA | Altera
부품 번호: EP4CE10F17C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $26.5 | $26.50 |
| 10 | $24.2 | $242.00 |
| 100 | $21.85 | $2,185.00 |
| 500 | $19.4 | $9,700.00 |
| 1,000 | $17.95 | $17,950.00 |
EP4CE10F17C8N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, the FPGA's logic function, I/O behavior, and routing are defined by a configuration bitstream loaded after manufacture, enabling rapid prototyping and field upgrades. FPGAs sit within the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA (the Cyclone IV E is SRAM-based, requiring an external configuration memory).
Key features include 10,320 LEs, 414 Kbits of embedded memory (M9K blocks), 23 dedicated 18x18 hardware multipliers (~46 GMACs of DSP throughput), four general-purpose PLLs, and 179 user I/Os with support for LVDS, LVTTL, LVCMOS, SSTL, and other single-ended/differential I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks (1.2 V to 3.3 V). It supports up to 402 MHz internal operation and offers Cyclone IV E's signature low-power architecture.
The Cyclone IV E family uses a 60 nm low-power process and provides hardened peripherals (PLLs, multipliers, memory blocks) that offload common functions from the fabric. Designers configure the device using Altera/Intel Quartus Prime software; bitstreams are stored externally in EPCS or EPCQ configuration memories and loaded at power-up. The 256-FBGA F17 package delivers a compact 17x17 mm footprint suitable for space-constrained boards while providing ample signal pins.
Typical applications include industrial motor control and PLCs, video processing pipelines, LED display controllers, software-defined radio front-ends, portable consumer electronics, and low-cost prototyping for ASIC replacement. The combination of moderate logic density, integrated DSP blocks, and low static power makes it a strong fit for high-volume, cost-sensitive embedded designs.
When designing with this device, ensure your power tree supplies the 1.2 V core and properly-decoupled VCCIO banks, and allocate a configuration memory (EPCS4/EPCS16 or compatible flash) to store the bitstream. Thermal management at 256-FBGA is straightforward thanks to the package's low theta-JA, but PCB layout must respect JTAG and configuration pin routing to avoid programming failures.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations beyond the manufacturer datasheet, helping engineers evaluate whether EP4CE10F17C8N fits their cost, performance, and supply-chain constraints.
드롭인 대체품: EP4CE10F17C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE10F17C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Configuration Mode.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE10F17C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CE10F17I8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CE15F17C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CE6F17C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$13.75 / 개
데이터시트 보기 →EP4CE10E22C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$11.1 / 개
데이터시트 보기 →XC6SLX9-2FTG256C
✅ 드롭인✓ 재고 있음
$27.85 / 개
데이터시트 보기 →EP4CE10F17C8N 최대 정격 & 전기적 특성
| Family | Cyclone IV E |
| Logic Elements (LEs) | 10320 |
| Embedded Memory | 423936 bits (414 Kbit) |
| Embedded Multipliers (18x18) | 23 |
| PLLs | 4 |
| Maximum User I/Os | 179 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V |
| Maximum Internal Frequency | 402 MHz |
| Process Technology | 60 nm low-power SRAM |
| 패키지 | 256-FBGA (F17), 17x17 mm |
| Configuration Method | SRAM, requires external EPCS/EPCQ flash |
| 동작 온도 | 0C to +85C (Commercial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP4CE10F17C8N 핀 구성
| 핀 A1 | I/O — User I/O pin (bank 1 or shared, per datasheet) |
| 핀 A2 | I/O — User I/O pin |
| 핀 A3 | I/O — User I/O pin |
| 핀 B1 | I/O — User I/O pin |
| 핀 B2 | GND — Ground |
| 핀 B3 | I/O — User I/O pin |
| 핀 C1 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 C2 | I/O — User I/O pin |
| 핀 C3 | VCCINT — Core supply voltage (1.2 V) |
| 핀 D1 | I/O — User I/O pin |
| 핀 D2 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 D3 | VCCPD — Pre-driver voltage |
| 핀 E1 | GND — Ground |
| 핀 E2 | nCONFIG — Configuration control (active low) |
| 핀 E3 | MSEL0 — Configuration mode select 0 |
| 핀 F1 | DATA0 — Configuration data input |
| 핀 F2 | DCLK — Configuration clock |
| 핀 F3 | nSTATUS — Configuration status (active low) |
| 핀 G1 | TDI — JTAG test data in |
| 핀 G2 | TCK — JTAG test clock |
| 핀 G3 | TMS — JTAG test mode select |
| 핀 H1 | TDO — JTAG test data out |
| 핀 H2 | VCCAUX — Auxiliary analog supply (2.5 V) |
| 핀 H3 | nCE — Chip enable (active low) |
| 핀 J1 | CLK0 — Differential clock input 0 positive |
| 핀 J2 | CLK1 — Differential clock input 1 positive |
| 핀 J3 | VCCA_PLL1 — PLL1 analog supply |
일반적인 애플리케이션
EP4CE10F17C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drive, Video Processing and Display Bridging, Software-Defined Radio Front-End, LED Display and Lighting Controllers, Industrial Communication Protocol Bridges, ASIC Replacement and Rapid Prototyping.
Industrial Motor Control and Drive
The EP4CE10F17C8N's combination of 10,320 logic elements, 23 dedicated 18x18 multipliers, 4 PLLs, and 179 user I/Os makes it well-suited for industrial motor control applications including PMSM, BLDC, and stepper drive loops. The 23 hardware multipliers handle Field-Oriented Control (FOC) math, Park/Clarke transforms, and SVM at 50-100 kHz PWM rates without exhausting fabric DSP resources. Its 402 MHz internal clock headroom supports the high-resolution timing required for 16-bit PWM at switching frequencies above 100 kHz. The F17 256-FBGA package provides 179 I/Os - ample for encoder inputs, Hall sensors, current shunts, gate drivers, and isolated communication. Per Altera's Cyclone IV E reference designs, this device fits AC drives from 100 W to several kW.
추천
Video Processing and Display Bridging
The EP4CE10F17C8N is widely deployed in video format conversion, scaling, and bridging applications such as HDMI-to-LVDS, dual-link DVI receivers, and camera interface aggregation. The 414 Kbit embedded memory (M9K blocks) buffers line-scan video frames at common resolutions up to 1080p60, while the 179 I/Os support parallel RGB, LVDS, and HiSPi camera inputs with margin. Cyclone IV E's low-power architecture benefits thermally constrained display products such as digital signage controllers. Hardware multipliers accelerate color-space conversion and chroma resampling. Designers pair the FPGA with external DDR2/DDR3 memory controllers implemented in the fabric for frame buffering at higher resolutions.
추천
Software-Defined Radio Front-End
For entry-level software-defined radio (SDR) designs, the EP4CE10F17C8N provides 23 18x18 multipliers and four PLLs that handle digital down-conversion, FIR filtering, and quadrature demodulation for HF-to-LMR signals. Its 414 Kbit embedded RAM accommodates multi-tap FIR coefficients and buffer stages for narrowband receivers. The 179 I/Os interface to high-speed ADCs and DACs (e.g., 14-bit, 125 MSPS) using LVDS pairs. Per Altera reference designs, Cyclone IV E SDR receivers handle bandwidths up to ~10 MHz with appropriate ADC/DAC selection. The low-power 60 nm process enables portable SDR applications.
추천
LED Display and Lighting Controllers
The EP4CE10F17C8N's 179 I/Os and 23 multipliers are ideal for driving large LED video walls, architectural lighting fixtures, and pixel-addressable RGB strips. Each multiplier handles per-channel PWM dimming, color-space conversion, and gamma correction for 16-bit color depth at refresh rates above 1 kHz. The 414 Kbit embedded RAM buffers pixel data for full HD display panels. According to Altera's Cyclone IV E reference designs, the FPGA drives up to 8 parallel HUB75 RGB-LED chains from a single device. The F17 256-FBGA package provides the I/O count needed for multi-port LED matrix interfaces.
추천
Industrial Communication Protocol Bridges
The EP4CE10F17C8N implements industrial fieldbus bridges such as EtherCAT, PROFINET, Modbus TCP, CANopen, and EtherNet/IP in fabric logic, leveraging its 4 PLLs for clock generation and 179 I/Os for parallel PHY/MAC connectivity. The 23 hardware multipliers accelerate CRC, hash, and AES-128 security algorithms used in industrial cybersecurity stacks. Per Cyclone IV E datasheet performance figures, the device handles a single PROFINET IRT or EtherCAT slave controller with margin. The compact 17x17 mm F17 package suits DIN-rail-mounted industrial controllers with strict space constraints.
추천
ASIC Replacement and Rapid Prototyping
The EP4CE10F17C8N serves as a high-volume cost-down replacement for small ASICs in products such as smart sensors, IoT edge nodes, and consumer peripherals. Designers convert ASIC RTL to Quartus Prime HDL and validate the same firmware in production volumes, avoiding the multi-million-dollar NRE of a custom ASIC. The 10,320 LEs and 414 Kbit memory handle typical glue logic, sensor fusion, and low-bandwidth DSP tasks. Per the Cyclone IV E product brief, this device is the lowest-density entry point for replacing legacy Altera Cyclone III designs in active products.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE10F17C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE10F17C7N | EP4CE10F17I8N | EP4CE15F17C8N | EP4CE6F17C8N | XC6SLX9-2FTG256C |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (F17), 17x17 mm | 256-FBGA (F17) - same | 256-FBGA (F17) - same | 256-FBGA (F17) - same | 256-FBGA (F17) - same | 256-FBGA (FTG256) - same footprint category |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Xilinx (AMD) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 15,408 | 6,272 | 9,152 (logic cells) |
| Embedded Memory | 414 Kbit | 414 Kbit | 414 Kbit | 504 Kbit | 270 Kbit | 576 Kbit |
| Embedded Multipliers (18x18) | 23 | 23 | 23 | 56 | 15 | 16 |
| PLLs | 4 | 4 | 4 | 4 | 2 | 2 (CMTs) |
| Maximum User I/Os | 179 | 179 | 179 | 179 | 179 | 186 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C8 (commercial, fastest) | C7 (commercial) | I8 (industrial) | C8 (commercial) | C8 (commercial) | -2 (Xilinx speed grade) |
주요 차별점
- Higher multiplier count than Xilinx Spartan-6 LX9 (vs XC6SLX9-2FTG256C)
- Family-wide 256-FBGA F17 PCB layout reuse (vs EP4CE6F17C8N / EP4CE15F17C8N)
- Wide temperature grade variant available (vs XC6SLX9-2FTG256C)
설계 노트
The EP4CE10F17C8N requires four distinct power rails: VCCINT (1.15-1.25 V, typically 1.2 V) for core logic, VCCIO (1.2-3.3 V per bank) for I/O, VCCPD (2.5 V or 3.3 V) for pre-drivers, and VCCAUX/VCCA_PLL (2.5 V) for PLLs and configuration. Per Altera's Cyclone IV E pin connection guidelines, all VCC pins must be decoupled with 0.1 uF and 10 uF capacitors placed as close as possible to the package balls. Designers should follow Altera's recommended power-up sequencing: VCCINT ramps first, then VCCIO, then VCCPD, with monotonic ramp-up to avoid device latch-up. Estimated: at full fabric utilization (~80% LEs, 100% multipliers), dynamic current on VCCINT can exceed 800 mA - budget 1.5 A headroom.
The 256-FBGA F17 package has a 1.0 mm ball pitch, requiring microvia or via-in-pad PCB technology for escape routing. Per Altera's Cyclone IV E hardware documentation, designers should use a 4-6 layer PCB stack-up with dedicated ground and power planes. All eight VCCIO bank supplies must be individually decoupled and isolated to prevent simultaneous-switching-output (SSO) noise. For high-speed LVDS interfaces, route 100 ohm differential pairs with matched lengths (within 20 mils) and maintain 3W spacing from adjacent signals. Thermal relief is provided through the package's center ball grid, which is internally connected to ground - ensure solid thermal vias to the inner ground plane.
Three pitfalls commonly cause EP4CE10F17C8N bring-up failures. (1) Missing external configuration memory: the FPGA cannot self-configure from internal flash, so an EPCS4, EPCS16, EPCQ16, or compatible serial flash must be wired to MSEL/DATA0/DCLK/nCONFIG/nSTATUS pins. (2) Incorrect MSEL pin strapping: MSEL0/MSEL1 must be set per the desired configuration mode (AS standard, AS fast, AP, FPP) - default is often wrong for production. (3) JTAG chain conflicts: if multiple Altera devices share TDI/TDO, the chain must be terminated correctly or programming will fail silently. Per Altera application note AN-370, designers should always test the JTAG chain with a known-good bitstream before attempting AS configuration.
Place the configuration flash (EPCS/EPCQ) within 100 mm of the FPGA's DATA0 and DCLK pins to meet signal-integrity margins. Route DCLK and DATA0 as a length-matched pair (within 50 mils) and keep them isolated from switching signals with 3W spacing. For applications using the FPGA's PLL outputs as high-speed clocks, place clock-generating pins adjacent to their destination loads to minimize jitter accumulation. Per Altera's Cyclone IV E device handbook, dual-purpose configuration pins (e.g., nCEO, nCETO) can be repurposed as user I/O after configuration - leave them accessible for in-system updates and debugging.
규정 준수 정보
RoHS and lead-free compliant per Altera product page for the F17 package. Standard part is commercial temperature; industrial/automotive grades (EP4CE10F17I8N/EP4CE10F17A7N) are AEC-Q100 qualified where applicable.
