Altera

EP1C3T10017N - 2,910 LEs Cyclone FPGA, TQFP-100 | Intel / Altera

부품 번호: EP1C3T10017N ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
1.5 V Vdss TQFP-100 (14x14 mm, 1.0 mm pitch) Package -7 (industrial, commercial temp) Speed
시작가 $9.6 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-06
볼륨 가격
수량 단가 합계
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.85 $1,385.00
500 $11.4 $5,700.00
1,000 $9.6 $9,600.00
ℹ️ 모든 가격은 USD 기준입니다

EP1C3T10017N 개요

The Intel (formerly Altera) EP1C3T10017N is a low-cost Cyclone FPGA from the first-generation Cyclone family, featuring 2,910 logic elements, 58,848 bits of embedded RAM, and a single global PLL in a 100-pin TQFP package. The "17" speed grade and "N" suffix indicate a commercial-temperature, lead-free, industrial-grade part with typical -7 speed characteristics, supporting clock rates suitable for glue-logic, custom peripheral bridging, and modest DSP pipelines.

The Cyclone family is Intel's first SRAM-based, low-cost FPGA architecture, positioned in the broader taxonomy as FPGA -> programmable logic device -> logic IC -> integrated circuit. Cyclone devices were introduced in 2002 to address cost-sensitive ASIC replacement and are typically used where logic density in the 2K-20K LE range is sufficient but a microcontroller lacks flexibility. Cyclone FPGAs are fabricated on a 0.13-micron CMOS process with a 4-input look-up table (LUT) based logic element, embedded M4K RAM blocks, and dedicated I/O structures supporting LVTTL, LVCMOS, PCI, and other common single-ended standards.

Key features of the EP1C3T10017N include 2,910 LEs, 13 embedded M4K RAM blocks (58,848 total RAM bits), one PLL providing clock multiplication, division, and phase shifting, and up to 65 user I/O pins across 4 I/O banks. The device supports configuration via passive serial (PS), active serial (AS) with an Altera configuration device, or JTAG. The TQFP-100 (1.0 mm pitch, 14x14 mm body) package enables low-cost PCB assembly on standard FR-4 substrates without the need for advanced HDI stack-ups.

The Cyclone LE architecture combines a 4-input LUT with a configurable register, allowing each LE to implement either combinational logic or a flip-flop. Embedded multiplier blocks (in larger Cyclone variants) and the distributed M4K memory blocks provide on-chip storage for FIFO buffers, look-up tables, and small data caches. The single PLL block supports output frequencies up to several hundred MHz and can deskew external clocks, generate multiple phase-related domains, or compensate for board-level skew.

Typical applications for the EP1C3T10017N include consumer-electronics glue logic, custom interface bridging (I2C/SPI/UART expansion, LCD/LED display controllers), industrial control and sensor aggregation, low-cost prototyping for ASIC replacement, education kits, and legacy system maintenance. Designers often select the EP1C3 for its combination of small footprint, low unit cost, and compatibility with the mature Quartus II design toolchain.

When designing with the EP1C3T10017N, pay careful attention to I/O bank voltage compatibility - the device supports separate VREF and VCCIO rails per bank, but mixing 3.3V and 5V TTL inputs on the same bank without proper VCCIO selection can cause long-term reliability issues. Use Quartus II 13.0sp1 or earlier for legacy support, or migrate to a Cyclone IV or Cyclone 10 LP device for new designs.

This page consolidates distributor pricing, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, helping procurement and FPGA engineers evaluate the EP1C3T10017N for both new and legacy designs.

드롭인 대체품: EP1C3T10017N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP1C3T10017N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Speed Grade, Operating Temperature, Process Technology.

Intel
Package: TQFP-100 (100-TQFP)
Speed Grade: -6 (C6)
Operating Temperature: 0 C to +85 C (commercial)
비교 대상: EP1C3T10017N →
Altera
Package: 100-pin TQFP
RoHS Status: Compliant
Speed Grade: 6
비교 대상: EP1C3T10017N →
Intel
Package: TQFP-100 (100-pin Thin Quad Flat Pack), 16 x 16 mm, 0.5 mm pitch
RoHS Status: Compliant (lead-free, 'N' suffix)
Operating Temperature: 0C to +85C (Commercial)
비교 대상: EP1C3T10017N →
Altera
Package: 100-pin TQFP (1.0 mm pitch)
Process Technology: 0.13 µm SRAM
비교 대상: EP1C3T10017N →
Intel
Package: 100-TQFP (T100)
RoHS Status: Non-compliant (Pb-containing package, per DigiKey listing)
Speed Grade: 7
비교 대상: EP1C3T10017N →
Intel
Package: 144-LQFP (TQFP-144)
RoHS Status: Compliant
Speed Grade: 7
비교 대상: EP1C3T10017N →
Altera
RoHS Status: Compliant (inferred from lead-free N finish)
Speed Grade: C8 (speed grade 8)
비교 대상: EP1C3T10017N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP1C3T100C8N

✅ 드롭인
Intel
📦 TQFP-100
Cyclone · 2,910 · 291 · 59,904 · 13 x M4K (4 Kbit each) · 65 · 1 · 275 MHz

✓ 재고 있음

$14.2 / 개

데이터시트 보기 →

EP1C3T100I7N

✅ 드롭인
Intel
📦 TQFP-100
Cyclone I · EP1C3 · 2,910 · 291 · 59,904 · 13 · 13 · 1

✓ 재고 있음

$13.85 / 개

데이터시트 보기 →

EP1C3T144I7N

✅ 드롭인 ⚠️ 사양 미검증
Intel
📦 TQFP-144
Cyclone · 2910 · 59904 · 291 · 104 · 13 · 1 · 1.5 V

✓ 재고 있음

$55.8 / 개

데이터시트 보기 →

EP1C3T100C6N

✅ 드롭인 ⚠️ 사양 미검증
Altera
📦 TQFP-100
Cyclone · 2,910 · 59,904 · 13 · 1 · 65 · 100-pin TQFP · Surface Mount

✓ 재고 있음

$13.5 / 개

데이터시트 보기 →

EP1C4F324C8N

✅ 드롭인 ⚠️ 사양 미검증
Altera
📦 FBGA-324
Cyclone · FPGA · 4000 · 400 · 78336 · 249 · 1.5 V

✓ 재고 있음

$14.2 / 개

데이터시트 보기 →

EP1C3T10017N 최대 정격 & 전기적 특성

Family Cyclone
Logic Elements 2,910 LEs
Embedded RAM 58,848 bits (13 M4K blocks)
PLLs 1
Maximum User I/O 65
패키지 TQFP-100 (14x14 mm, 1.0 mm pitch)
Speed Grade -7 (industrial, commercial temp)
동작 온도 0C to +85C (commercial, N suffix)
Process Technology 0.13-micron SRAM CMOS
Supply Voltage (Core) 1.5 V
Configuration Modes PS, AS, JTAG
실장 유형 Surface Mount
MSL 레벨 3 (168 hours)
RoHS 상태 Compliant (lead-free N suffix)
Lead-Free Yes (N suffix)

EP1C3T10017N 핀 구성

TQFP-100 Package Pinout Diagram TQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 TQFP-100
핀 1 I/O — User I/O pin (bank 1)
핀 2 I/O — User I/O pin (bank 1)
핀 3 I/O — User I/O pin (bank 1)
핀 4 I/O — User I/O pin (bank 1)
핀 5 VCCIO1 — I/O bank 1 supply voltage
핀 6 I/O — User I/O pin (bank 1)
핀 7 I/O — User I/O pin (bank 1)
핀 8 I/O — User I/O pin (bank 1)
핀 9 I/O — User I/O pin (bank 1)
핀 10 I/O — User I/O pin (bank 1)
핀 11 GND — Ground
핀 12 I/O — User I/O pin (bank 2)
핀 13 I/O — User I/O pin (bank 2)
핀 14 I/O — User I/O pin (bank 2)
핀 15 I/O — User I/O pin (bank 2)
핀 16 VCCINT — Core supply voltage (1.5 V)
핀 17 I/O — User I/O pin (bank 2)
핀 18 I/O — User I/O pin (bank 2)
핀 19 I/O — User I/O pin (bank 2)
핀 20 I/O — User I/O pin (bank 2)
핀 21 GND — Ground
핀 22 I/O — User I/O pin (bank 2)
핀 23 I/O — User I/O pin (bank 2)
핀 24 I/O — User I/O pin (bank 2)
핀 25 I/O — User I/O pin (bank 2)
핀 26 VCCIO2 — I/O bank 2 supply voltage
핀 27 I/O — User I/O pin (bank 2)
핀 28 I/O — User I/O pin (bank 2)
핀 29 I/O — User I/O pin (bank 2)
핀 30 I/O — User I/O pin (bank 2)
핀 31 GND — Ground
핀 32 I/O — User I/O pin (bank 3)
핀 33 I/O — User I/O pin (bank 3)
핀 34 I/O — User I/O pin (bank 3)
핀 35 I/O — User I/O pin (bank 3)
핀 36 VCCIO3 — I/O bank 3 supply voltage
핀 37 I/O — User I/O pin (bank 3)
핀 38 I/O — User I/O pin (bank 3)
핀 39 I/O — User I/O pin (bank 3)
핀 40 I/O — User I/O pin (bank 3)
핀 41 GND — Ground
핀 42 I/O — User I/O pin (bank 3)
핀 43 I/O — User I/O pin (bank 3)
핀 44 I/O — User I/O pin (bank 3)
핀 45 I/O — User I/O pin (bank 3)
핀 46 VCCINT — Core supply voltage (1.5 V)
핀 47 I/O — User I/O pin (bank 3)
핀 48 I/O — User I/O pin (bank 3)
핀 49 I/O — User I/O pin (bank 3)
핀 50 I/O — User I/O pin (bank 3)
핀 51 GND — Ground
핀 52 I/O — User I/O pin (bank 4)
핀 53 I/O — User I/O pin (bank 4)
핀 54 I/O — User I/O pin (bank 4)
핀 55 I/O — User I/O pin (bank 4)
핀 56 VCCIO4 — I/O bank 4 supply voltage
핀 57 I/O — User I/O pin (bank 4)
핀 58 I/O — User I/O pin (bank 4)
핀 59 I/O — User I/O pin (bank 4)
핀 60 I/O — User I/O pin (bank 4)
핀 61 GND — Ground
핀 62 I/O — User I/O pin (bank 4)
핀 63 I/O — User I/O pin (bank 4)
핀 64 I/O — User I/O pin (bank 4)
핀 65 I/O — User I/O pin (bank 4)
핀 66 VCCINT — Core supply voltage (1.5 V)
핀 67 I/O — User I/O pin (bank 4)
핀 68 I/O — User I/O pin (bank 4)
핀 69 I/O — User I/O pin (bank 4)
핀 70 I/O — User I/O pin (bank 4)
핀 71 GND — Ground
핀 72 I/O — User I/O pin (bank 1)
핀 73 I/O — User I/O pin (bank 1)
핀 74 I/O — User I/O pin (bank 1)
핀 75 I/O — User I/O pin (bank 1)
핀 76 VCCIO1 — I/O bank 1 supply voltage
핀 77 I/O — User I/O pin (bank 1)
핀 78 I/O — User I/O pin (bank 1)
핀 79 I/O — User I/O pin (bank 1)
핀 80 I/O — User I/O pin (bank 1)
핀 81 GND — Ground
핀 82 CLK0 — Dedicated clock input 0 (PLL reference)
핀 83 CLK1 — Dedicated clock input 1
핀 84 nCONFIG — Configuration control (active-low)
핀 85 nSTATUS — Configuration status (active-low)
핀 86 CONF_DONE — Configuration done indicator
핀 87 DCLK — Configuration clock
핀 88 DATA0 — Configuration data input
핀 89 MSEL0 — Configuration mode select 0
핀 90 MSEL1 — Configuration mode select 1
핀 91 TDI — JTAG test data input
핀 92 TMS — JTAG test mode select
핀 93 TCK — JTAG test clock
핀 94 TDO — JTAG test data output
핀 95 VCCINT — Core supply voltage (1.5 V)
핀 96 I/O — User I/O pin (bank 1)
핀 97 I/O — User I/O pin (bank 1)
핀 98 I/O — User I/O pin (bank 1)
핀 99 I/O — User I/O pin (bank 1)
핀 100 I/O — User I/O pin (bank 1)

일반적인 애플리케이션

EP1C3T10017N 적합 용도: 6 애플리케이션s: Legacy Industrial Glue Logic Replacement, Custom LCD / LED Display Controller, Sensor Aggregation and Data Pre-Processing, Legacy Communication Protocol Bridge, Education and FPGA Training Boards, Low-Cost ASIC Replacement for Consumer Electronics.

🏭

Legacy Industrial Glue Logic Replacement

The EP1C3T10017N is well suited as a drop-in replacement in legacy industrial control boards where a CPLD or small ASIC originally performed glue-logic functions such as address decoding, bus arbitration, and interrupt steering. With 2,910 LEs and 65 user I/O pins, the device can absorb both the combinational glue logic and small state machines previously split across a CPLD plus a discrete logic gate array. Designers can implement custom peripheral expansion (additional UART, SPI, or I2C controllers) without changing the host processor or PCB layout. The TQFP-100 footprint with 0.5 mm pitch supports hand-rework and visual inspection during field repairs. Combined with its commercial temperature range and Cyclone I maturity, the EP1C3T10017N extends the service life of installed industrial equipment.

📺

Custom LCD / LED Display Controller

The EP1C3T10017N's 13 M4K RAM blocks totaling 58,848 bits are ideal for frame-buffer storage and character-generator ROMs in custom LCD or LED matrix display controllers. Each M4K block can be configured as dual-port RAM, allowing the host processor to update the display buffer via one port while the FPGA reads pixel data through the other port, freeing the host CPU from refresh duties. The 4-input LUT architecture efficiently implements font ROMs and small character-rendering state machines in just a few hundred LEs. The TQFP-100 package exposes up to 65 user I/O, sufficient to drive 8-bit RGB panels plus control signals. Commercial temperature grade is adequate for indoor kiosk and instrumentation displays.

🧩

Sensor Aggregation and Data Pre-Processing

With 2,910 LEs and 65 I/O pins, the EP1C3T10017N serves as a multi-sensor aggregator in environmental monitoring and building automation systems, collecting data from SPI, I2C, and analog-front-end devices and presenting a unified interface to the host processor. The 13 M4K RAM blocks provide 58,848 bits of FIFO buffering for burst data from accelerometers, temperature sensors, and humidity sensors, allowing the host CPU to wake only periodically. The single PLL can generate multiple clock domains for sensors with different sampling rates (1 kHz temperature, 100 Hz humidity, 10 kHz vibration). The TQFP-100 package enables compact PCB integration in sensor hubs, and commercial temperature range is sufficient for indoor and protected-outdoor installations.

🌐

Legacy Communication Protocol Bridge

The EP1C3T10017N is commonly used as a protocol-conversion bridge between mismatched industrial buses (RS-232 to RS-485, UART to SPI, parallel to I2C), a function too complex for a CPLD but well within the Cyclone I's capability. With 2,910 LEs, designers can implement multi-channel UARTs with hardware flow control, plus a state machine to coordinate bus turnaround and arbitration - tasks that would otherwise require a microcontroller and custom firmware. The 65 user I/O support simultaneous multiple bus interfaces (e.g., 4x UART + 2x SPI + 1x I2C) without external mux logic. TQFP-100 with 0.5 mm pitch supports both automated assembly and field replacement in legacy telecom or industrial networking equipment.

🖥️

Education and FPGA Training Boards

The EP1C3T10017N's combination of low unit cost, 2,910 LE capacity, 100-pin TQFP hand-solderable package, and mature Quartus II toolchain support makes it a classic teaching vehicle in university digital-logic and computer-architecture courses. Students can implement simple RISC processors, UART controllers, VGA drivers, and VGA-pattern generators entirely within 2,910 LEs, exposing the boundary between firmware and hardware description. The TQFP-100 footprint on 0.5 mm pitch is forgiving of student hand-soldering compared to BGA alternatives, and the commercial temperature range is appropriate for indoor lab environments. Quartus II 13.0sp1 remains freely available for educational download, preserving a low-cost entry path for FPGA pedagogy.

📱

Low-Cost ASIC Replacement for Consumer Electronics

The EP1C3T10017N originated as a low-cost ASIC alternative for consumer products like set-top boxes, DVD players, and digital cameras where fixed-function silicon was uneconomical at low volumes. Today, the same logic capacity and TQFP-100 footprint serve as a maintenance-part supply for installed consumer products and as a rapid-prototyping platform for derivative designs. Designers can implement custom video-processing pipelines, audio mixing, or user-interface controllers in 2,910 LEs with 13 M4K RAM blocks providing frame and audio buffer storage. The single PLL generates pixel-clock and audio-clock domains from a common reference. Commercial temperature range is appropriate for indoor consumer environments, and the Cyclone I roadmap remains supported for legacy consumer designs through 2026.

추천 제품 요약

EP1C3T100C8N Intel 사용처: Legacy Industrial Glue Logic Replacement, Education and FPGA Training Boards EP1C3T100I7N Intel 사용처: Legacy Industrial Glue Logic Replacement, Sensor Aggregation and Data Pre-Processing EPCQ16ASI8N Altera 사용처: Legacy Industrial Glue Logic Replacement EP4CE6E22C8N Intel 사용처: Custom LCD / LED Display Controller, Low-Cost ASIC Replacement for Consumer Electronics EPCS4SI8N Altera EPCS configuration flash for Cyclone bitstream storage 사용처: Custom LCD / LED Display Controller, Education and FPGA Training Boards 10CL006YU256I7G Intel 사용처: Custom LCD / LED Display Controller EP1C12Q240I7N Intel 사용처: Sensor Aggregation and Data Pre-Processing EPCS64SI16N Higher-density configuration flash for designs with large bitstreams 사용처: Sensor Aggregation and Data Pre-Processing EP1C6Q240I7N Altera 사용처: Legacy Communication Protocol Bridge MAX3232CPE RS-232 line driver for legacy serial bridge applications 사용처: Legacy Communication Protocol Bridge MAX3485ESA RS-485 transceiver for industrial bus interfaces 사용처: Legacy Communication Protocol Bridge 10CL025YU256I8G Modern Cyclone 10 LP for updated coursework 사용처: Education and FPGA Training Boards EP1C3T144I7N Intel 사용처: Low-Cost ASIC Replacement for Consumer Electronics EPCQ4ASI8N Modern configuration flash for new bitstream storage 사용처: Low-Cost ASIC Replacement for Consumer Electronics
What is the logic element count of the EP1C3T10017N?
The EP1C3T10017N contains 2,910 logic elements (LEs) according to the Altera Cyclone device handbook. Each LE consists of a 4-input look-up table (LUT) and a programmable flip-flop, providing the fundamental building block for combinational and sequential logic. This places the device at the low-density end of the Cyclone family, suitable for glue logic and small peripheral bridges.
Is the EP1C3T10017N still in production?
The EP1C3T10017N is classified as Not Recommended for New Designs (NRND) by Intel / Altera. The first-generation Cyclone family was succeeded by Cyclone II, Cyclone III/IV, and the current Cyclone 10 LP family. Per Intel product change notifications, the EP1C3T10017N is available for existing designs and legacy maintenance, but new product developments should migrate to a Cyclone IV or Cyclone 10 LP equivalent.
What package does the EP1C3T10017N use and what is the pin pitch?
The EP1C3T10017N is housed in a 100-pin TQFP (Thin Quad Flat Pack) package with a 14x14 mm body and 0.5 mm pin pitch (TQFP-100). This is a low-cost surface-mount package compatible with standard FR-4 PCB fabrication and visual soldering inspection, unlike fine-pitch BGAs which require HDI stack-ups and X-ray inspection.
How many user I/O pins does the EP1C3T10017N provide?
The EP1C3T10017N provides up to 65 user I/O pins across 4 I/O banks, per the Cyclone device handbook. Not all 100 package pins are user I/O - the remainder are dedicated configuration, clock, JTAG, power, and ground pins. The actual usable I/O count in your design depends on which configuration scheme and clock pins you select.
Where can I download the EP1C3T10017N datasheet PDF?
The EP1C3T10017N datasheet is part of the Altera Cyclone Device Handbook, available from the Altera / Intel literature archive. The Cyclone family handbook (document number cyc_c51007) covers all EP1C3 variants including the TQFP-100 package. Quartus II design software 13.0sp1 or earlier is required for compilation, as newer Quartus versions dropped Cyclone I support.
What is the embedded memory capacity of the EP1C3T10017N?
The EP1C3T10017N includes 58,848 bits of embedded RAM organized as 13 M4K blocks, where each M4K block is 4 Kbits (4608 bits usable data plus parity). These blocks can be configured as single-port RAM, dual-port RAM, ROM, or FIFO buffers, making the device suitable for small data buffers, register files, and look-up tables in custom state machines.
EP1C3T10017N vs EP1C6 - which should I use for a new design?
For new designs in 2026, choose the Cyclone IV EP4CE6 or Cyclone 10 LP 10CL006 over the EP1C3, since the EP1C3 is NRND. The EP1C6 has 6,272 LEs (more than 2x the EP1C3) in a compatible TQFP-144 package. Choose the EP1C3T10017N only when maintaining existing legacy hardware where PCB rework is not feasible, and budget for long-term obsolescence risk.
What is the price of the EP1C3T10017N as of 2026-09-06?
As of 2026-09-06, the EP1C3T10017N lists for approximately $18.50 in single-unit quantities through authorized distributors, dropping to about $9.60 at the 1000-piece break per Octopart aggregator data. Pricing for legacy Cyclone I parts has risen in 2024-2026 due to NRND status and shrinking authorized-channel stock; budget accordingly or migrate to Cyclone 10 LP.
Where to buy the EP1C3T10017N online with short lead time?
The EP1C3T10017N is stocked at IC-Components, Jotrin Electronics, Ariat-Tech, VEKEMO, and Augswan per September 2026 distributor listings. Lead time at authorized channels varies from 4-8 weeks due to NRND status. For shorter lead times, contact independent distributors or consider the EP1C3T100I7N industrial-temperature variant if your application allows the temperature range.
What is the best drop-in replacement for the EP1C3T10017N?
The closest drop-in replacement within the Cyclone family is the EP1C3T100C8N, which shares the TQFP-100 package and pinout but with a different speed grade. For functional replacement with more headroom, the Cyclone IV EP4CE6E22C8N or Cyclone 10 LP 10CL006YU256I7G offers 6,272 LEs but requires PCB rework due to a different package. Verify pinout against the datasheet before substitution.
Does the EP1C3T10017N support DDR or LVDS signaling?
The EP1C3T10017N supports LVTTL, LVCMOS, PCI, and SSTL I/O standards through its 4 I/O banks, but does not support LVDS or DDR memory interfaces directly. The single PLL block provides clock conditioning up to several hundred MHz, suitable for source-synchronous interfaces at moderate speeds. For high-speed DDR memory or LVDS, migrate to Cyclone IV or later families.
What is the difference between EP1C3T100 and EP1C3T144 versions?
The EP1C3T100 is housed in a TQFP-100 package with up to 65 user I/O pins, while the EP1C3T144 uses a TQFP-144 package with up to 104 user I/O pins. Both share the same 2,910 LEs, 58,848 RAM bits, and single PLL - the package difference is the only change. Choose TQFP-100 for compact designs and TQFP-144 when you need more I/O bandwidth.
Can Quartus II program the EP1C3T10017N?
Yes, the EP1C3T10017N is supported by Quartus II versions 1.0 through 13.0sp1. Intel discontinued Cyclone I support in Quartus Prime 14.0 and later, so legacy designs should pin their toolchain to Quartus II 13.0sp1. For new development using Cyclone I devices, the open-source yosys + nextpnr flow also supports the EP1C3 with community-maintained bitstream tools.
Is the EP1C3T10017N suitable for automotive AEC-Q100 applications?
The EP1C3T10017N is rated for commercial temperature (0C to +85C) and is not AEC-Q100 qualified. For automotive designs, the EP1C3T100I7N industrial variant (-40C to +100C) is more appropriate, or migrate to a Cyclone IV automotive-grade device such as the EP4CE22E22I7N which is AEC-Q100 qualified. Consult the Intel product change notification PCN-2018 for full automotive roadmap.

엔지니어링 참조 데이터: EP1C3T10017N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP1C3T10017N when you need a low-cost FPGA in a hand-solderable TQFP-100 package for legacy product maintenance, education, or small-volume designs where the 2,910 LE capacity is sufficient. Choose the EP1C3T100I7N for industrial temperature (-40C to +100C) deployments such as outdoor sensor hubs or factory-floor equipment. Choose the EP1C3T100C8N if your design does not require the -7 speed grade and you want the lowest unit cost. Choose the EP1C3T144I7N when you need more than 65 user I/O pins. For new product designs in 2026, migrate to a Cyclone IV EP4CE6E22C8N or Cyclone 10 LP 10CL006YU256I7G, both of which are active in production with longer lifecycle support and modern feature sets including embedded multipliers and larger memory.

대체품과의 비교

파라미터 이 제품 EP1C3T100C8N EP1C3T100I7N EP1C3T144I7N EP1C3T100C6N EP1C4F324C8N
Package TQFP-100 TQFP-100 - same TQFP-100 - same TQFP-144 - different TQFP-100 - same FBGA-324 - different
Brand Altera Altera Altera Altera Altera Altera
Logic Elements 2,910 LEs 2,910 LEs 2,910 LEs 2,910 LEs 2,910 LEs 4,000 LEs (+37%)
Embedded RAM 58,848 bits 58,848 bits 58,848 bits 58,848 bits 58,848 bits 78,336 bits
Maximum User I/O 65 65 65 104 65 249
Speed Grade -7 -8 (-12% slower) -7 (same) -7 (same) -6 (faster) -8
Operating Temperature 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C (industrial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial)
Lifecycle Status NRND NRND NRND NRND NRND NRND

주요 차별점

  • TQFP-100 with 65 user I/O - largest I/O in the EP1C3 family at lowest package cost (vs EP1C3T144I7N)
  • Commercial temperature grade at lower cost than industrial -7 variant (vs EP1C3T100I7N)
  • Single PLL sufficient for moderate clock-domain designs without complexity overhead (vs EP1C4F324C8N)

설계 노트

The EP1C3T10017N requires a stable 1.5 V core supply (VCCINT) and separate VCCIO rails for each I/O bank. Decoupling requires at least one 100 uF bulk capacitor per rail plus 0.1 uF and 0.01 uF high-frequency ceramics placed within 5 mm of each VCCINT and VCCIO pin pair. During configuration, the nCONFIG pin must be held low for at least 2 us after VCCINT ramps past the POR threshold; failure to meet this timing causes configuration failure and a nSTATUS low signal. Per the Cyclone device handbook, the ramp rate of VCCINT should be between 0.5 V/ms and 100 V/ms for reliable POR behavior.

The TQFP-100 package with 0.5 mm pin pitch requires 4-layer PCB stack-up for signal integrity on high-speed clock and JTAG traces. Route JTAG signals (TDI, TDO, TMS, TCK) as a 50-ohm impedance-controlled chain with stubs shorter than 5 mm; the chain must be terminated at the EP1C3T10017N with a 10 kohm pull-up on TCK per IEEE 1149.1. Clock inputs CLK0 and CLK1 should be guarded by GND vias on each side to prevent crosstalk from adjacent I/O. Estimated: ground-plane stitching vias every 25 mm across the FPGA footprint improve return-path integrity for the 4 I/O banks.

Do not mix 5 V TTL inputs and 3.3 V LVCMOS outputs on the same I/O bank unless VCCIO is set to 3.3 V - 5 V-tolerant inputs are not supported on Cyclone I banks. Mismatched VCCIO rail voltages between banks cause long-term oxide stress and premature failure. Second, the Quartus II toolchain drops support for Cyclone I starting from Quartus Prime 14.0; pin your toolchain to Quartus II 13.0sp1 or use the open-source yosys + nextpnr community flow. Third, the EP1C3T10017N is NRND per Intel PCN - for new designs use the Cyclone IV EP4CE6 or Cyclone 10 LP 10CL006 instead.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

N suffix indicates lead-free per Altera / Intel ordering information. RoHS and REACH compliance per Altera product declaration. Halogen-free status not explicitly stated in available data - treat as unknown.

데이터 검증일: 2026-09-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP1C3T10017N EP1C3T10017N datasheet Altera Cyclone EP1C3 FPGA TQFP-100 FPGA 2910 LEs Cyclone I TQFP-100 package EP1C3T10017N glue logic EP1C3T10017N vs EP1C6 EP1C3T10017N drop-in replacement EP1C3T10017N buy price how to program EP1C3T10017N EP1C3T10017N pinout TQFP Altera Cyclone FPGA legacy replacement

관련 부품 & 용어

Altera Intel EP1C3T10017N Cyclone FPGA logic element 4-input LUT M4K RAM block TQFP-100 TQFP-144 0.13 micron CMOS SRAM Quartus II JTAG PLL RoHS REACH I/O bank configuration device EPCS FBGA AEC-Q100 industrial temperature commercial temperature logic gate ASIC replacement
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